USD795821S1 - Liquid cooling cold plate with diamond cut pin fins - Google Patents

Liquid cooling cold plate with diamond cut pin fins Download PDF

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Publication number
USD795821S1
USD795821S1 US29/555,493 US201629555493F USD795821S US D795821 S1 USD795821 S1 US D795821S1 US 201629555493 F US201629555493 F US 201629555493F US D795821 S USD795821 S US D795821S
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US
United States
Prior art keywords
liquid cooling
cold plate
pin fins
cooling cold
diamond cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/555,493
Inventor
Ali Mira
Yashar Mira
Michael Mira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HeatscapeCom Inc
Original Assignee
HeatscapeCom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by HeatscapeCom Inc filed Critical HeatscapeCom Inc
Priority to US29/555,493 priority Critical patent/USD795821S1/en
Assigned to HEATSCAPE.COM, INC. reassignment HEATSCAPE.COM, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIRA, ALI, MIRA, MICHAEL, MIRA, YASHAR
Application granted granted Critical
Publication of USD795821S1 publication Critical patent/USD795821S1/en
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Description

FIG. 1 is a top perspective view of a liquid cooling cold plate with diamond cut pin fins showing our new design;
FIG. 2 is a top perspective disassembled view corresponding to FIG. 1;
FIG. 3 is a bottom perspective disassembled view corresponding to FIG. 1;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front elevational view thereof;
FIG. 8 is a top plan view thereof; and,
FIG. 9 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a liquid cooling cold plate with diamond cut pin fins, as shown and described.
US29/555,493 2016-02-22 2016-02-22 Liquid cooling cold plate with diamond cut pin fins Active USD795821S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/555,493 USD795821S1 (en) 2016-02-22 2016-02-22 Liquid cooling cold plate with diamond cut pin fins

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Application Number Priority Date Filing Date Title
US29/555,493 USD795821S1 (en) 2016-02-22 2016-02-22 Liquid cooling cold plate with diamond cut pin fins

Publications (1)

Publication Number Publication Date
USD795821S1 true USD795821S1 (en) 2017-08-29

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US29/555,493 Active USD795821S1 (en) 2016-02-22 2016-02-22 Liquid cooling cold plate with diamond cut pin fins

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Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060291165A1 (en) * 2005-05-31 2006-12-28 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
US20080007915A1 (en) * 2006-07-06 2008-01-10 Chao-Chuan Chen Heat sink device for a heat generating element
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20110304979A1 (en) * 2009-01-29 2011-12-15 Peterson Eric C Cooling apparatus
US20120261095A1 (en) * 2011-04-12 2012-10-18 Asia Vital Components Co., Ltd. Thermal module structure and manufacturing method thereof
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
US20160327996A1 (en) * 2015-05-08 2016-11-10 Fujitsu Limited Cooling module and electronic device
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
US20160363967A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation device thereof
US20160366788A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060291165A1 (en) * 2005-05-31 2006-12-28 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
US20080007915A1 (en) * 2006-07-06 2008-01-10 Chao-Chuan Chen Heat sink device for a heat generating element
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20110304979A1 (en) * 2009-01-29 2011-12-15 Peterson Eric C Cooling apparatus
US20120261095A1 (en) * 2011-04-12 2012-10-18 Asia Vital Components Co., Ltd. Thermal module structure and manufacturing method thereof
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
US20160327996A1 (en) * 2015-05-08 2016-11-10 Fujitsu Limited Cooling module and electronic device
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
US20160363967A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation device thereof
US20160366788A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module

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