CN102157467A - Cooling heat-dissipation system and cooling device thereof - Google Patents
Cooling heat-dissipation system and cooling device thereof Download PDFInfo
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- CN102157467A CN102157467A CN 201010120010 CN201010120010A CN102157467A CN 102157467 A CN102157467 A CN 102157467A CN 201010120010 CN201010120010 CN 201010120010 CN 201010120010 A CN201010120010 A CN 201010120010A CN 102157467 A CN102157467 A CN 102157467A
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Abstract
The invention relates to a cooling heat-dissipation system and a cooling device thereof. The cooling heat-dissipation system is used for dissipating heat energy generated by a heat source and comprises the cooling device, a condenser, a vapour transfer tube and a cooling liquid transfer tube, wherein the cooling device comprises a hollow shell and a spray orifice sheet, wherein the spray orifice sheet is arranged in the shell, separates the inner space of the shell into a liquid supply chamber and a vapour chamber adjacent to the heat source and is provided with a plurality of micropores with aperture dimensions of between 5 micrometers and 1000 micrometers; the condenser is provided with a fluid inlet, a condensing cavity and a cooling liquid outlet which are communicated; the vapour transfer tube is communicated between a vapour outlet of the shell of the cooling device and the fluid inlet of the condenser; the cooling liquid transfer tube is communicated between the cooling liquid outlet of the condenser and a cooling liquid inlet of the shell of the cooling device; and the cooling device, the condenser, the vapour transfer tube and the cooling liquid transfer tube form a closed loop.
Description
Technical field
The present invention relates to a kind of cooling heat radiation system, particularly relate to a kind of loop formula cooling heat radiation system that utilizes the evaporative phase-change principle to dispel the heat.
Background technology
General active electric sub-element cooling system such as the fan fin (or claiming fin) of arranging in pairs or groups, perhaps fan collocation fin and heat pipe all face unit are heat flux (W/cm
2) be not enough to reach the demand of following high power electronic element radiating.
For in response to high power electronic element radiating demand, the technology that development in recent years goes out to utilize the phase change principle that electronic component is cooled off, for example the U.S. the 7th, 082,778B2 patent case discloses a kind of spraying radiating module, uses the principle of similar ink gun ink-jet, produces bubble with the surface tension of the electrode slice collocation hydraulic fluid of heating, force hydraulic fluid to be extruded and in spray chamber, produce and spray spraying evaporation of vaporizing with the heat-generating electronic elements thermo-contact; In vaporescence, absorb the heat energy that electronic component produced in a large number, reach the effect of cooling.Yet the inkjet head technology is complex structure not only, and the electrode slice of shower nozzle need heat, and causes hydraulic fluid temperature when the shower nozzle position to improve, and reduces radiating efficiency.Therefore, be necessary to develop the cooling system that another kind has high cooling efficiency.
Summary of the invention
The objective of the invention is is providing a kind of designs simplification and is having the cooling heat radiation system of high cooling efficiency.
Another object of the present invention is to provide a kind of cooling device that can effectively make the hydraulic fluid atomizing and help to evaporate.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to the cooling heat radiation system that the present invention proposes, be used for loosing and remove the heat energy that a thermal source produces, comprise a cooling device, a condenser, a steam transfer tube and a cooling fluid transfer tube.Cooling device comprises a hollow housing, and a spray nozzle sheet that is installed in the housing, and this spray nozzle sheet is the steam chamber of a feed flow chamber and contiguous this thermal source with the enclosure interior separated by spaces, and has most the micropores of aperture size between 5 to 1000 microns (μ m).Housing also has the vapor outlet port that a cooling fluid inlet and that is communicated with this feed flow chamber and supplies working fluid to flow into is communicated with this steam chamber.
Preferably, each micropore has a liquid inlet and a hydrojet end, and the aperture of this micropore is tapered to the smaller aperture due of this hydrojet end by the larger aperture of liquid inlet.This spray nozzle sheet be utilize electroforming process, laser processing technology, heat pressing process and injection molding wherein a mode make.
Preferably, the aperture size of the micropore of this spray nozzle sheet is between 5 to 500 microns, and is better between 10 to 200 microns, and the distance between micropore and micropore is between 5 to 2000 microns; Micropore is matrix form or alternating expression is arranged.The thickness of spray nozzle sheet is between 20 to 300 microns.
