JP2006210863A - Wafer type heat dissipation module and its heat dissipation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer type heat dissipation module for lowering the temperature in operation of a central processing unit, and a heat dissipation method therefor. <P>SOLUTION: The wafer type heat dissipation module comprises a metal cover plate 11, a first shell body 12, a thermoelectronic cooler 13, a heat dissipation element 21, a second shell body 22, a first fan 23 and a second fan 24. The metal cover plate 11 shields against heat energy of the central processing unit 3. The thermoelectronic cooler 13 lowers the temperature of the central processing unit 3, and further the heat is transferred to the heat dissipation element 21, and dissipated by the first fan 23 and the second fan 24. By controlling electric power of the thermoelectronic cooler 13 and procedure of heat dissipation such as ON and OFF conditions, etc. of the first and second fans 23 and 24 with the use of a computer program, an environment of the central processing unit and the whole is improved to obtain superior effect. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wafer type heat dissipation module and a heat dissipation method thereof, and more particularly to a heat dissipation module including a wafer type thermoelectric cooler.

  As science and technology advances, the calculation speed of elements inside electronic products becomes faster and the amount of information processing also increases. On the other hand, the heat energy generated in the central processing unit also increases. Since these thermal energies affect the operation efficiency and quality of the central processing unit, how to dissipate the thermal energy is a problem that cannot be ignored when researching and developing electronic products. Various heat dissipation products are being researched and developed by the competition of modern science and technology for heat dissipation products.

  The conventional heat dissipation system is mainly a passive heat dissipation system, and a metal or metal alloy having excellent thermal conductivity is used as a heat conductor, and fins or holes are provided in the heat conductor, so that the heat conductor and air or water are provided. In order to increase the contact area with the fluid such as, and improve the effect of thermal convection. In such a passive heat dissipation system, in order to obtain a better heat dissipation effect, various measures are taken with respect to the number, position, angle, direction of convection, etc. In order to obtain conductivity, attempts have been made to change the ratio of the alloy to the conductor material, the ratio of the composite material, and the like. However, there are three types of methods of heat transfer: convection, conduction, and radiation. Since these three types of heat conduction methods interfere with each other inside the central processing unit, the heat dissipation effect is not fully exhibited. There is a fact that.

  Further, the thermoelectric cooler is brought into contact with the central processing unit, and the thermoelectric cooler utilizes the characteristic that the thermoelectric cooler generates a heat absorbing surface and a heat generating surface on both sides of the semiconductor wafer due to a current conduction effect. The technology of cooling the central processing unit by bringing it into contact with the central processing unit that generates heat and bringing the heat generation surface into contact with a heat sink and a cooling fan is disclosed in, for example, Taiwan Patent No. 088203663. It is disclosed. In the structure and method described in the patent, by applying a voltage to the thermoelectric cooler, a temperature difference is generated on both sides of the semiconductor wafer, one surface absorbs heat, and the other surface generates heat. Obtainable. The thermoelectric cooler has such a characteristic of temperature difference, but if the heat dissipation of the heat dissipation surface is insufficient, it will affect the temperature of the heat absorption surface and the heat energy will flow to the heat absorption surface. become. In addition, since the temperature rises and falls rapidly, there is a problem that the dew condensation phenomenon often appears. Therefore, there is still a point to be improved in the thermoelectric cooler used for heat dissipation of the central processing unit.

  The main object of the present invention is a wafer-type heat radiation module having a thermoelectric cooler, and the central processing unit is completely covered with a metal cover plate, and heat is collected. It is an object of the present invention to provide a wafer type module capable of avoiding heat conduction.

  Another object of the present invention is a wafer-type heat radiation module having a thermoelectric cooler, and provides a wafer-type module that can avoid heat conduction with the outside by having a shell made of an inner and outer double shell wall. There is to do.

  A further object of the present invention is a wafer-type heat radiation module having two exhaust ports and a fan, and the optimum heat radiation effect is obtained by controlling the power of the thermoelectric cooler and the on / off state of the fan by a computer program. An object of the present invention is to provide a wafer-type heat radiation module that can be achieved.

