US20060162340A1 - Chip-based CPU cooler and cooling method thereof - Google Patents
Chip-based CPU cooler and cooling method thereof Download PDFInfo
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- US20060162340A1 US20060162340A1 US11/082,693 US8269305A US2006162340A1 US 20060162340 A1 US20060162340 A1 US 20060162340A1 US 8269305 A US8269305 A US 8269305A US 2006162340 A1 US2006162340 A1 US 2006162340A1
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- fan
- thermal electric
- electric cooler
- cpu
- cooling device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to CPU (central processing unit) cooling devices and more particularly to a chip-based CPU cooling device having a thermal electric cooler and a cooling method thereof.
- a CPU cooler is implemented as a passive one.
- a member formed of high heat conduction metal or alloy is mounted on the CPU.
- the member comprises a plurality of parallel fins.
- heat generated by CPU is transferred to the fins by contact prior to dissipating to the ambient.
- the number of fins, locations of the fins, angles of the fins with respect to CPU, convection, material of the cooler i.e., heat conductivity of material
- the desired good heat dissipation of CPU is compromised as interference among heat conduction, convection, and radiation.
- Another conventional CPU cooler is implemented as a thermal electric cooler which is in direct contact with CPU.
- a heat absorbing surface and a heat dissipating surface are formed on both sides of a semiconductor chip in response to electric current flowing through the thermal electric cooler.
- the heat absorbing surface contacts the hot CPU and the heat dissipating surface is in fluid communication with a heat sink or cooling fan so as to carry out cooling of the CPU.
- Such technique is disclosed in Taiwanese Patent No. 88,203,663.
- heat may undesirably transfer back to the heat absorbing surface if cooling members arranged at the heat dissipating surface operate abnormally.
- dew may generate on the cooler due to abrupt temperature drop.
- the need for improvement of thermal electric cooler for CPU still exists.
- It is another object of the present invention to provide a chip-based CPU cooling device comprising a hollow seat and a housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fins by eliminating external air interference.
- It is yet another object of the present invention to provide a chip-based CPU cooling device comprising a thermal electric cooler, a first fan mounted on a first outlet, and a second fan mounted on a second outlet such that an optimum heat dissipation can be obtained by running a control program to optionally control on/off of the fans and power of the activated thermal electric cooler depending on actual demand.
- a chip-based cooling device mountable on a CPU arranged on a motherboard comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the thermal electric cooler is shaped to fit in the seat, the heat dissipation member is enclosed by the housing and is mounted on the seat, the first fan is mounted on top of the housing, the second fan is mounted on one side of the housing, the thermal electric cooler is adapted to contact the cover, and the heat dissipation member is adapted to contact the thermal electric cooler, and wherein the seat and housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fin by eliminating external air interference.
- a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device
- a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range each of the thermal electric cooler, the first fan, and the second fan is off; in a second range each of the thermal electric cooler, the first fan, and the second fan is in a standby condition; in a third range the thermal electric
- a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device
- a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a
- FIG. 1 is an exploded perspective view of a preferred embodiment of cooling device according to the invention to be mounted on a CPU;
- FIG. 2 is a perspective view of one portion of the assembled cooling device shown in FIG. 1 ;
- FIG. 3 is a perspective view of the remaining portion of the assembled cooling device shown in FIG. 1 ;
- FIG. 4 is a perspective view of the completely assembled cooling device on the CPU shown in FIG. 1 ;
- FIG. 5 is a state diagram illustrating a plurality of temperature cases according to a cooling method of the invention.
- the cooling device comprises a cover 11 formed of metal of high heat conductivity, a seat 12 , a thermal electric cooler 13 , a frame 14 , a plurality of fins 21 of high heat conductivity as a heat sink, a housing 22 , a first fan 23 , and a second fan 24 .
- a cover 11 formed of metal of high heat conductivity
- a seat 12 a thermal electric cooler 13
- a frame 14 a plurality of fins 21 of high heat conductivity as a heat sink
- a housing 22 a housing 22
- a first fan 23 a first fan 23
- a second fan 24 a second fan 24 .
- a CPU 3 is completely covered by the cover 11 thereon.
