USD772823S1 - Heat sink module - Google Patents

Heat sink module Download PDF

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Publication number
USD772823S1
USD772823S1 US29/537,536 US201529537536F USD772823S US D772823 S1 USD772823 S1 US D772823S1 US 201529537536 F US201529537536 F US 201529537536F US D772823 S USD772823 S US D772823S
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US
United States
Prior art keywords
heat sink
sink module
module
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/537,536
Inventor
Brett A. Lindeman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
eBullient LLC
Original Assignee
eBullient LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by eBullient LLC filed Critical eBullient LLC
Priority to US29/537,536 priority Critical patent/USD772823S1/en
Assigned to EBULLIENT, LLC reassignment EBULLIENT, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LINDEMAN, BRETT A.
Assigned to EBULLIENT, INC. reassignment EBULLIENT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EBULLIENT, LLC
Application granted granted Critical
Publication of USD772823S1 publication Critical patent/USD772823S1/en
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Description

FIG. 1 is top perspective view of a heat sink module;
FIG. 2 is a bottom perspective view of the heat sink module of FIG. 1;
FIG. 3 is a top view of the heat sink module of FIG. 1;
FIG. 4 is a bottom view of the heat sink module of FIG. 1;
FIG. 5 is a front view of the heat sink module of FIG. 1;
FIG. 6 is a rear view of the heat sink module of FIG. 1;
FIG. 7 is a left side view of the heat sink module of FIG. 1; and,
FIG. 8 is a right side view of the heat sink module of FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink module, as shown and described.
US29/537,536 2015-08-26 2015-08-26 Heat sink module Active USD772823S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/537,536 USD772823S1 (en) 2015-08-26 2015-08-26 Heat sink module

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Application Number Priority Date Filing Date Title
US29/537,536 USD772823S1 (en) 2015-08-26 2015-08-26 Heat sink module

Publications (1)

Publication Number Publication Date
USD772823S1 true USD772823S1 (en) 2016-11-29

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US29/537,536 Active USD772823S1 (en) 2015-08-26 2015-08-26 Heat sink module

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US (1) USD772823S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357900S (en) * 1993-04-01 1995-05-02 Fujitsu Limited Combined heat sink and fan
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
US20060162340A1 (en) * 2005-01-27 2006-07-27 Iter Networking Corporation Chip-based CPU cooler and cooling method thereof
US20070058342A1 (en) * 2005-09-12 2007-03-15 Foxconn Technology Co., Ltd. Heat dissipation device
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
US20140131007A1 (en) * 2012-11-14 2014-05-15 Coolit Systems, Inc. Mounting system for fluid heat exchange systems
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
US9175911B2 (en) * 2011-03-04 2015-11-03 Tsung-Hsien Huang Heat sink assembly
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357900S (en) * 1993-04-01 1995-05-02 Fujitsu Limited Combined heat sink and fan
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
US20060162340A1 (en) * 2005-01-27 2006-07-27 Iter Networking Corporation Chip-based CPU cooler and cooling method thereof
US20070058342A1 (en) * 2005-09-12 2007-03-15 Foxconn Technology Co., Ltd. Heat dissipation device
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US9175911B2 (en) * 2011-03-04 2015-11-03 Tsung-Hsien Huang Heat sink assembly
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
US20140131007A1 (en) * 2012-11-14 2014-05-15 Coolit Systems, Inc. Mounting system for fluid heat exchange systems
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Aliexpress, "New POM Acrylic GPU water cooling block . . . ", Accessed Jun. 27, 2016, Reviewed on Jan. 29, 2016. (http://www.aliexpress.com/item-img/New-GPU-XPH-POM-Acrylic-43-53-mm-kernel-water-cooling-block-Copper-Waterblock-Liquid-Cooler/1757527273.html). *
Aliexpress, Results for "copper water block . . . ", Searched Jun. 27, 2016. (http://www.aliexpress.com/cp/copper-water-block-online-shopping.html). *
Twitter, "Media Tweets by Ebullient (@EbullientInc)", Relevent images as early as Apr. 24, 2015, Accessed May 27, 2016. (https://twitter.com/Ebullient-Inc/media). *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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