  In order to achieve the above object, the invention according to claim 1 is used for lowering the operating temperature of the central processing unit provided in the electric circuit board, and includes a metal cover plate, a first shell body, , A wafer-type heat dissipation module comprising a thermoelectric cooler, a heat dissipation element, a second shell, a first fan, and a second fan, the metal cover plate covering the central processing unit The first shell body covers the thermoelectric cooler and the second shell body covers the upper side of the first shell body while covering the heat dissipating element, and the first fan. Is provided on the upper side of the second shell, the second fan is provided on the upper edge of one side wall of the second shell, the thermoelectric cooler is in contact with the metal cover plate so as to conduct heat, and dissipates heat. A wafer-type heat dissipation module is provided in which the element is in contact with the thermoelectric cooler so that heat conduction is possible. It is.

  The invention according to claim 2 is the wafer-type heat dissipation module according to claim 1, wherein each of the first shell body and the second shell body has an inner shell wall and an outer shell wall, The gist is that an air chamber is formed between the outer shell wall and the outer shell wall, and the air chamber contains air for preventing heat energy from being transmitted to the outside.

  According to a third aspect of the present invention, in the wafer-type heat dissipation module according to the second aspect, an accommodation space penetrating in the vertical direction is formed at the center of the first shell, and the thermoelectric cooler is accommodated in the accommodation space. The gist is that

  According to a fourth aspect of the present invention, in the wafer-type heat radiation module according to the second aspect, a passage penetrating in the vertical direction is formed at the center of the second shell, and the heat radiation element is accommodated in the passage. A first air vent is formed on the upper side of the second shell in the first shell, a conduit is connected to the upper side of one side wall of the second shell, and the conduit has a second air vent. The gist is that a first fan is attached and a second fan is attached to the second air vent.

  According to a fifth aspect of the present invention, in the wafer-type heat dissipation module according to the fourth aspect, one of the first fan and the second fan discharges air from the second shell to the outside, and the other The gist of the fan is to suck air into the second shell.

  The invention according to claim 6 is the wafer-type heat dissipation module according to claim 1, wherein the heat dissipation module further includes a partition plate, and an opening having a size corresponding to the size of the thermoelectric cooler is provided at the center of the partition plate. The section is provided, the partition plate is disposed on the accommodation space, and the thermoelectric cooler protrudes from the upper surface of the first shell through the opening.

The gist of the invention according to claim 7 is that, in the wafer-type heat radiation module according to claim 1, the heat radiation element is a heat radiation plate.
The gist of the invention according to claim 8 is that, in the wafer type heat radiation module according to claim 1, the heat radiation element is a heat radiation pipe.

  The invention according to claim 9 is a heat dissipation method for a wafer-type heat dissipation module, wherein the wafer-type heat dissipation module includes a thermoelectric cooler for lowering the operating temperature of the central processing unit, a first fan, and a second The thermoelectric cooler has a heat radiating surface and a heat absorbing surface, and the temperature difference between the heat radiating surface and the heat absorbing surface is obtained by the input power of the thermoelectric cooler. The second fan sucks air from the outside into the heat dissipation module, and the heat dissipation method is based on the input power of the thermoelectric cooler and the on / off of the first fan and the second fan by a computer program. In the method for controlling the state, the step of dividing into a plurality of states based on the operating temperature of the central processing unit, the input power of the thermoelectric cooler corresponding to each state, the first fan and the second fan The process of setting the on and off states, the input power of the thermoelectric cooler corresponding to each state, and the operation setting related to the on and off states of the first fan and the second fan are performed by the thermoelectric cooler with low power. A state where the first fan is on and the second fan is off, and the thermoelectric cooler is operated with a large amount of power and the first fan is on And the second fan is set to be in an off state, the thermoelectric cooler is operated with a large electric power, and both the first fan and the second fan are in an on state. And a state in which the thermoelectric cooler is operated at maximum power and both the first fan and the second fan are set to the on state, and Arithmetic processing equipment To determine the corresponding state from temperature, it provides a method of thermal radiation of the wafer heat-dissipating module comprising a step of controlling the state of the input power and the first and second fans on and off the thermoelectric cooler.