- the cover 11 also completely contacts the CPU 3 and the thermal electric cooler 13 .
- the cover 11 is served to direct out heat produced from CPU 3 .
- the square hollow seat 12 comprises an outer U-shaped wall 121 , an inner U-shaped wall 122 , a U-shaped groove 123 defined by the walls 121 and 122 for directing air communication with the cover 11 (i.e., no external air interference), and a central opening 124 which is a hollow-through opening.
- a chip powered by flowing electric current therethrough is provided in the thermal electric cooler 13 and the chip comprises a lower heat absorbing surface 131 and an upper heat dissipating surface 132 .
- a lower portion of the thermal electric cooler 13 is shaped to neatly fit in the opening 124 to contact the cover 11 .
- the square frame 14 comprises a central opening 141 with an upper portion of the thermal electric cooler 13 neatly fitted therein and slightly, upwardly projected from the seat 12 (as shown in FIG. 3 ) to contact the base of the fins 21 .
- the housing 22 is secured to the seat 12 (as shown in FIG. 4 ), which is in turn secured to a motherboard with the CPU 3 mounted thereon in a manner known in the art.
- the housing 22 as shown in FIG.
- the cooling device for CPU on the motherboard, as shown in FIG. 4 .
- the fins 21 may be replaced by any of other good heat dissipation members (e.g., heat pipe) in other embodiments.
- heat generated by the running CPU 3 is transferred to the heat dissipating surface 132 through the cover 11 and the heat absorbing surface 131 by conduction in which electricity is produced by heating the junction between the heat absorbing surface 131 and the heat dissipating surface 132 so as to produce an electromotive force. Further, heat is transferred to the fins 21 from the heat dissipating surface 132 by conduction due to the electromotive force.
- the first fan 23 is powered to dissipate heat from the fins 21 to the ambient via the passageway 224 and the second fan 24 is powered to draw external cold air onto the fins 21 in the passageway 227 .
- Such can greatly enhance the heat dissipation capability of the cooling device, resulting in a quick, sufficient cooling of the CPU 3 .
- FIG. 5 it shows a state diagram illustrating a plurality of cases (six cases are shown) according to a cooling method of the cooling device of the invention.
- the cases are defined based on the operating temperature of CPU 3 .
- a first case 41 corresponds to the operating temperature of CPU 3 smaller than 15° C. (i.e., temp ⁇ 15° C.)
- a second case 42 corresponds to the operating temperature of CPU 3 larger or equal to 15° C. and smaller than 25° C. (i.e., 15° C. ⁇ temp ⁇ 25° C.)
- a third case 43 corresponds to the operating temperature of CPU 3 larger or equal to 25° C. and smaller than 36° C.
- a fourth case 44 corresponds to the operating temperature of CPU 3 larger or equal to 36° C. and smaller than 41° C. (i.e., 36° C. ⁇ temp ⁇ 41° C.)
- a fifth case 45 corresponds to the operating temperature of CPU 3 larger or equal to 41° C. and smaller or equal to 69.9° C. (i.e., 41° C. ⁇ temp ⁇ 69.9° C.)
- a sixth case 46 corresponds to the operating temperature of CPU 3 larger than 70° C. (i.e., 70° C. ⁇ temp) respectively.
- Predetermined operations of certain components e.g., on or off of the first fan 23 and/or the second fan 24 , and off, low power operation, or full (or high) power operation of the thermal electric cooler 13 of the cooling device will be activated immediately when the operating temperature of CPU 3 reaches the temperature range of one of the cases.
- an optimum heat dissipation effect can be carried out as detailed below.
- the thermal electric cooler 13 , the first fan 23 , and the second fan 24 are all off.
- the thermal electric cooler 13 , the first fan 23 , and the second fan 24 are in standby condition.
- the thermal electric cooler 13 operates in low power (or in half power as in other preferred embodiment), the first fan 23 is on, and the second fan 24 is off.
- the thermal electric cooler 13 operates in high power, the first fan 23 is on, and the second fan 24 is off.
- the thermal electric cooler 13 operates in high power, the first fan 23 is on, and the second fan 24 is on.
- the thermal electric cooler 13 operates in full power, the first fan 23 is on, and the second fan 24 is on.