Preferably, the housing of this cooling device has one around the upper casing portion that defines this feed flow chamber, reaches a corresponding combination with this upper casing portion and centers on the lower casing portion that defines this vaporization chamber.This lower casing portion inner surface has in order to improve the micro-structural of evaporation effect.This cooling device comprises that also majority is arranged at the flow deflector of this upper casing portion inner surface.
Condenser has fluid inlet, a condensation chamber and a cooling liquid outlet that communicates.Preferably, condenser comprises that a continuous hollow stores cell body and most hollow fin, and this storage cell body is connected with these fin spaces and forms this condensation chamber; Wherein, have in order to promote the micro-structural of condensation efficiency around storage cell body that defines this condensation chamber and fin inner surface.The bottom surface of the storage cell body of this condenser is inclination, and this cooling liquid outlet is positioned at the lower of this storage cell body bottom surface, and this fluid intake position is higher than this cooling liquid outlet.Condenser also comprises the fan of the outer surface of being located at these fins.
The steam transfer tube is communicated between the fluid intake of the vapor outlet port of housing of cooling device and this condenser.Preferably, the inner surface of this steam transfer tube has the micro-structural that promotes condensation efficiency.
The cooling fluid transfer tube is communicated between the cooling fluid inlet of housing of the cooling liquid outlet of this condenser and this cooling device.
Preferably, this cooling heat radiation system also comprises a transmission supplementary module, comprise be installed on one in this loop in order to the pump and that drives working fluid in order to control the control valve of this working fluid flow.
This cooling heat radiation system also comprises power supply and the control module that a pair of this transmission supplementary module provides power supply and control running; This cooling device also comprises a temperature sensing spare in order to this heat source temperature of sensing, this condenser also comprises respectively a temperature sensing spare and the pressure-sensing spare in order to this condensation cavity temperature of sensing and pressure, this power supply is connected with these temperature sensing spares, pressure-sensing spare with control module, and this transmits the parameter of supplementary module running as control with measured temperature, pressure.
By technique scheme, cooling heat radiation system of the present invention and cooling device thereof have following advantage and beneficial effect at least: utilize the spray nozzle sheet that has the atomic little micropore in a large amount of and aperture in the cooling device, make the hydraulic fluid atomizing or become superfine fluid column, the heat energy that energy high efficiency absorption thermal source transmits produces phase change becomes gas, be directed to condenser by fluid transfer pipe again and carry out heat exchange and reply and to be liquid, reach the purpose of high cooling efficiency.
In sum, the present invention is relevant a kind of cooling heat radiation system and cooling device thereof.This cooling heat radiation system is used for loosing and removes the heat energy that thermal source produces, and comprises cooling device, condenser, steam transfer tube and cooling fluid transfer tube.This cooling device comprises that a hollow housing and is installed on the spray nozzle sheet in the housing, and this spray nozzle sheet is the steam chamber of feed flow chamber and contiguous this thermal source with the enclosure interior separated by spaces, and has most the micropores of aperture size between 5 to 1000 microns.Condenser has fluid inlet, a condensation chamber and a cooling liquid outlet that communicates.The steam transfer tube is communicated between the fluid intake of the vapor outlet port of housing of this cooling device and this condenser.The cooling fluid transfer tube is communicated between the cooling fluid inlet of housing of the cooling liquid outlet of this condenser and this cooling device; This cooling device, condenser, steam transfer tube and cooling fluid transfer tube form loop.The present invention has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the system schematic of first preferred embodiment of cooling heat radiation system of the present invention.
Fig. 2 is the perspective exploded view of a cooling device in this first preferred embodiment.
Fig. 3 is the schematic diagram that cooling device that hydraulic fluid enters first preferred embodiment carries out the situation of heat exchange.
Fig. 4 is the stereogram of the spray nozzle sheet of first preferred embodiment.
Fig. 5 and Fig. 6 are the schematic diagrames of the technology of this spray nozzle sheet of explanation.
Fig. 7 is the schematic diagram of a condenser in this first preferred embodiment.
Fig. 8 and Fig. 9 are the vertical views of the cooling device of the present invention's second preferred embodiment.
Figure 10 is the schematic diagram that cooling device that hydraulic fluid enters second preferred embodiment carries out the situation of heat exchange.
Figure 11 is the schematic diagram that the present invention is applied to the LED light fixture.