  The invention according to claim 10 is a heat dissipation method for a wafer-type heat dissipation module, wherein the wafer-type heat dissipation module has a thermoelectric cooler for lowering the operating temperature of the central processing unit, a first fan, and a second The thermoelectric cooler has a heat radiating surface and a heat absorbing surface, and the temperature difference between the heat radiating surface and the heat absorbing surface is obtained by the input power of the thermoelectric cooler. The second fan sucks air from the outside into the heat dissipation module, and the heat dissipation method is based on the input power of the thermoelectric cooler and the on / off of the first fan and the second fan by a computer program. In the method for controlling the off state, the step of dividing into a plurality of states based on the operating temperature of the central processing unit, the input power of the thermoelectric cooler corresponding to each state, the first fan and the second The thermoelectric cooler sets the on / off state of the fan, and the operation settings regarding the input power of the thermoelectric cooler corresponding to each state and the on / off states of the first fan and the second fan. A thermoelectric cooler is operated at high power, the first state is set to be operated with small power, the first fan is in an on state, and the second fan is in an off state; A second state in which the second fan is turned on and the second fan is turned off, and the thermoelectric cooler is operated with high power, and the first fan and the second fan Including at least a third state set so as to be in an on state, and determining a corresponding state from the operating temperature of the central processing unit, the input power of the thermoelectric cooler and the first state Fan and second fan And the step of controlling the off state, the first state, the second state, and the third state constitute one operation cycle, and the operation temperature of the central processing unit is from a temperature range corresponding to the third state. A wafer-type heat dissipation module which is set to return to the first state when the temperature falls below the temperature range in the third state, and which again determines the corresponding state from the operating temperature of the central processing unit Provide a heat dissipation method.

  In order to conduct most of the heat energy generated from the central processing unit to the thermoelectric cooler, the metal cover plate covers the central processing unit and is in contact with the central processing unit and the thermoelectric cooler. The metal lid plate has a function of recovering heat energy generated from the central processing unit. The first shell and the second shell each have an inner shell wall and an outer shell wall, and an air chamber is formed between the inner shell wall and the outer shell wall. By containing air in the chamber, heat conduction with the outside is prevented.

  The heat dissipation method of the wafer type heat dissipation module of the present invention comprises controlling the heat dissipation effect of the heat dissipation module using a computer program. A plurality of states are set, and each of the plurality of states has a corresponding condition. When the condition in the state is satisfied, the operation setting according to the condition can be started. The operation setting parameters include controlling the input power of the thermoelectric cooler and controlling the on and off states of the first fan and the second fan. By changing the input power of the thermoelectric cooler, different temperature differences can be obtained. Corresponding to the first fan and the second fan being turned on or turned off, different degrees of convection can be obtained, whereby the heat radiation effect under different conditions can be controlled.

  In the wafer type heat radiation module of the present invention, it is possible to avoid heat conduction between the central processing unit and the outside by completely covering the central processing unit with a metal cover plate and recovering heat. It is possible to avoid heat conduction with the outside by providing a shell body made of a double shell wall. By providing the above configuration, an efficient heat dissipation effect can be achieved. Furthermore, the optimal heat radiation effect can be achieved by controlling the power of the thermoelectric cooler and the on / off state of the fan with a computer program.

In order that those skilled in the art can further understand the structure and technical features of the present invention, preferred embodiments of the present invention will be described in detail below with reference to the drawings.
1 to 4 are perspective views of a wafer-type heat radiation module according to a preferred embodiment of the present invention. The wafer type heat radiation module of the present embodiment is used to dissipate heat energy generated in the central processing unit 3.

  The wafer type heat radiation module of the present embodiment mainly includes a metal lid plate 11, a first shell body 12, a thermoelectric cooler 13, a heat radiation fin piece 21, a second shell body 22, and a first fan. 23 and a second fan 24.