- thermometer including a thermometer (not shown) is provided between the cover 11 and the CPU 3 .
- the thermometer is adapted to measure the operating temperature of the CPU 3 and the temperature sensor is adapted to send the measured temperature to a control program which is, in turn, run to determine a corresponding case of the cooling device (i.e., temperature range).
- a cycle 51 including third, fourth, and fifth cases 43 , 44 , and 45 can be formed.
- a drop of the operating temperature of the CPU 3 out of the range of 41° C. and 69.9° C. may cause the cooling device to leave the fifth case 45 to enter the third case 43 directly as controlled by the running control program.
- the cycle 51 thus can operate in a low noise and power saving mode.
- state change can be made either from the first case 41 to the second case 42 or from the second case 42 to the first case 41 (i.e., reversible therebetween).
- state change can be made either from the second case 42 to the third case 43 or from the third case 43 to the second case 42 .
- state change can be made either from the fifth case 45 to the sixth case 46 or from the sixth case 46 to the fifth case 45 .
- the operating temperature of CPU 3 and the operating status of any component of the cooling device can be shown on the computer monitor immediately. For instance, an under temperature warning may be issued when the CPU 3 is operating in the first case 41 . Also, an over temperature warning may be issued when the CPU 3 is operating in the sixth case 46 .
- the above temperature cases are implemented as a finite state machine. Further, any change from one state to the other state is done by event driving in a logic flow. For instance, it is done by running a software called “STATE FLOW”.
Abstract
Provided are chip-based CPU cooling device and cooling method thereof. The cooling device comprises a metal cover adapted to completely cover and contact the CPU, a hollow seat, a thermal electric cooler shaped to fit in the seat and adapted to contact the cover, a heat dissipation member (e.g., fins) enclosed by a housing and mounted on the seat for contacting the thermal electric cooler, a first fan mounted on top of the housing, and a second fan mounted on side of the housing. An optimum heat dissipation can be obtained by running a control program to control on/off of the fans and power of the thermal electric cooler by operating the cooling device in one of a plurality of corresponding temperature ranges of the CPU.
Description
- 1. Field of Invention The present invention generally relates to CPU (central processing unit) cooling devices and more particularly to a chip-based CPU cooling device having a thermal electric cooler and a cooling method thereof.
- 2. Description of Related Art
- Operating frequency of the CPU of a computer has been continuously increasing as the technology develops. Accordingly, heat generated by a running CPU increases greatly. Heat dissipation thus has become a critical issue in maintaining the normal operation of a CPU (i.e., computer).
- Conventionally, a CPU cooler is implemented as a passive one. In detail, a member formed of high heat conduction metal or alloy is mounted on the CPU. The member comprises a plurality of parallel fins. In operation, heat generated by CPU is transferred to the fins by contact prior to dissipating to the ambient. For achieving maximum heat dissipation, the number of fins, locations of the fins, angles of the fins with respect to CPU, convection, material of the cooler (i.e., heat conductivity of material) are considered. However, the desired good heat dissipation of CPU is compromised as interference among heat conduction, convection, and radiation.
- Another conventional CPU cooler is implemented as a thermal electric cooler which is in direct contact with CPU. A heat absorbing surface and a heat dissipating surface are formed on both sides of a semiconductor chip in response to electric current flowing through the thermal electric cooler. The heat absorbing surface contacts the hot CPU and the heat dissipating surface is in fluid communication with a heat sink or cooling fan so as to carry out cooling of the CPU. Such technique is disclosed in Taiwanese Patent No. 88,203,663. However, heat may undesirably transfer back to the heat absorbing surface if cooling members arranged at the heat dissipating surface operate abnormally. Moreover, dew may generate on the cooler due to abrupt temperature drop. Thus, the need for improvement of thermal electric cooler for CPU still exists.
- It is therefore an object of the present invention to provide a chip-based CPU cooling device having a metal cover completely covered and contacted the CPU for facilitating heat dissipation by eliminating external air interference.
- It is another object of the present invention to provide a chip-based CPU cooling device comprising a hollow seat and a housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fins by eliminating external air interference.
