US20090044929A1 - Liquid cooling module - Google Patents

Liquid cooling module Download PDF

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Publication number
US20090044929A1
US20090044929A1 US11/889,606 US88960607A US2009044929A1 US 20090044929 A1 US20090044929 A1 US 20090044929A1 US 88960607 A US88960607 A US 88960607A US 2009044929 A1 US2009044929 A1 US 2009044929A1
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United States
Prior art keywords
pump
mounted
liquid cooling
sealed unit
cooling module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/889,606
Inventor
Yun-Yu Yeh
Qineng Xiao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xigmatek Co Ltd
Original Assignee
Xigmatek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xigmatek Co Ltd filed Critical Xigmatek Co Ltd
Priority to US11/889,606 priority Critical patent/US20090044929A1/en
Assigned to XIGMATEK CO., LTD. reassignment XIGMATEK CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XIAO, QINENG, YEH, YUN-YU
Publication of US20090044929A1 publication Critical patent/US20090044929A1/en
Application status is Abandoned legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05366Assemblies of conduits connected to common headers, e.g. core type radiators
    • F28D1/05391Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits combined with a particular flow pattern, e.g. multi-row multi-stage radiators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031Radiators for recooling a coolant of cooling systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A liquid cooling module has a sealed unit and a heat dissipating module connected by multiple flexible pipes. The sealed unit has a contacting surface attached to an electronic element. The heat dissipating module has a radiator, coolant tanks and a pump all mounted compactly together. The radiator has multiple fins and tubes to allow the coolant to flow through and dissipate heat and may have a fan to increase airflow. The coolant tank is formed on the radiator. The pump circulates the coolant along the coolant pipes. Accordingly, the liquid cooling module has a compact structure and the coolant pipes are flexible, so the liquid cooling module can be mounted simply in a computer case, and is installed easily by home users and professionals alike.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a cooling system, and more particularly to a liquid cooling module that can cool a processor of a computer efficiently, is compact and easily fitted to a computer case.
  • 2. Description of Related Art
  • As computer hardware is developing rapidly to provide faster performance, processor overheating is becoming a significant problem.
  • The most common solution for cooling a computer processor is to use a heat dissipater utilizing air, such as a fan, a heat sink assembly or a combination therein to take away heat generated by the computer processor. However, as computer hardware becomes faster and smaller, more heat is generated by the processor. Therefore, conventional heat dissipaters using air are being replaced by heat dissipaters using a coolant and may comprise a sealed unit, a coolant, multiple rigid pipes, a pump, a radiator and a tank. The sealed unit is mounted adjacent to the processor and is sealed against coolant leakage. The coolant is a non-flammable coolant. The pipes are rigid, full of the coolant and connect the compressor to the sealed unit that the coolant passes over to remove heat. Then the coolant passes through the pipes to the coolant tank and onto the radiator where excess heat is removed from the coolant. The coolant in the radiator then flows to the compressor to complete another cooling cycle.
  • However, the radiator, coolant tank and compressor are separately mounted in a computer case and connected to each other using the rigid pipes. In such an arrangement, the structure may be complicated to install and occupies much space. Installation is further complicated since the rigid pipes must be tailored to correct lengths during installation, especially since any coolant leaks may damage the computer or surrounding area. The complicated installation is therefore, performed by professionals and prevents many home users from upgrading to this technology.
  • To overcome the shortcomings, the present invention provides a liquid cooling module to obviate or mitigate the aforementioned problems.
  • SUMMARY OF THE INVENTION
  • The main objective of the present invention is to provide a liquid cooling module having excellent cooling capability and is compact and easily adjustable to fit a variety of computer cases.
  • To achieve the objective, the liquid cooling module in accordance with the present invention comprises a sealed unit, a heat dissipating module, and multiple flexible pipes connected between the sealed unit and the heat dissipating module to allow coolant to flow inside.
  • The sealed unit has a contacting surface attached to an electronic component of a computer to absorb heat.
  • The heat dissipating module has a radiator, coolant tanks and a pump all mounted compactly together. The radiator has multiple fins and tubes to allow the coolant to flow through and dissipate heat and may comprise a fan to increase airflow. The coolant tank is formed on the radiator. The pump circulates the coolant along the coolant pipes. Accordingly, the liquid cooling module has a compact structure, because the coolant pipes are flexible, the liquid cooling module is mounted simply in a computer case, and is installed easily by home users or professionals alike.
  • Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a liquid cooling module in accordance with the present invention;
  • FIG. 2 is an exploded perspective view of the liquid cooling module in FIG. 1;
  • FIG. 3 is a cross sectional rear view of the liquid cooling module in FIG. 1; and
  • FIG. 4 is a cross sectional top view of the liquid cooling module in FIG. 1; and
  • FIG. 5 is a perspective view of the liquid cooling module in FIG. 1, shown mounted in a computer casing.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • With reference to FIG. 5, an electronic element (61) may be a processor mounted in a computer casing (60) and has an upper surface.
  • With further reference to FIGS. 1 to 4, a liquid cooling module in accordance with present invention comprises a sealed unit (30), a heat dissipating module, an outlet pipe (50) and an inlet pipe (51).
  • The sealed unit (30) has multiple fasteners (31), a chamber, a contacting surface (330), a lid, an outlet seat (32), an inlet seat (35), a mounting board (33) and multiple inner fins (34).
  • The fasteners (31) are mounted through the sealed unit (30) to hold the sealed unit (30) in contact with the electronic element (61) and each may be implemented with a spring. The chamber is formed inside the sealed unit (30). The outlet seat (32) and the inlet seat (35) are formed separately through the lid of the sealed unit (30) and communicate with the chamber. The mounting board (33) is mounted sealably on the lid, and may be metal. The contacting surface (330) is formed on the sealed unit (30), may be on the mounting board and is in contact with the upper surface of the electronic element (61) to absorb heat. The inner fins (34) are formed on the mounting board (33) in the chamber of the sealed unit (30)
  • The heat dissipating module is connected to the sealed unit (30) and comprises a radiator (10), a fan (20), an upper tank (13), a lower tank (40) and a pump (46).
  • The radiator (10) is mounted on the lower tank (40) and has a front, a rear, a top, a bottom, a bottom cover (45), multiple tubes (12) and multiple fins (11). The bottom cover (45) is mounted sealably on the bottom of the radiator. The tubes (12) may be metal, are formed parallelly to each other from the top to the bottom of the radiator, may be between the upper and lower tanks (13, 40) and through the bottom cover and each tube (12) has a flow channel (120) and two sides. Each flow channel (120) is formed longitudinally through each tube (12) to allow coolant to flow inside. The fins (11) are mounted perpendicularly to and adjacent to both sides of each tube (12) and increase heat dissipating efficiency of each tube (12).
  • The fan (20) is securely mounted adjacent to the front of the radiator (10) to increase airflow through the fins (11) of the radiator (10) to increase heat dissipation.
  • The upper tank (13) is mounted securely on the top of the radiator (10) and has a top and a barrier (14) and may further have a coolant input (18) and a cap (17). The barrier (14) is mounted securely in the upper tank (13), to separate the tubes (12) into two equal groups of warm tubes (12) and cold tubes (12) and defining a warm chamber (15) and a cold chamber (16) that communicate respectively with corresponding flow channels (120) of the warm and cold tubes (12). The coolant input (18) is formed through the top of the upper tank (13) for adding coolant and may be threaded. The cap (17) is securely mounted detachably on the coolant input (18) of the upper tank (13) and may be threaded and correspond to the threaded coolant input (18).
  • The lower tank (40) is mounted securely on the bottom of the radiator (10) and sealably to the bottom cover (45) and has a side wall (41), an inlet (411), an outlet (410) and a partition (42). The inlet (411) and the outlet (410) are separately formed through the side wall (41). The partition (42) is mounted securely in the lower tank (40) to define a cool chamber (43) and a hot chamber (44).
  • The cool chamber (43) communicates with half of the flow channels (120) of the warm and cold tubes (12)
  • The hot chamber (44) communicates with half of the flow channels (120) of the warm tubes (12) and with the inlet (411).
  • The pump (46) may be an impeller, a compressor or the like, is mounted on the radiator (10), is mounted in the cool chamber (43) of the lower tank (40) and has a pump case (47) and a pump assembly. The pump case (47) has a top surface, a pump chamber, a pump exhaust (470), a pump inlet (472) and a pump partition (471).
  • The pump partition (471) is mounted sealably in the cool chamber (43), between the bottom cover (45) of the radiator (12) and the pump case (47). The pump chamber is defined between the pump case (47), pump partition (471) and bottom cover (45) of the radiator (12) and communicates with half of the cold tubes (12). The pump inlet (472) is formed through the top surface of the pump case (47) and communicates with the pump chamber. The pump exhaust (470) is formed on and protrudes from the pump case (47), communicates with the pump chamber via the pump inlet (472) and is mounted sealably in the outlet (410) of the lower tank (40)
  • The pump assembly is mounted sealably on the pump case (47) and has an impeller (48) and a driver (49). The impeller (48) is mounted rotatably in the pump case (47) and has multiple spiral vans (480). The driver (49) drives the impeller (48) to rotate and thereby pumps the coolant from the pump chamber through the pump exhaust (470) to the outlet (410) of the lower tank (40).