  In order to conduct most of the heat energy generated in the central processing unit 3 to the thermoelectric cooler 13, the metal cover plate 11 covers the central processing unit 3 and the central processing unit 3 and the thermoelectric cooler 13. Make contact. The metal lid plate 11 has a function of recovering heat energy generated in the central processing unit 3. The first shell 12 includes two shell walls 121 and 122 of an inner layer and an outer layer, and an air chamber 123 is formed between the shell wall 122 of the inner layer and the shell wall 121 of the outer layer. The air chamber 123 is filled with air, so that heat conduction with the outside can be prevented. An accommodation space 124 penetrating in the vertical direction is formed at the center of the first shell body 12, and the thermoelectric cooler 13 is disposed above the accommodation space 124 so as to contact the metal lid plate 11. .

  The first shell body 12 has a hollow structure, and a slot for accommodating the metal lid plate 11 corresponding to the metal lid plate 11 is provided below the accommodation space 124 of the first shell body 12. Is provided. The entire first shell 12 is fixed by a frame so that the thermal energy generated in the central processing unit 3 is conducted in the vertical direction by covering the central processing unit 3 and the metal cover plate 11. It is controlled and the whole heat dissipation efficiency can be improved.

  The first shell 12 entirely covers the central processing unit 3 and the metal cover plate 11, that is, formed between the inner shell wall 122 and the outer shell wall 121 of the first shell 12. The air chamber 123 covers the thermoelectric cooler 13. In the present embodiment, a partition plate 14 that covers the upper side of the first shell 12 is provided above the first shell 12. The partition plate 14 is provided with an opening 141 having a size corresponding to the size of the thermoelectric cooler 13, so that the upper end of the thermoelectric cooler 13 passes through the opening 141. Projecting from the upper surface of the first shell 12.

  The second shell body 22 is connected to the first shell body 12 and includes two shell walls 221 and 222 of an inner layer and an outer layer. An air chamber 223 is formed by the inner shell wall 222 and the outer shell wall 221 of the second shell body 22, and it is avoided that heat is conducted to the outside by filling the air chamber 223 with air. A passage 224 penetrating in the vertical direction is provided in the center of the second shell body 22, and the heat conducted from the thermoelectric cooler 13 can be further reduced by accommodating the radiating fin piece 21 in the passage 224. It becomes. The lower end portion of the radiating fin piece 21 is in contact with the thermoelectric cooler 13. A first air vent 225 is formed at the upper edge of the second shell 22 in the passage 224, and a conduit 226 is connected to the upper side of one side wall of the second shell. The conduit 226 has a second air vent 227. A first fan 23 is attached to the first air outlet 225, and a second fan 24 is attached to the second air outlet 227. The first fan 23 quickly discharges the heat energy dissipated from the heat dissipating fin piece 21, and the second fan 24 is configured to introduce cold air and improve the heat dissipating speed by air convection.

  In the present embodiment, the heat dissipating fin piece 21 is a heat dissipating plate having a fin piece, and has a high thermal conductivity and is an excellent heat dissipating element. The heat radiating element may be another heat conductor having an excellent heat radiating function. For example, a heat conduction pipe or the like has the same effect as the present invention.

  Thermal energy generated by the operation of the central processing unit 3 is conducted to the thermoelectric cooler 13 by the metal lid plate 11, and a wafer that can be controlled by current is installed in the thermoelectric cooler 13. The wafer has a heat absorbing surface 131 and a heat radiating surface 132, and heat can be radiated on the other side while absorbing heat. The heat absorption surface 131 is in contact with the metal lid plate 11, while the heat dissipation surface 132 is in contact with the heat dissipation fin piece 21. The thermal energy is transmitted to the heat radiating fin piece 21 after being transmitted to the heat radiating surface 132 by electrothermal conversion. Cold air is sucked into the passage 224, and the first fan 23 discharges the hot air from the passage 224, thereby achieving the effect of accelerating the circulation of the air and cooling the central processing unit 3.