- It is yet another object of the present invention to provide a chip-based CPU cooling device comprising a thermal electric cooler, a first fan mounted on a first outlet, and a second fan mounted on a second outlet such that an optimum heat dissipation can be obtained by running a control program to optionally control on/off of the fans and power of the activated thermal electric cooler depending on actual demand.
- In one aspect of the present invention, there is provided a chip-based cooling device mountable on a CPU arranged on a motherboard, comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the thermal electric cooler is shaped to fit in the seat, the heat dissipation member is enclosed by the housing and is mounted on the seat, the first fan is mounted on top of the housing, the second fan is mounted on one side of the housing, the thermal electric cooler is adapted to contact the cover, and the heat dissipation member is adapted to contact the thermal electric cooler, and wherein the seat and housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fin by eliminating external air interference.
- In another aspect of the present invention, in a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device there is provided a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range each of the thermal electric cooler, the first fan, and the second fan is off; in a second range each of the thermal electric cooler, the first fan, and the second fan is in a standby condition; in a third range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a fourth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a fifth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; and in a sixth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on; c) measuring the operating temperature of the CPU; and d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform.
- In yet another aspect of the present invention, in a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device there is provided a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; c) measuring the operating temperature of the CPU; d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range.
- The above and other objects, features and advantages of the present invention will become apparent from the following detailed description taken with the accompanying drawings.
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FIG. 1 is an exploded perspective view of a preferred embodiment of cooling device according to the invention to be mounted on a CPU; -
FIG. 2 is a perspective view of one portion of the assembled cooling device shown inFIG. 1 ; -
FIG. 3 is a perspective view of the remaining portion of the assembled cooling device shown inFIG. 1 ; -
FIG. 4 is a perspective view of the completely assembled cooling device on the CPU shown inFIG. 1 ; and -
FIG. 5 is a state diagram illustrating a plurality of temperature cases according to a cooling method of the invention. - Referring to FIGS. 1 to 4, there is shown a cooling device for CPU in accordance with a preferred embodiment of the invention. The cooling device comprises a
cover 11 formed of metal of high heat conductivity, aseat 12, a thermalelectric cooler 13, aframe 14, a plurality offins 21 of high heat conductivity as a heat sink, ahousing 22, afirst fan 23, and asecond fan 24. Each component is discussed in detailed below. - A
CPU 3 is completely covered by thecover 11 thereon. Thecover 11 also completely contacts theCPU 3 and the thermalelectric cooler 13. Thecover 11 is served to direct out heat produced fromCPU 3. The squarehollow seat 12 comprises an outer U-shapedwall 121, an inner U-shapedwall 122, a U-shapedgroove 123 defined by thewalls central opening 124 which is a hollow-through opening. A chip powered by flowing electric current therethrough is provided in the thermalelectric cooler 13 and the chip comprises a lowerheat absorbing surface 131 and an upperheat dissipating surface 132. A lower portion of the thermalelectric cooler 13 is shaped to neatly fit in theopening 124 to contact thecover 11. - The
square frame 14 comprises acentral opening 141 with an upper portion of the thermalelectric cooler 13 neatly fitted therein and slightly, upwardly projected from the seat 12 (as shown inFIG. 3 ) to contact the base of thefins 21. Thehousing 22 is secured to the seat 12 (as shown inFIG. 4 ), which is in turn secured to a motherboard with theCPU 3 mounted thereon in a manner known in the art. Thehousing 22, as shown inFIG. 1 , comprises anouter wall 221, aninner wall 222, achannel 223 defined by thewalls central passageway 224 defined by theinner wall 222 for neatly fitting thefins 21 therein, anupper opening 225 with thefirst fan 23 mounted thereon, and aninclined passage 226 at one side, thepassage 226 having anopening 227 at an open end with thesecond fan 24 mounted thereon. This completes the assembly of the cooling device for CPU on the motherboard, as shown inFIG. 4 . Note that thefins 21 may be replaced by any of other good heat dissipation members (e.g., heat pipe) in other embodiments. - In operation, heat generated by the running