Figure 12 is the schematic diagram that the present invention is applied to host computer.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to cooling heat radiation system and its embodiment of cooling device, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Seeing also shown in Figure 1ly, is the system schematic of first preferred embodiment of cooling heat radiation system of the present invention.The cooling heat radiation system 100 of the present invention's first preferred embodiment, be used for the diffusing heat energy that a thermal source 70 produces that removes, comprise a cooling device 1, a condenser 2, a steam transfer tube 3, a cooling fluid transfer tube 4, a transmission supplementary module 5, and a power supply and control module 6.This cooling device 1, condenser 2, steam transfer tube 3 and cooling fluid transfer tube 4 form a loop.Transmission supplementary module 5 comprises and is installed on one in this loop in order to drive the pump 51 and the control valve 52 in order to the Control work fluid flow of working fluid.Working fluid that present embodiment adopts is Flourinert and the Novec series of products that 3M produces, but not as limit, also can be water or alcohol.Pump 51 can be piezoelectric film type, gear type or electromagnetic type, and compatible with working fluid; It should be noted that control valve 52 can omit if pump 51 is the may command flow.
Cooperating and to consult Fig. 2 and Fig. 3, is respectively the schematic diagram that cooling device that perspective exploded view, the hydraulic fluid of a cooling device in this first preferred embodiment enters first preferred embodiment carries out the situation of heat exchange.Above-mentioned cooling device 1 comprises that a hollow housing 11, with bottom surface contact thermal source 70 is installed on the spray nozzle sheet 12 in the housing 11, and a temperature sensing spare 13.Spray nozzle sheet 12 is divided into housing 11 inner spaces the steam chamber 103 of the feed flow chamber 102 and a below of one top.Housing 11 has a connection feed flow chamber 102 and for the cooling fluid inlet 101 that working fluid flows into, reaches the vapor outlet port 104 of a connection steam chamber 103.The housing 11 of present embodiment is by a upper casing portion 111 and a lower casing portion 112 corresponding combining, and upper casing portion 111 is around defining this feed flow chamber 102, and lower casing portion 112 is around defining this vaporization chamber 103.
Seeing also shown in Figure 4ly, is the stereogram of spray nozzle sheet of first preferred embodiment of cooling heat radiation system of the present invention.Above-mentioned spray nozzle sheet 12 thickness and have most and are the micropores 120 that matrix form or alternating expression are arranged between 20 to 300 microns (μ m).Micropore 120 aperture sizes are between 5 to 1000 microns, and the distance that micropore 120 and micropore are 120 is between 5 to 2000 microns.The aperture size of the micropore 120 of present embodiment is between 10 to 200 microns, inferior good also can be between 5 to 500 microns, can make working fluid reach preferable atomizing effect and more help heat radiation.
Consult Fig. 4, Fig. 5 and Fig. 6, Fig. 5 and Fig. 6 are the schematic diagrames of the technology of this spray nozzle sheet of explanation.In the present embodiment, the manufacture method of spray nozzle sheet 12 comprises following steps:
At the beginning, one for example the surface of material main body such as glass or silicon 80 utilize technology such as physical vapor deposition (PVD) or chemical vapor deposition (CVD) to form a depositing metal layers (figure do not show), then utilize method of spin coating (spin coating) or infusion process to form a photoresist layer (figure does not show); After then by light shield photoresist layer being exposed, develop and remove the not beneath photoresist layer of transmission region, to expose depositing metal layers to be removed with yellow photolithographic techniques; Then remove the depositing metal layers that is not subjected to the photoresistance protection and exposes with etching mode; and remove all photoresistances subsequently; this moment as shown in Figure 5; the depositing metal layers 81 that has a plurality of perforation 810 in the surface of material main body 80 formation one; these perforation 810 are the predetermined hole of the micropore 120 of spray nozzle sheet 12, and the aperture is greater than micropore 120.
Then, utilize electroforming process to form an electroforming metal layer 83 on depositing metal layers 81 surfaces.At last, carry out the demoulding and electroforming metal layer 83 is separated with depositing metal layers 81 and material main body 80, form spray nozzle sheet 12 as shown in Figure 4.
Consult Fig. 2, Fig. 3 and Fig. 4 simultaneously, utilize micropore 120 apertures of the spray nozzle sheet 12 that above-mentioned technology makes adjustable, and each micropore 120 has the liquid inlet 121 of contiguous this feed flow chamber 102, and the hydrojet end 122 of contiguous this vaporization chamber 103.The aperture of micropore 12 is the smaller aperture due that are tapered to hydrojet end 122 by the larger aperture of liquid inlet 121.