  As shown in FIG. 5, the preferred heat dissipation method of the wafer type heat dissipation module of the present invention includes actively controlling the heat dissipation effect of the heat dissipation module using a computer program. First, based on the operating temperature of the central processing unit 3, it is divided into several states as shown in FIG. For example, as the temperature corresponding to the first state 41, the operating temperature of the central processing unit 3 is set to a temperature lower than 15 ° C. (temp <15 ° C.). As the temperature corresponding to the second state 42, the operating temperature is set to a temperature of 15 ° C. or higher and lower than 25 ° C. (15 ° C. ≦ temp <25 ° C.). As the temperature corresponding to the third state 43, the operating temperature is set to a temperature of 25 ° C. or higher and lower than 36 ° C. (25 ° C. ≦ temp <36 ° C.). As the temperature corresponding to the fourth state 44, the operating temperature is set to a temperature of 36 ° C. or higher and lower than 41 ° C. (36 ° C. ≦ temp <41 ° C.). As the temperature corresponding to the fifth state 45, the operation temperature is set to a temperature of 41 ° C. or higher and 69.9 ° C. or lower (41 ° C. ≦ temp ≦ 69.9 ° C.). As the temperature corresponding to the sixth state 46, the operating temperature is set to a temperature higher than 70 ° C. (70 ° C. <temp). Each of these states has a corresponding temperature condition as described above, and is set so that a preset operation is started when the temperature condition is satisfied. The setting of the operation includes controlling the input power of the thermoelectric cooler and controlling the on and off states of the first fan and the second fan. By changing the input power of the thermoelectric cooler, a corresponding temperature difference can be obtained. Different degrees of convection can be obtained depending on the on and off states of the first fan and the second fan. And the heat dissipation effect in various state conditions can be controlled.

  In the heat dissipation method of the present invention, the operation setting in the first state 41 includes an off state of the thermoelectric cooler 13 and an off state of the first fan 23 and the second fan 24. The operation setting of the second state 42 includes a step of entering standby. The operation setting of the third state 43 includes that the thermoelectric cooler 13 is operated with a small electric power (set to half the electric power in the present embodiment), and the first fan 23 is on. Yes, and the second fan 24 is set to be in an off state. The operation setting of the fourth state 44 includes that the thermoelectric cooler 13 is operated with a large electric power (set to the maximum electric power in the present embodiment), and the first fan 23 is on. And the second fan 24 is set to be in an off state. The operation setting of the fifth state 45 includes that the thermoelectric cooler 13 is operated with a large electric power (set to the maximum electric power in this embodiment), and includes the first fan 23 and the second fan All fans 24 are set to be in an on state. The operation setting in the sixth state 46 includes that the thermoelectric cooler 13 is operated at the maximum power, and is set so that both the first fan 23 and the second fan 24 are turned on. Has been.

  In this embodiment, the metal cover plate 11 and the central processing unit are used to control the thermoelectric cooler 13 with a computer program and to accurately operate the first fan 23 and the second fan 24 in a corresponding state. 3 is provided with a temperature sensor (not shown). This temperature sensor can directly measure the operating temperature of the central processing unit 3, and transmits the measured temperature value to a control program, which is configured to determine the state corresponding to that temperature by logic judgment. ing.

  The third state 43, the fourth state 44, and the fifth state 45 can be set as one operation cycle 51. Temporarily, the temperature of the central processing unit 3 falls outside the range of the set temperature that is the condition of the fifth state 45 (in this embodiment, the temperature is set to 41 ° C. or more and 69.9 ° C. or less). If so, the control program moves the operating state from the fifth state 45 to the third state 43. Therefore, the third state 43, the fourth state 44, and the fifth state 45 constitute an operation cycle 51 that reduces noise, and has the effect of saving power and reducing noise quickly.