CPU 3 is transferred to theheat dissipating surface 132 through thecover 11 and theheat absorbing surface 131 by conduction in which electricity is produced by heating the junction between theheat absorbing surface 131 and theheat dissipating surface 132 so as to produce an electromotive force. Further, heat is transferred to thefins 21 from theheat dissipating surface 132 by conduction due to the electromotive force. At the same time, thefirst fan 23 is powered to dissipate heat from thefins 21 to the ambient via thepassageway 224 and thesecond fan 24 is powered to draw external cold air onto thefins 21 in thepassageway 227. Such can greatly enhance the heat dissipation capability of the cooling device, resulting in a quick, sufficient cooling of theCPU 3. - Referring to
FIG. 5 , it shows a state diagram illustrating a plurality of cases (six cases are shown) according to a cooling method of the cooling device of the invention. The cases are defined based on the operating temperature ofCPU 3. Afirst case 41 corresponds to the operating temperature ofCPU 3 smaller than 15° C. (i.e., temp<15° C.), asecond case 42 corresponds to the operating temperature ofCPU 3 larger or equal to 15° C. and smaller than 25° C. (i.e., 15° C.≦temp<25° C.), athird case 43 corresponds to the operating temperature ofCPU 3 larger or equal to 25° C. and smaller than 36° C. (i.e., 25° C.≦temp<36° C.), afourth case 44 corresponds to the operating temperature ofCPU 3 larger or equal to 36° C. and smaller than 41° C. (i.e., 36° C.≦temp<41° C.), afifth case 45 corresponds to the operating temperature ofCPU 3 larger or equal to 41° C. and smaller or equal to 69.9° C. (i.e., 41° C.≦temp≦69.9° C.), and asixth case 46 corresponds to the operating temperature ofCPU 3 larger than 70° C. (i.e., 70° C.<temp) respectively. Predetermined operations of certain components (e.g., on or off of thefirst fan 23 and/or thesecond fan 24, and off, low power operation, or full (or high) power operation of the thermalelectric cooler 13 of the cooling device will be activated immediately when the operating temperature ofCPU 3 reaches the temperature range of one of the cases. As a result, an optimum heat dissipation effect can be carried out as detailed below. - In the
first case 41 the thermalelectric cooler 13, thefirst fan 23, and thesecond fan 24 are all off. In thesecond case 42 the thermalelectric cooler 13, thefirst fan 23, and thesecond fan 24 are in standby condition. In thethird case 43 the thermalelectric cooler 13 operates in low power (or in half power as in other preferred embodiment), thefirst fan 23 is on, and thesecond fan 24 is off. In thefourth case 44 the thermalelectric cooler 13 operates in high power, thefirst fan 23 is on, and thesecond fan 24 is off. In thefifth case 45 the thermalelectric cooler 13 operates in high power, thefirst fan 23 is on, and thesecond fan 24 is on. In thesixth case 46 the thermalelectric cooler 13 operates in full power, thefirst fan 23 is on, and thesecond fan 24 is on. Additionally, a temperature sensor including a thermometer (not shown) is provided between thecover 11 and theCPU 3. The thermometer is adapted to measure the operating temperature of theCPU 3 and the temperature sensor is adapted to send the measured temperature to a control program which is, in turn, run to determine a corresponding case of the cooling device (i.e., temperature range). - A
cycle 51 including third, fourth, andfifth cases CPU 3 out of the range of 41° C. and 69.9° C. may cause the cooling device to leave thefifth case 45 to enter thethird case 43 directly as controlled by the running control program. Thecycle 51 thus can operate in a low noise and power saving mode. Moreover, state change can be made either from thefirst case 41 to thesecond case 42 or from thesecond case 42 to the first case 41 (i.e., reversible therebetween). Also, state change can be made either from thesecond case 42 to thethird case 43 or from thethird case 43 to thesecond case 42. In addition, state change can be made either from thefifth case 45 to thesixth case 46 or from thesixth case 46 to thefifth case 45. - Additionally, the operating temperature of
CPU 3 and the operating status of any component of the cooling device can be shown on the computer monitor immediately. For instance, an under temperature warning may be issued when theCPU 3 is operating in thefirst case 41. Also, an over temperature warning may be issued when theCPU 3 is operating in thesixth case 46. In brief, the above temperature cases are implemented as a finite state machine. Further, any change from one state to the other state is done by event driving in a logic flow. For instance, it is done by running a software called “STATE FLOW”. - While the invention herein disclosed has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (12)
1. A chip-based cooling device mountable on a CPU arranged on a motherboard, comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the cover is also adapted to contact a bottom of the thermal electric cooler, the thermal electric cooler is shaped to fit in the seat, the housing is mounted on a top of the seat, the heat dissipation member is enclosed by the housing, the first fan is mounted on a top of the housing, the second fan is mounted on a side of the housing, and a bottom of the heat dissipation member is adapted to contact a top of the thermal electric cooler.
