USD772822S1 - Redundant heat sink module - Google Patents
Redundant heat sink module Download PDFInfo
- Publication number
- USD772822S1 USD772822S1 US29/529,869 US201529529869F USD772822S US D772822 S1 USD772822 S1 US D772822S1 US 201529529869 F US201529529869 F US 201529529869F US D772822 S USD772822 S US D772822S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink module
- redundant heat
- redundant
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.
Claims (1)
- The ornamental design for a redundant heat sink module, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/529,869 USD772822S1 (en) | 2015-06-11 | 2015-06-11 | Redundant heat sink module |
US29/531,759 USD773408S1 (en) | 2015-06-11 | 2015-06-29 | Redundant heat sink module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/529,869 USD772822S1 (en) | 2015-06-11 | 2015-06-11 | Redundant heat sink module |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/531,759 Continuation USD773408S1 (en) | 2015-06-11 | 2015-06-29 | Redundant heat sink module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD772822S1 true USD772822S1 (en) | 2016-11-29 |
Family
ID=57351308
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/529,869 Active USD772822S1 (en) | 2015-06-11 | 2015-06-11 | Redundant heat sink module |
US29/531,759 Active USD773408S1 (en) | 2015-06-11 | 2015-06-29 | Redundant heat sink module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/531,759 Active USD773408S1 (en) | 2015-06-11 | 2015-06-29 | Redundant heat sink module |
Country Status (1)
Country | Link |
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US (2) | USD772822S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170105313A1 (en) * | 2015-10-10 | 2017-04-13 | Ebullient, Llc | Multi-chamber heat sink module |
USD924952S1 (en) * | 2020-01-07 | 2021-07-13 | Worthington Cylinders Corporation | Electronic module for a tank lid |
USD929477S1 (en) * | 2020-01-07 | 2021-08-31 | Worthington Cylinders Corporation | Electronic module for a tank lid |
US11906218B2 (en) | 2014-10-27 | 2024-02-20 | Ebullient, Inc. | Redundant heat sink module |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD803169S1 (en) * | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD795821S1 (en) * | 2016-02-22 | 2017-08-29 | Heatscape.Com, Inc. | Liquid cooling cold plate with diamond cut pin fins |
USD873396S1 (en) * | 2016-04-06 | 2020-01-21 | Showa Denko K.K. | Cooler |
USD800674S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
USD800675S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD404720S (en) * | 1997-02-06 | 1999-01-26 | Charles Gayle | Heat sink and mounting plate for integrated circuits |
US20060162340A1 (en) * | 2005-01-27 | 2006-07-27 | Iter Networking Corporation | Chip-based CPU cooler and cooling method thereof |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20110155353A1 (en) * | 2009-12-30 | 2011-06-30 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
US8631860B2 (en) * | 2009-09-29 | 2014-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Water-cooled heat dissipation system and water tank thereof |
US20140030900A1 (en) * | 2012-07-27 | 2014-01-30 | Kevin B. Leigh | Component cooling |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
US20140311176A1 (en) * | 2013-04-19 | 2014-10-23 | Microthermal Technology Corp. | Phase transfer heat dissipating device and phase transfer heat dissipating system |
US20150124404A1 (en) * | 2013-11-06 | 2015-05-07 | Cisco Technology, Inc. | System and apparatus for network device heat management |
US9175911B2 (en) * | 2011-03-04 | 2015-11-03 | Tsung-Hsien Huang | Heat sink assembly |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
US20160128238A1 (en) * | 2014-10-27 | 2016-05-05 | Ebullient, Llc | Hot-swappable server with cooling line assembly |
-
2015
- 2015-06-11 US US29/529,869 patent/USD772822S1/en active Active
- 2015-06-29 US US29/531,759 patent/USD773408S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD404720S (en) * | 1997-02-06 | 1999-01-26 | Charles Gayle | Heat sink and mounting plate for integrated circuits |
US20060162340A1 (en) * | 2005-01-27 | 2006-07-27 | Iter Networking Corporation | Chip-based CPU cooler and cooling method thereof |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US8631860B2 (en) * | 2009-09-29 | 2014-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Water-cooled heat dissipation system and water tank thereof |
US20110155353A1 (en) * | 2009-12-30 | 2011-06-30 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
US9175911B2 (en) * | 2011-03-04 | 2015-11-03 | Tsung-Hsien Huang | Heat sink assembly |
US20140030900A1 (en) * | 2012-07-27 | 2014-01-30 | Kevin B. Leigh | Component cooling |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
US20140311176A1 (en) * | 2013-04-19 | 2014-10-23 | Microthermal Technology Corp. | Phase transfer heat dissipating device and phase transfer heat dissipating system |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
US20150124404A1 (en) * | 2013-11-06 | 2015-05-07 | Cisco Technology, Inc. | System and apparatus for network device heat management |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
US20160128238A1 (en) * | 2014-10-27 | 2016-05-05 | Ebullient, Llc | Hot-swappable server with cooling line assembly |
Non-Patent Citations (3)
Title |
---|
Aliexpress Shop, "New POM Acrylic GPU water cooling block Copper Waterblock Liquid Cooler for hole Pitch 43-53mm Graphics Card", Accessed Jun. 27, 2016, Reviewed on Jan. 29, 2016. (http://www.aliexpress.com/item/New-GPU-XPH-POM-Acrylic-43-53-mm-kernel-water-cooling-block-Copper-Waterblock-Liquid-Cooler/1757527273.html). * |
Amazon, "Nhowe SC-VG46 VGA GPU Water Cooling Block for Support N Card Public version GTX460 560Ti ", Accessed May 27, 2016, First sold on Amazon Nov. 7, 2015. (https://www.amazon.com/Nhowe-SC-VG46-Cooling-Support-version/dp/B017P09W9C?ie=UTF8&keywords=Aluminum%20Water%20Block&qid=1464369241&ref-=sr-1-87&s=pc&sr=1-87). * |
Linustechtips forum, "EK Introduces Annihilator Series 1U CPU Water Block for server and workstation type motherboards", Accessed May 27, 2016, Posted May 15, 2015. (https://linustechtips.com/main/topic/367045-ek-introduces-annihilator-series-1u-cpu-water-block-for-server-and-workstation-type-motherboards/). * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11906218B2 (en) | 2014-10-27 | 2024-02-20 | Ebullient, Inc. | Redundant heat sink module |
US20170105313A1 (en) * | 2015-10-10 | 2017-04-13 | Ebullient, Llc | Multi-chamber heat sink module |
USD924952S1 (en) * | 2020-01-07 | 2021-07-13 | Worthington Cylinders Corporation | Electronic module for a tank lid |
USD929477S1 (en) * | 2020-01-07 | 2021-08-31 | Worthington Cylinders Corporation | Electronic module for a tank lid |
Also Published As
Publication number | Publication date |
---|---|
USD773408S1 (en) | 2016-12-06 |
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