  With respect to the operation cycle 51 including the third state 43, the fourth state 44, and the fifth state 45, between the first state 41 and the second state 42, the second state 42 and the third state 42 The relationship between the state 43 and the fifth state 45 and the sixth state 46 is a reversible relationship, that is, the order of the two states can be interchanged.

  The present invention can be further provided with a function for calling attention. In any state, the related information is displayed on the display of the personal computer by program control, so that the related information (for example, system status, central processing unit) can be displayed to the user. Operating temperature, etc.).

  In the present embodiment, the low temperature caution system may be set in the first state 41 and the high temperature caution system may be set in the sixth state 46. Thereby, the user can obtain information on the system state at that time.

  Since the heat radiation module of the present invention divides each state into a finite state machine, a logic flow guided by an event can be created. By using a computer program such as a state flow, the operation of the heat dissipation module can be positively controlled, and optimization of heat dissipation control can be further achieved.

  The structures and features described in the present embodiment are described for the purpose of clearly understanding the present invention, and do not limit the scope of the present invention. Various modifications made by a person skilled in the art based on the description of the present invention should be regarded as equivalent to the present invention without departing from the spirit of the present invention and included in the scope of the claims of the present invention. Should be considered.

1 is an exploded perspective view of a preferred embodiment of the present invention. 1 is an assembled perspective view of a preferred embodiment of the present invention. It is a perspective view which shows a part of preferable embodiment of this invention. It is a perspective view which shows another part of preferable embodiment of this invention. FIG. 3 is a logic diagram of a heat dissipation method according to a preferred embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Metal cover board, 12 ... 1st shell body, 121,221 ... Outer shell wall, 122, 222 ... Inner shell wall, 123, 223 ... Air chamber, 124 ... Housing space, 13 ... Thermoelectric cooler, 131 ... heat absorbing surface, 132 ... heat radiating surface, 14 ... partition plate, 141 ... opening, 21 ... heat radiating fin piece, 22 ... second shell, 224 ... passage, 225 ... first air outlet, 226 ... conduit, 227 2nd air outlet, 23 ... 1st fan, 24 ... 2nd fan, 3 ... Central processing unit, 41 ... 1st state, 42 ... 2nd state, 43 ... 3rd state, 44 ... 4th state, 45 ... 5th state, 46 ... 6th state, 51 ... driving cycle.

Claims (10)