2. The cooling device of claim 1 , wherein each of the seat and the housing comprises an outer wall, an inner wall, and a groove defined by the walls for direct air communication with the cover or the heat dissipation member.
3. The cooling device of claim 2 , wherein the seat further comprises a central opening for receiving the thermal electric cooler.
4. The cooling device of claim 2 , wherein the housing further comprises a central passageway defined by the inner wall for receiving the heat dissipation member, an upper opening with the first fan mounted thereon, and an inclined passage at one side, the passage having an opening at an open end with the second fan mounted thereon.
5. The cooling device of claim 4 , wherein the first fan is adapted to dissipate heat to the ambient and the second fan is adapted to draw external cold air into the housing.
6. The cooling device of claim 1 , further comprising a hollow frame comprising a central opening shaped to put the thermal electric cooler therein such that the thermal electric cooler therein is adapted to upwardly project from the seat.
7. The cooling device of claim 1 , wherein the heat dissipation member is a heat sink.
8. The cooling device of claim 1 , wherein the heat dissipation member is a heat pipe.
9. In a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device, a method of cooling the CPU comprising the steps of:
a) defining an operating temperature of the CPU into one of a plurality of ranges;
b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range each of the thermal electric cooler, the first fan, and the second fan is off; in a second range each of the thermal electric cooler, the first fan, and the second fan is in a standby condition; In a third range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a fourth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a fifth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; in a sixth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on;
c) measuring the operating temperature of the CPU; and
d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform.
10. In a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device, a method of cooling the CPU comprising the steps of:
a) defining an operating temperature of the CPU into one of a plurality of ranges;
b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on;
c) measuring the operating temperature of the CPU;
d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and
e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range.
11. In a chip-based cooling device mountable on a CPU arranged on a motherboard, a method of cooling the CPU comprising the steps of:
a) defining an operating temperature of the CPU into one of a plurality of ranges;
b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; and
in a fourth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on;
c) measuring the operating temperature of the CPU; and
d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform.
12. In a chip-based cooling device mountable on a CPU arranged on a motherboard, a method of cooling the CPU comprising the steps of:
a) defining an operating temperature of the CPU into one of a plurality of ranges;
b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on;
c) measuring the operating temperature of the CPU;
d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and
e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094102464A TW200627133A (en) | 2005-01-27 | 2005-01-27 | Chip-type heat sink module and heat dissipation method thereof |
TW094102464 | 2005-01-27 |
Publications (1)
Publication Number | Publication Date |
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US20060162340A1 true US20060162340A1 (en) | 2006-07-27 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/082,693 Abandoned US20060162340A1 (en) | 2005-01-27 | 2005-03-18 | Chip-based CPU cooler and cooling method thereof |
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US (1) | US20060162340A1 (en) |
JP (1) | JP2006210863A (en) |
TW (1) | TW200627133A (en) |
Cited By (18)
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US20070289324A1 (en) * | 2006-06-19 | 2007-12-20 | Tsunemoto Suzuki | Cabinet for mri system |