When working fluid enters feed flow chamber 102 by cooling fluid inlet 101, can enter steam chamber 103 by the extremely many and atomic little micropore 120 of spray nozzle sheet 12 and form most superfine fluid columns or fine droplet spraying.Fluid column or be sprayed at steam chamber 103 bottoms and form as thin as a wafer liquid layer, liquid layer becomes steam because of the heat energy that absorbs thermal source 70 generations evaporates, and produce bubble 9 and steam is accumulated at housing 11 inner surfaces easily, fluid column that continues to splash into or spraying can be broken bubble 9 and steam is shed through vapor outlet port 104, improve flow of vapor efficient.
In addition, lower casing portion 112 inner surfaces of present embodiment have micro-structural, also help to make liquid layer evaporation becoming steam by the surface area increase, improve the effect of utilizing phase change to absorb heat energy.
See also Fig. 1 and shown in Figure 3, the steam in the steam chamber 103 enters steam transfer tube 3 through vapor outlet port 104.Present embodiment steam transfer tube 3 is made with the material that macromolecular material or stainless steel etc. is compatible to hydraulic fluid, its inner surface has micro-structural, increase and the lifting condensation efficiency by surface area, make steam have an opportunity in steam transfer tube 3, promptly to be condensed into liquid, and with pump 51 actuating forces, steam pressure, capillarity in the collocation steam transfer tube 3 makes the liquid (general designation fluid) of steam or condensation enter condenser 2.
Cooperate and consult Fig. 7, condenser 2 comprises that a continuous hollow stores cell body 21 and most hollow fin 22, this storage cell body 21 is connected with the inner space of fin 22 and forms a condensation chamber 202, and storage cell body 21 has fluid inlet 201 and one cooling liquid outlet 203 that communicates with this condensation chamber 202.The usefulness that the fin 22 of present embodiment is designed to hollow is intended to increase the heat of steam exchange area, helps to improve condensation effect; In addition, the inner surface that stores cell body 21 and fin 22 also has micro-structural, promotes condensation efficiency by increasing surface area equally.When fluid enters condensation chamber 202 by fluid intake 201, can carry out heat exchange fast and discharge latent heat, be condensed into liquid and lower the temperature into cooling fluid.
Consult Fig. 1 once more, present embodiment utilizes power supply and 6 pairs of transmission of control module supplementary module 5 that power supply and control running are provided, this condenser 2 also comprises respectively a temperature sensing spare 23 and the pressure-sensing spare 24 in order to temperature and pressure in this condensation chamber 202 of sensing, temperature sensing spare 23, the pressure-sensing spare 24 of power supply and control module 6 and this condenser 2, and the temperature sensing spare 13 of cooling device 1 connects, and with measured temperature, the pressure parameter as control pump 51 rotating speeds or control valve 52 openings of sizes or switching frequency; Pump 51 is accepted the power supply of power supply and control module 6 and control signal and is turned round, and control valve 52 is accepted the power supply of power supply and control module 6 and control signal and switch and control flow.
See also shown in Fig. 1, Fig. 2 and Fig. 8 to 10, Fig. 8 and Fig. 9 are the vertical views of the cooling device of the present invention's second preferred embodiment; Figure 10 is the schematic diagram that cooling device that hydraulic fluid enters second preferred embodiment carries out the situation of heat exchange.Second preferred embodiment of cooling heat radiation system 100 of the present invention and the difference of first preferred embodiment are that cooling device 1 comprises that also majority is arranged at the flow deflector 14 of upper casing portion 111 inner surfaces, and these flow deflectors 14 are that the center is radial arrangement or concentric circles is arranged with cooling fluid inlet 101.When hydraulic fluid flows into from cooling fluid inlet 101, to be subjected to these flow deflector 14 guiding and past direction drainage of not being obstructed, and form big pressure and force these spray nozzle sheet 12 central authorities to be sunk slightly below cooling fluid inlet 101, flow through spray nozzle sheet 12 formed fluid columns or spraying of hydraulic fluid will enter steam chamber 103 more equably.
The application of relevant cooling heat radiation system of the present invention 100 is fit to be installed on as shown in figure 11 a LED light fixture 71, and its cooling device 1 contacts with LED wafer (thermal source 70) and utilizes phase change to absorb heat energy; Also be fit to be installed on as shown in figure 12 in the casing 72 of host computer, its cooling device 1 contacts with central processing unit (thermal source 70), and in order to form forced convertion, to strengthen radiating effect, this condenser 2 also comprises the fan 25 of the outer surface of being located at these fins 22.
