TW200627133A - Chip-type heat sink module and heat dissipation method thereof - Google Patents

Chip-type heat sink module and heat dissipation method thereof

Info

Publication number
TW200627133A
TW200627133A TW094102464A TW94102464A TW200627133A TW 200627133 A TW200627133 A TW 200627133A TW 094102464 A TW094102464 A TW 094102464A TW 94102464 A TW94102464 A TW 94102464A TW 200627133 A TW200627133 A TW 200627133A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
chip
sink module
central microprocessor
heat sink
Prior art date
Application number
TW094102464A
Other languages
Chinese (zh)
Inventor
Wei-Chen Kuo
Original Assignee
Iter Networking Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iter Networking Corp filed Critical Iter Networking Corp
Priority to TW094102464A priority Critical patent/TW200627133A/en
Priority to US11/082,693 priority patent/US20060162340A1/en
Priority to JP2005102106A priority patent/JP2006210863A/en
Publication of TW200627133A publication Critical patent/TW200627133A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides a chip-type heat sink module and a heat dissipation method thereof, which are used to reduce the temperature of central microprocessor during operation. The chip-type heat sink module comprises a metal cover, a first shell, a thermoelectric cooler, a heat dissipation element, a second shell, a first fan, and a second fan, wherein the metal cover could collect and isolate the heat source of the central microprocessor, then the thermoelectric cooler is employed to reduce the temperature of central microprocessor, and the heat is conducted to the heat dissipation element and dissipated out through the first and second fans; given a driving software to control the power of the thermoelectric cooler and on/off procedures of the first and second fans for heat dissipation, the central microprocessor and the overall environment could achieve better operation efficiency.
TW094102464A 2005-01-27 2005-01-27 Chip-type heat sink module and heat dissipation method thereof TW200627133A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094102464A TW200627133A (en) 2005-01-27 2005-01-27 Chip-type heat sink module and heat dissipation method thereof
US11/082,693 US20060162340A1 (en) 2005-01-27 2005-03-18 Chip-based CPU cooler and cooling method thereof
JP2005102106A JP2006210863A (en) 2005-01-27 2005-03-31 Wafer type heat dissipation module and its heat dissipation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102464A TW200627133A (en) 2005-01-27 2005-01-27 Chip-type heat sink module and heat dissipation method thereof

Publications (1)

Publication Number Publication Date
TW200627133A true TW200627133A (en) 2006-08-01

Family

ID=36695221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102464A TW200627133A (en) 2005-01-27 2005-01-27 Chip-type heat sink module and heat dissipation method thereof

Country Status (3)

Country Link
US (1) US20060162340A1 (en)
JP (1) JP2006210863A (en)
TW (1) TW200627133A (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4129032B2 (en) * 2006-06-19 2008-07-30 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー Cabinet for MRI equipment
EP2471095B1 (en) * 2009-08-28 2018-02-21 Raytheon Company Architecture for gas cooled parallel microchannel array cooler
US20110129910A1 (en) * 2009-10-20 2011-06-02 Agency For Science, Technology And Research Cooling device, and assembly, and methods for lowering temperature in a chemical reaction
PL2472351T3 (en) * 2010-12-31 2013-07-31 Advanced Digital Broadcast Sa A method for controlling a cooling system and a cooling system
US20120213579A1 (en) * 2011-02-18 2012-08-23 Burroughs Payment System, Inc. Stacking Adapter and Assembly Including the Same
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
US10299403B2 (en) * 2015-09-23 2019-05-21 Advanced Micro Devices, Inc. Modular thermal solution for high-performance processors
USD786806S1 (en) * 2015-09-26 2017-05-16 Ebullient, Inc. Heat sink module
CN106870425B (en) * 2016-11-14 2020-02-11 奇鋐科技股份有限公司 Serial fan inclined structure
CN106970691B (en) * 2016-11-14 2020-03-10 奇鋐科技股份有限公司 Series fan with frame
US20180156234A1 (en) * 2016-12-05 2018-06-07 Asia Vital Components Co., Ltd. Fan frame body structure and fan with the fan frame body
US10024326B2 (en) * 2016-12-05 2018-07-17 Asia Vital Components Co., Ltd. Series fan with support frame
CN115151119A (en) * 2021-03-29 2022-10-04 北京小米移动软件有限公司 Electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6448544B1 (en) * 1998-06-08 2002-09-10 Brandeis University Low noise, high resolution image detection system and method
MXPA02010790A (en) * 2001-03-03 2004-02-26 Zalman Tech Co Ltd Heatsink and heatsink device using the heatsink.
US6415612B1 (en) * 2001-06-29 2002-07-09 Intel Corporation Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler

Also Published As

Publication number Publication date
US20060162340A1 (en) 2006-07-27
JP2006210863A (en) 2006-08-10

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