US20110048689A1 (en) * | 2009-08-28 | 2011-03-03 | Johnson Scott T | Architecture for gas cooled parallel microchannel array cooler |
US20110129910A1 (en) * | 2009-10-20 | 2011-06-02 | Agency For Science, Technology And Research | Cooling device, and assembly, and methods for lowering temperature in a chemical reaction |
EP2472351A1 (en) * | 2010-12-31 | 2012-07-04 | Advanced Digital Broadcast S.A. | A method for controlling a cooling system and a cooling system |
US20120213579A1 (en) * | 2011-02-18 | 2012-08-23 | Burroughs Payment System, Inc. | Stacking Adapter and Assembly Including the Same |
USD772179S1 (en) * | 2015-08-26 | 2016-11-22 | Ebullient, Inc. | Heat sink module |
USD772178S1 (en) * | 2015-09-26 | 2016-11-22 | Ebullient, Inc. | Heat sink module |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
USD772822S1 (en) * | 2015-06-11 | 2016-11-29 | Ebullient, Inc. | Redundant heat sink module |
USD773409S1 (en) * | 2015-09-16 | 2016-12-06 | Ebullient, Llc | Multi-chamber heat sink module |
USD774472S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
US20170083058A1 (en) * | 2015-09-23 | 2017-03-23 | Chris Janak | Modular thermal solution for high-performance processors |
CN106870425A (en) * | 2016-11-14 | 2017-06-20 | 奇鋐科技股份有限公司 | Tandem fan incline structure |
CN106970691A (en) * | 2016-11-14 | 2017-07-21 | 奇鋐科技股份有限公司 | Has the tandem fan of framework |
USD812022S1 (en) * | 2015-09-12 | 2018-03-06 | Ebullient, Llc | Multi-chamber heat sink module |
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US20070289324A1 (en) * | 2006-06-19 | 2007-12-20 | Tsunemoto Suzuki | Cabinet for mri system |
US20110048689A1 (en) * | 2009-08-28 | 2011-03-03 | Johnson Scott T | Architecture for gas cooled parallel microchannel array cooler |
US9455213B2 (en) | 2009-08-28 | 2016-09-27 | Raytheon Company | Architecture for gas cooled parallel microchannel array cooler |
US20110129910A1 (en) * | 2009-10-20 | 2011-06-02 | Agency For Science, Technology And Research | Cooling device, and assembly, and methods for lowering temperature in a chemical reaction |
EP2472351A1 (en) * | 2010-12-31 | 2012-07-04 | Advanced Digital Broadcast S.A. | A method for controlling a cooling system and a cooling system |
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US20120213579A1 (en) * | 2011-02-18 | 2012-08-23 | Burroughs Payment System, Inc. | Stacking Adapter and Assembly Including the Same |
USD774473S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
USD774472S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
USD773408S1 (en) * | 2015-06-11 | 2016-12-06 | Ebullient, Inc. | Redundant heat sink module |
USD772822S1 (en) * | 2015-06-11 | 2016-11-29 | Ebullient, Inc. | Redundant heat sink module |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
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USD773409S1 (en) * | 2015-09-16 | 2016-12-06 | Ebullient, Llc | Multi-chamber heat sink module |
US20170083058A1 (en) * | 2015-09-23 | 2017-03-23 | Chris Janak | Modular thermal solution for high-performance processors |
US10299403B2 (en) * | 2015-09-23 | 2019-05-21 | Advanced Micro Devices, Inc. | Modular thermal solution for high-performance processors |
USD772178S1 (en) * | 2015-09-26 | 2016-11-22 | Ebullient, Inc. | Heat sink module |
USD786806S1 (en) * | 2015-09-26 | 2017-05-16 | Ebullient, Inc. | Heat sink module |
CN106970691A (en) * | 2016-11-14 | 2017-07-21 | 奇鋐科技股份有限公司 | Has the tandem fan of framework |
CN106870425A (en) * | 2016-11-14 | 2017-06-20 | 奇鋐科技股份有限公司 | Tandem fan incline structure |
US20180156234A1 (en) * | 2016-12-05 | 2018-06-07 | Asia Vital Components Co., Ltd. | Fan frame body structure and fan with the fan frame body |
US10024326B2 (en) * | 2016-12-05 | 2018-07-17 | Asia Vital Components Co., Ltd. | Series fan with support frame |
US20220312639A1 (en) * | 2021-03-29 | 2022-09-29 | Beijing Xiaomi Mobile Software Co., Ltd. | Electronic device |
US11765860B2 (en) * | 2021-03-29 | 2023-09-19 | Beijing Xiaomi Mobile Software Co., Ltd | Electronic device |
Also Published As
Publication number | Publication date |
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JP2006210863A (en) | 2006-08-10 |
TW200627133A (en) | 2006-08-01 |
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