Used to lower the operating temperature of the central processing unit provided on the electric circuit board, and a metal cover plate, a first shell, a thermoelectric cooler, a heat dissipation element, a second shell, In the wafer type heat dissipation module composed of the first fan and the second fan,
The metal cover plate covers the central processing unit and is in contact with the central processing unit so as to allow heat conduction, the first shell covers the thermoelectric cooler, and the second shell covers the heat dissipation element. While covering the upper side of the first shell body, the first fan is provided on the upper side of the second shell body, and the second fan is placed on the upper edge of one side wall of the second shell body. The wafer type heat radiation module is provided, wherein the thermoelectric cooler is in contact with the metal lid plate so as to be able to conduct heat, and the heat radiating element is in contact with the thermoelectric cooler so as to be able to conduct heat. In the wafer type heat dissipation module according to claim 1,
Each of the first shell and the second shell has an inner shell wall and an outer shell wall, and an air chamber is formed between the inner shell wall and the outer shell wall. A wafer-type heat radiation module, wherein the air chamber contains air for preventing heat energy from being conducted to the outside. In the wafer type heat radiation module according to claim 2,
An accommodation space penetrating in the vertical direction is formed in the center of the first shell, and the thermoelectric cooler is accommodated in the accommodation space. In the wafer type heat radiation module according to claim 2,
A passage penetrating in the vertical direction is formed in the center of the second shell body, the heat dissipation element is accommodated in the passage, and a first air vent is formed above the second shell body in the passage. A conduit is connected to an upper side of one side wall of the second shell, the conduit has a second air vent, a first fan is attached to the first air vent, and the second A wafer-type heat dissipation module, wherein a second fan is attached to the air vent of the fan. In the wafer type heat dissipation module according to claim 4,
One of the first fan and the second fan exhausts air from the second shell to the outside, and the other fan sucks air into the second shell. Heat dissipation module. In the wafer type heat dissipation module according to claim 1,
The heat dissipation module further includes a partition plate, an opening having a size corresponding to the size of the thermoelectric cooler is provided at the center of the partition plate, and the partition plate is disposed on the accommodation space, The thermoelectric cooler protrudes from the upper surface of the first shell through the opening, and is a wafer type heat dissipation module. In the wafer type heat dissipation module according to claim 1,
The wafer type heat radiation module, wherein the heat radiation element is a heat radiation plate. In the wafer type heat dissipation module according to claim 1,
The wafer type heat radiation module, wherein the heat radiation element is a heat radiation pipe. A heat dissipation method for a wafer-type heat dissipation module,
The wafer-type heat dissipation module has a thermoelectric cooler for lowering the operating temperature of the central processing unit, a first fan, and a second fan, and the thermoelectric cooler has a heat dissipation surface and a heat absorption surface. The temperature difference between the heat dissipation surface and the heat absorption surface is obtained by the input power of the thermoelectric cooler, the first fan exhausts air from the heat dissipation module, and the second fan exhausts air. In the method of sucking into the heat dissipation module from the outside and controlling the input power of the thermoelectric cooler and the on / off states of the first fan and the second fan by a computer program, the heat dissipation method Is
Dividing into a plurality of states based on the operating temperature of the central processing unit;
The step of setting the input power of the thermoelectric cooler corresponding to each state and the on and off states of the first fan and the second fan, the input power of the thermoelectric cooler corresponding to each state, and the first The operational settings for the on and off states of the fan and the second fan are such that the thermoelectric cooler is operated with low power, the first fan is on, and the second fan is off. The thermoelectric cooler is operated with large power, the first fan is turned on, and the second fan is turned off, and the thermoelectric cooler is large A state in which the first fan and the second fan are both set to the on state, and the thermoelectric cooler is operated at the maximum power, and the first fan and the second fan are operated with electric power. All fans are on And that the state, the comprising at least the set to be in a state,
Determining the corresponding state from the operating temperature of the central processing unit, and controlling the input power of the thermoelectric cooler and the on and off states of the first and second fans;
A heat dissipation method for a wafer-type heat dissipation module. A heat dissipation method for a wafer-type heat dissipation module,
The wafer-type heat dissipation module has a thermoelectric cooler for lowering the operating temperature of the central processing unit, a first fan, and a second fan, and the thermoelectric cooler has a heat dissipation surface and a heat absorption surface. The temperature difference between the heat dissipation surface and the heat absorption surface is obtained by the input power of the thermoelectric cooler, the first fan exhausts air from the heat dissipation module, and the second fan exhausts air. In the method of sucking into the heat dissipation module from the outside and controlling the input power of the thermoelectric cooler and the on / off states of the first fan and the second fan by a computer program, the heat dissipation method Is
Dividing into a plurality of states based on the operating temperature of the central processing unit;
The step of setting the input power of the thermoelectric cooler corresponding to each state and the on and off states of the first fan and the second fan, the input power of the thermoelectric cooler corresponding to each state, and the first The operational settings for the on and off states of the fan and the second fan are such that the thermoelectric cooler is operated with low power, the first fan is on, and the second fan is off. And a second state set such that the thermoelectric cooler is operated with a large electric power, the first fan is on, and the second fan is off. And a third state in which the thermoelectric cooler is operated with a large electric power and both the first fan and the second fan are set to be in an on state,
Determining the corresponding state from the operating temperature of the central processing unit, and controlling the input power of the thermoelectric cooler and the on and off states of the first and second fans;
The first state, the second state, and the third state constitute one operation cycle, and the operation temperature of the central processing unit is from a temperature range corresponding to the third state to a temperature range in the third state. A step of returning to the first state when the temperature falls to a low temperature, and again determining the corresponding state from the operating temperature of the central processing unit;
A heat dissipation method for a wafer-type heat dissipation module.

Images