USD404720S - Heat sink and mounting plate for integrated circuits - Google Patents

Heat sink and mounting plate for integrated circuits Download PDF

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Publication number
USD404720S
USD404720S US29/066,146 US6614697F USD404720S US D404720 S USD404720 S US D404720S US 6614697 F US6614697 F US 6614697F US D404720 S USD404720 S US D404720S
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US
United States
Prior art keywords
mounting plate
heat sink
integrated circuits
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/066,146
Inventor
Charles Gayle
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Individual
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Individual
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Priority to US29/066,146 priority Critical patent/USD404720S/en
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Publication of USD404720S publication Critical patent/USD404720S/en
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Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the heat sink and mounting plate for integrated circuits showing my new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being identical in appearance;
FIG. 3 is a top plan view thereof, the bottom plan view being identical in appearance; and,
FIG. 4 is a side elevational view thereof, the opposite side view being identical in appearance.

Claims (1)

  1. The ornamental design for a heat sink and mounting plate for integrated circuits, shown and described.
US29/066,146 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits Expired - Lifetime USD404720S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/066,146 USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/066,146 USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

Publications (1)

Publication Number Publication Date
USD404720S true USD404720S (en) 1999-01-26

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Family Applications (1)

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US29/066,146 Expired - Lifetime USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD786806S1 (en) * 2015-09-26 2017-05-16 Ebullient, Inc. Heat sink module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

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