USD786806S1 - Heat sink module - Google Patents
Heat sink module Download PDFInfo
- Publication number
- USD786806S1 USD786806S1 US29/540,704 US201529540704F USD786806S US D786806 S1 USD786806 S1 US D786806S1 US 201529540704 F US201529540704 F US 201529540704F US D786806 S USD786806 S US D786806S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink module
- view
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.
Claims (1)
- The ornamental design for a heat sink module, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/540,704 USD786806S1 (en) | 2015-09-26 | 2015-09-26 | Heat sink module |
US29/540,988 USD772178S1 (en) | 2015-09-26 | 2015-09-29 | Heat sink module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/540,704 USD786806S1 (en) | 2015-09-26 | 2015-09-26 | Heat sink module |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/540,988 Continuation USD772178S1 (en) | 2015-09-26 | 2015-09-29 | Heat sink module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD786806S1 true USD786806S1 (en) | 2017-05-16 |
Family
ID=57287607
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/540,704 Active USD786806S1 (en) | 2015-09-26 | 2015-09-26 | Heat sink module |
US29/540,988 Active USD772178S1 (en) | 2015-09-26 | 2015-09-29 | Heat sink module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/540,988 Active USD772178S1 (en) | 2015-09-26 | 2015-09-29 | Heat sink module |
Country Status (1)
Country | Link |
---|---|
US (2) | USD786806S1 (en) |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD357900S (en) * | 1993-04-01 | 1995-05-02 | Fujitsu Limited | Combined heat sink and fan |
USD404720S (en) * | 1997-02-06 | 1999-01-26 | Charles Gayle | Heat sink and mounting plate for integrated circuits |
US20060162340A1 (en) * | 2005-01-27 | 2006-07-27 | Iter Networking Corporation | Chip-based CPU cooler and cooling method thereof |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
USD553656S1 (en) * | 2007-02-09 | 2007-10-23 | Amulaire Thermal Technology, Inc. | Cold plate heat sink |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20110155353A1 (en) * | 2009-12-30 | 2011-06-30 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
US8631860B2 (en) * | 2009-09-29 | 2014-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Water-cooled heat dissipation system and water tank thereof |
US20140030900A1 (en) * | 2012-07-27 | 2014-01-30 | Kevin B. Leigh | Component cooling |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
US20140131007A1 (en) * | 2012-11-14 | 2014-05-15 | Coolit Systems, Inc. | Mounting system for fluid heat exchange systems |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
US20140311176A1 (en) * | 2013-04-19 | 2014-10-23 | Microthermal Technology Corp. | Phase transfer heat dissipating device and phase transfer heat dissipating system |
US20150124404A1 (en) * | 2013-11-06 | 2015-05-07 | Cisco Technology, Inc. | System and apparatus for network device heat management |
US9175911B2 (en) * | 2011-03-04 | 2015-11-03 | Tsung-Hsien Huang | Heat sink assembly |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
US20160128238A1 (en) * | 2014-10-27 | 2016-05-05 | Ebullient, Llc | Hot-swappable server with cooling line assembly |
-
2015
- 2015-09-26 US US29/540,704 patent/USD786806S1/en active Active
- 2015-09-29 US US29/540,988 patent/USD772178S1/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD357900S (en) * | 1993-04-01 | 1995-05-02 | Fujitsu Limited | Combined heat sink and fan |
USD404720S (en) * | 1997-02-06 | 1999-01-26 | Charles Gayle | Heat sink and mounting plate for integrated circuits |
US20060162340A1 (en) * | 2005-01-27 | 2006-07-27 | Iter Networking Corporation | Chip-based CPU cooler and cooling method thereof |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
USD553656S1 (en) * | 2007-02-09 | 2007-10-23 | Amulaire Thermal Technology, Inc. | Cold plate heat sink |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US8631860B2 (en) * | 2009-09-29 | 2014-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Water-cooled heat dissipation system and water tank thereof |
US20110155353A1 (en) * | 2009-12-30 | 2011-06-30 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
US9175911B2 (en) * | 2011-03-04 | 2015-11-03 | Tsung-Hsien Huang | Heat sink assembly |
US20140030900A1 (en) * | 2012-07-27 | 2014-01-30 | Kevin B. Leigh | Component cooling |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
US20140131007A1 (en) * | 2012-11-14 | 2014-05-15 | Coolit Systems, Inc. | Mounting system for fluid heat exchange systems |
US20140311176A1 (en) * | 2013-04-19 | 2014-10-23 | Microthermal Technology Corp. | Phase transfer heat dissipating device and phase transfer heat dissipating system |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
US20150124404A1 (en) * | 2013-11-06 | 2015-05-07 | Cisco Technology, Inc. | System and apparatus for network device heat management |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
US20160128238A1 (en) * | 2014-10-27 | 2016-05-05 | Ebullient, Llc | Hot-swappable server with cooling line assembly |
Non-Patent Citations (4)
Title |
---|
Aliexpress, "New POM Acrylic GPU water cooling block . . . ", Accessed Jun. 27, 2016, Reviewed on Jan. 29, 2016. (http://www.aliexpress.com/item-img/New-GPU-XPH-POM-Acrylic-43-53-mm-kernel-water-cooling-block-Copper-Waterblock-Liquid-Cooler/1757527273.html). * |
Aliexpress, Results for "copper water block . . . ", Searched Jun. 27, 2016. (http://www.aliexpress.com/cp/copper-water-block-online-shopping.html. * |
Newegg.com, "Intel Series Computer Water Cooling CPU Block . . . ", Accessed May 26, 2016, (http://www.newegg.com/Product/Product.aspx?Item=9SIA3XT2KU0198&cm-re=water-block---9SIA3XT2KU0198---Product). * |
Twitter, "Media Tweets by Ebullient (@EbullientInc)", Relevent images as early as Apr. 24, 2015, Accessed May 27, 2016. (https://twitter.com/Ebullient-Inc/media). * |
Also Published As
Publication number | Publication date |
---|---|
USD772178S1 (en) | 2016-11-22 |
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