USD772822S1 - Redundant heat sink module - Google Patents

Redundant heat sink module Download PDF

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Publication number
USD772822S1
USD772822S1 US29/529,869 US201529529869F USD772822S US D772822 S1 USD772822 S1 US D772822S1 US 201529529869 F US201529529869 F US 201529529869F US D772822 S USD772822 S US D772822S
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United States
Prior art keywords
heat sink
sink module
redundant heat
redundant
view
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US29/529,869
Inventor
Brett A. Lindeman
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eBullient LLC
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eBullient LLC
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Publication date
Application filed by eBullient LLC filed Critical eBullient LLC
Priority to US29/529,869 priority Critical patent/USD772822S1/en
Priority to US29/531,759 priority patent/USD773408S1/en
Assigned to EBULLIENT, LLC reassignment EBULLIENT, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LINDEMAN, BRETT A.
Assigned to EBULLIENT, INC. reassignment EBULLIENT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EBULLIENT, LLC
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Publication of USD772822S1 publication Critical patent/USD772822S1/en
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Description

FIG. 1 is top front perspective view of a redundant heat sink module;
FIG. 2 is a bottom front perspective view of the redundant heat sink module of FIG. 1;
FIG. 3 is top rear perspective view of the redundant heat sink module of FIG. 1;
FIG. 4 is a bottom rear perspective view of the redundant heat sink module of FIG. 1;
FIG. 5 is a top view of the redundant heat sink module of FIG. 1;
FIG. 6 is a bottom view of the redundant heat sink module of FIG. 1;
FIG. 7 is a front view of the redundant heat sink module of FIG. 1;
FIG. 8 is a rear view of the redundant heat sink module of FIG. 1;
FIG. 9 is a left side view of the redundant heat sink module of FIG. 1; and,
FIG. 10 is a right side view of the redundant heat sink module of FIG. 1.
The broken lines shown in the drawings illustrate portions of the heat sink module and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a redundant heat sink module, as shown and described.
US29/529,869 2015-06-11 2015-06-11 Redundant heat sink module Active USD772822S1 (en)

Priority Applications (2)

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US29/529,869 USD772822S1 (en) 2015-06-11 2015-06-11 Redundant heat sink module
US29/531,759 USD773408S1 (en) 2015-06-11 2015-06-29 Redundant heat sink module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/529,869 USD772822S1 (en) 2015-06-11 2015-06-11 Redundant heat sink module

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US29/531,759 Continuation USD773408S1 (en) 2015-06-11 2015-06-29 Redundant heat sink module

Publications (1)

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USD772822S1 true USD772822S1 (en) 2016-11-29

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US29/529,869 Active USD772822S1 (en) 2015-06-11 2015-06-11 Redundant heat sink module
US29/531,759 Active USD773408S1 (en) 2015-06-11 2015-06-29 Redundant heat sink module

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US29/531,759 Active USD773408S1 (en) 2015-06-11 2015-06-29 Redundant heat sink module

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170105313A1 (en) * 2015-10-10 2017-04-13 Ebullient, Llc Multi-chamber heat sink module
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
US11906218B2 (en) 2014-10-27 2024-02-20 Ebullient, Inc. Redundant heat sink module

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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US20060162340A1 (en) * 2005-01-27 2006-07-27 Iter Networking Corporation Chip-based CPU cooler and cooling method thereof
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
US20150124404A1 (en) * 2013-11-06 2015-05-07 Cisco Technology, Inc. System and apparatus for network device heat management
US9175911B2 (en) * 2011-03-04 2015-11-03 Tsung-Hsien Huang Heat sink assembly
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
US20060162340A1 (en) * 2005-01-27 2006-07-27 Iter Networking Corporation Chip-based CPU cooler and cooling method thereof
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
US20110155353A1 (en) * 2009-12-30 2011-06-30 Man Zai Industrial Co., Ltd. Liquid cooling device
US9175911B2 (en) * 2011-03-04 2015-11-03 Tsung-Hsien Huang Heat sink assembly
US20140030900A1 (en) * 2012-07-27 2014-01-30 Kevin B. Leigh Component cooling
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
US20140311176A1 (en) * 2013-04-19 2014-10-23 Microthermal Technology Corp. Phase transfer heat dissipating device and phase transfer heat dissipating system
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20150124404A1 (en) * 2013-11-06 2015-05-07 Cisco Technology, Inc. System and apparatus for network device heat management
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly

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* Cited by examiner, † Cited by third party
Title
Aliexpress Shop, "New POM Acrylic GPU water cooling block Copper Waterblock Liquid Cooler for hole Pitch 43-53mm Graphics Card", Accessed Jun. 27, 2016, Reviewed on Jan. 29, 2016. (http://www.aliexpress.com/item/New-GPU-XPH-POM-Acrylic-43-53-mm-kernel-water-cooling-block-Copper-Waterblock-Liquid-Cooler/1757527273.html). *
Amazon, "Nhowe SC-VG46 VGA GPU Water Cooling Block for Support N Card Public version GTX460 560Ti ", Accessed May 27, 2016, First sold on Amazon Nov. 7, 2015. (https://www.amazon.com/Nhowe-SC-VG46-Cooling-Support-version/dp/B017P09W9C?ie=UTF8&keywords=Aluminum%20Water%20Block&qid=1464369241&ref-=sr-1-87&s=pc&sr=1-87). *
Linustechtips forum, "EK Introduces Annihilator Series 1U CPU Water Block for server and workstation type motherboards", Accessed May 27, 2016, Posted May 15, 2015. (https://linustechtips.com/main/topic/367045-ek-introduces-annihilator-series-1u-cpu-water-block-for-server-and-workstation-type-motherboards/). *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11906218B2 (en) 2014-10-27 2024-02-20 Ebullient, Inc. Redundant heat sink module
US20170105313A1 (en) * 2015-10-10 2017-04-13 Ebullient, Llc Multi-chamber heat sink module
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid

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