  • The outlet pipe (50) is flexible and is connected between the sealed unit (30) and the heat dissipating module, may has two ends be respectively connected to the outlet seat (32) of the sealed unit (30) and pass through the outlet (410) of the lower tank (40) to connect to the pump exhaust (470).
  • The inlet pipe (51) is flexible and is connected between the sealed unit (30) and the heat dissipating module, may be between the inlet seat (35) of the sealed unit (30), and the inlet (411) of the lower tank (40).
  • With reference to FIGS. 3 and 4, coolant such as water, distilled water, a dielectric solvent or the like well known in the art is added, may be through the coolant input (18) to fill the tubes and pipes. The pump (46) forces the coolant out of the pump exhaust (470) of the pump (46), passes through the outlet pipe (50) and enters the sealed unit (30). The coolant passes through the chamber of the sealed unit (30) and absorbs heat from the mounting board (33), then passes through the inlet pipe (51) and enters the hot chamber (44) of the lower tank (40).
  • With further reference to FIG. 3, the coolant inside the hot chamber (44) of the lower tank (40) flows up the flow channels (120) of one half of the warm tubes (12) and is cooled by air flow enhanced by the fan (20) and enters the warm chamber (15), before flowing down the other half of the warm tubes (12) and is further cooled until reaching the cool chamber (43). Then the coolant flows through one half of the warm tubes (12), is again cooled until entering the cold chamber (16). The coolant flows through the other half of the cold tubes (12), is further cooled and enters the pump chamber, where the coolant is forced out of the pump chamber. Therefore, the coolant is thoroughly cooled before being used to cool again, this greatly enhances efficiency of heat dissipating.
  • With further reference to FIG. 5, because the pipes (50, 51) are flexible, the sealed unit (30) of the liquid cooling module can be easily and conveniently mounted onto the electronic element (61) of the casing (60). Since, the pump (47), radiator (12), fan (20) and coolant upper and lower tanks (13, 40) are all formed together this unit is both compact and easily installed. Therefore, the liquid cooling module in accordance with the present invention is compact and convenient to use.
  • Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail especially in matters of shape, size and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (12)

1. A liquid cooling module comprising
a sealed unit having
a chamber being formed inside the sealed unit; and
a contacting surface being formed on the sealed unit to absorb heat;
a heat dissipating module comprising
a radiator having multiple tubes and fins being mounted perpendicularly to and adjacent to both sides of each tube;
a pump communicating with the radiator;
an outlet pipe being flexible and connected between the sealed unit and the heat dissipating module; and
an inlet pipe being flexible and connected between the sealed unit and the heat dissipating module.
2. The liquid cooling module as claimed in claim 1, wherein the radiator of the heat dissipating module has
a front;
a rear;
a top;
a bottom; and
the tubes being formed parallelly to each other from the top to the bottom of the radiator, and each tube having a flow channel formed longitudinally through the tube.
3. The liquid cooling module as claimed in claim 2, wherein the heat dissipating module further has
a bottom cover mounted sealably on the bottom of the radiator;
an upper tank being mounted securely on the top of the radiator and having
a top; and
a barrier being mounted securely in the upper tank to separate the tubes into two equal groups of warm tubes and cold tubes and defining a warm chamber and a cold chamber that communicate respectively with corresponding flow channels of the warm and cold tubes;
a lower tank being mounted on the bottom of the radiator and sealably on the bottom cover and having
a side wall;
an inlet being formed through the side wall;
an outlet being formed through the side wall;
a partition being mounted securely in the lower tank and defining
a cool chamber communicating with half of the flow channels of the warm and cold tubes; and
a hot chamber communicating with the other half of the flow channels of the warm tubes and the inlet;
wherein the tubes are further formed between the upper and lower tanks and through the bottom cover; and
the pump is mounted in the cool chamber and further has
a pump case having
a top surface;
a pump partition being mounted sealably in the cool chamber between the bottom cover and the pump case;
a pump chamber being defined between the pump case, pump partition and bottom cover and communicating with half of the cold tubes;
a pump inlet being formed through the top surface of the pump case and communicating with the pump chamber;
a pump exhaust being formed on and protruding from the pump case, communicating with the pump chamber via the pump inlet and being mounted sealably in the outlet of the lower tank; and
wherein the inlet pipe is further connected to the inlet of the lower tank; and
the outlet pipe is further connected to the outlet of the lower tank.
4. The liquid cooling module as claimed in claim 3, wherein the pump is an impeller pump having a pump assembly mounted in the pump case.
5. The liquid cooling module as claimed in claim 4, wherein the heat dissipating module further comprising a fan being securely mounted adjacent to the front of the radiator to increase airflow flowing through the fins of the radiator to increase heat dissipation.
6. The liquid cooling module as claimed in claim 5, wherein the sealed unit further has
a lid;
a mounting board being mounted sealably on the lid;
and multiple inner fins being formed on the mounting board in the chamber of the sealed unit;
wherein the contacting surface is formed on the mounting board.
7. The liquid cooling module as claimed in claim 6, wherein
the sealed unit further has an outlet seat and an inlet seat being formed separately through the lid of the sealed unit and communicating with the chamber;
wherein the outlet pipe is further connected to the outlet seat of the sealed unit; and
the inlet pipe is further connected to the inlet seat of the sealed unit.
8. The liquid cooling module as claimed in claim 7, wherein
the upper tank further has
a coolant input being formed through the top of the upper tank for adding coolant; and
a cap being securely mounted detachably on the coolant input of the upper tank.
9. The liquid cooling module as claimed in claim 8, wherein
the coolant input of the upper tank is threaded; and
the cap is threaded to correspond to the coolant input.
10. The liquid cooling module as claimed in claim 7, wherein the pump assembly further has
an impeller being mounted rotatable in the pump case and having multiple spiral vans; and
a driver driving the impeller to rotate.
11. The liquid cooling module as claimed in claim 10, wherein the mounting board of the sealed unit is metal.
12. The liquid cooling module as claimed in claim 10, wherein the sealed unit further has multiple fasteners being mounted through the sealed unit.
US11/889,606 2007-08-15 2007-08-15 Liquid cooling module Abandoned US20090044929A1 (en)

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KR101087774B1 (en) * 2009-09-16 2011-11-30 한국생산기술연구원 Thermosyphon type heat sink
WO2011150920A3 (en) * 2010-06-02 2012-05-10 Tfc Cooling Products E.K. Heat exchanger
US20130299139A1 (en) * 2009-12-15 2013-11-14 Stephen Mounioloux Radiator with integrated pump for actively cooling electronic devices
US20140076523A1 (en) * 2012-09-19 2014-03-20 Aaron Ray Batker Pritzker Devices, systems, and methods for cooling electronic device heat spreaders
CN104914961A (en) * 2015-06-24 2015-09-16 东莞运宏模具有限公司 Computer case radiating mechanism
CN105202943A (en) * 2015-10-21 2015-12-30 无锡惠山泵业有限公司 Novel efficient radiator
US20160088768A1 (en) * 2014-09-24 2016-03-24 Delta Electronics, Inc. Rotatable-type liquid-cooled heat sink and disposition method for the same
CN105451510A (en) * 2014-09-24 2016-03-30 台达电子工业股份有限公司 Liquid-cooling heat radiation device capable of being overturned for use, and overturning configuration method thereof
CN105827066A (en) * 2016-05-27 2016-08-03 罗振洪 Hybrid air and oil cooling system for temperature control motor and controller
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
CN106711110A (en) * 2017-03-19 2017-05-24 北京工业大学 Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator)
US20170191709A1 (en) * 2015-12-30 2017-07-06 Msi Computer (Shenzhen) Co.,Ltd. Heat dissipation device and thermoelectric cooling module thereof
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
US20170257979A1 (en) * 2016-03-01 2017-09-07 Auras Technology Co., Ltd. Water cooling device
US9795058B2 (en) * 2015-06-11 2017-10-17 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation device thereof
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US20170367217A1 (en) * 2015-11-12 2017-12-21 Apaltek Co., Ltd. Liquid Cooling Radiation System and Liquid Radiator Thereof
US9867315B2 (en) 2012-06-29 2018-01-09 Asetek Danmark A/S Server memory cooling apparatus
US20180042140A1 (en) * 2015-03-31 2018-02-08 Guangdong Shenling Air-conditioning Equipment Co., Ltd. Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device
CN108112225A (en) * 2018-01-30 2018-06-01 重庆市长寿区臻波通讯设备有限公司 Low power consuming communication terminal
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
CN108289402A (en) * 2018-01-30 2018-07-17 重庆市长寿区臻波通讯设备有限公司 The radiator structure of communication terminal
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US20190082559A1 (en) * 2017-09-08 2019-03-14 Auras Technology Co., Ltd. Liquid cooling system with multiple heat dissipation devices
EP3575920A1 (en) 2018-05-29 2019-12-04 Dcx Sp. Z O.O. A cpu cooling module for use as a direct liquid cpu cooling
WO2019232813A1 (en) * 2018-06-03 2019-12-12 东莞昂湃实业有限公司 Integrated liquid cooling system

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