In sum, cooling heat radiation system of the present invention absorbs the principle of a large amount of latent heat when utilizing liquid phase-change to change into to gas, and the designs such as special spray nozzle sheet of arranging in pairs or groups significantly improve radiating efficiency, so can reach purpose of the present invention really.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (22)
1. a cooling heat radiation system is used for loosing and removes the heat energy that a thermal source produces, and comprises a cooling device, a condenser, a steam transfer tube and a cooling fluid transfer tube; It is characterized in that: cooling device comprises a hollow housing, and one be installed in this housing and be the spray nozzle sheet that a feed flow chamber and is close to the steam chamber of this thermal source with this enclosure interior separated by spaces, this housing also has the vapor outlet port that a cooling fluid inlet and that is communicated with this feed flow chamber and supplies working fluid to flow into is communicated with this steam chamber, and this spray nozzle sheet has the most individual micropores of aperture size between 5 to 1000 microns; This condenser has fluid inlet, a condensation chamber and a cooling liquid outlet that communicates; This steam transfer tube is communicated between the fluid intake of the vapor outlet port of housing of this cooling device and this condenser; This cooling fluid transfer tube is communicated between the cooling fluid inlet of housing of the cooling liquid outlet of this condenser and this cooling device, and this cooling device, condenser, steam transfer tube and cooling fluid transfer tube form a loop.
2. cooling heat radiation system as claimed in claim 1 is characterized in that: the micropore of the spray nozzle sheet of this cooling device has a liquid inlet and a hydrojet end, and the aperture of this micropore is tapered to the smaller aperture due of this hydrojet end by the larger aperture of liquid inlet.
3. cooling heat radiation system as claimed in claim 1 is characterized in that: the spray nozzle sheet of this cooling device be utilize electroforming process, laser processing technology, heat pressing process and injection molding wherein a mode make.
4. cooling heat radiation system as claimed in claim 1 is characterized in that: the aperture size of the micropore of this spray nozzle sheet is between 5 to 500 microns.
5. cooling heat radiation system as claimed in claim 4 is characterized in that: the aperture size of the micropore of this spray nozzle sheet is between 10 to 200 microns.
6. as each described cooling heat radiation system in the claim 1 to 5, it is characterized in that: the micropore of this spray nozzle sheet and the distance between micropore are between 5 to 2000 microns.
7. as each described cooling heat radiation system in the claim 1 to 5, it is characterized in that: the thickness of this spray nozzle sheet is between 20 to 300 microns.
8. as each described cooling heat radiation system in the claim 1 to 5, it is characterized in that: the housing of this cooling device has one around the upper casing portion that defines this feed flow chamber, reaches a corresponding combination with this upper casing portion and centers on the lower casing portion that defines this vaporization chamber.
9. cooling heat radiation system as claimed in claim 8 is characterized in that: this lower casing portion inner surface has in order to improve the micro-structural of evaporation effect.
10. cooling heat radiation system as claimed in claim 8 is characterized in that: this cooling device comprises that also majority is arranged at the flow deflector of this upper casing portion inner surface.
11. cooling heat radiation system as claimed in claim 1 is characterized in that: this condenser comprises that a continuous hollow stores cell body and plurality of fins.
12. cooling heat radiation system as claimed in claim 11 is characterized in that: the fin hollow of this condenser, this storage cell body are connected with these fin spaces and form this condensation chamber to expand heat exchange area.
13. cooling heat radiation system as claimed in claim 12 is characterized in that: the bottom surface of the storage cell body of this condenser is inclination, and this cooling liquid outlet is positioned at the lower of this storage cell body bottom surface, and this fluid intake position is higher than this cooling liquid outlet.
14. cooling heat radiation system as claimed in claim 12 is characterized in that: this condenser also comprises the fan of the outer surface of being located at these fins.
15. cooling heat radiation system as claimed in claim 12 is characterized in that: have in order to promote the micro-structural of condensation efficiency around storage cell body that defines this condensation chamber and fin inner surface.
16. as claim 1 or 15 described cooling heat radiation systems, it is characterized in that: the inner surface of this steam transfer tube has the micro-structural that promotes condensation efficiency.
17. cooling heat radiation system as claimed in claim 1 is characterized in that: this cooling heat radiation system also comprises a transmission supplementary module, comprises that one is installed in this loop and in order to drive the pump of working fluid.
18. cooling heat radiation system as claimed in claim 17 is characterized in that: this transmission supplementary module comprises that also one is installed in this loop and in order to control the control valve of this working fluid flow.
19. as claim 17 or 18 described cooling heat radiation systems, it is characterized in that: this cooling heat radiation system also comprises power supply and the control module that a pair of this transmission supplementary module provides power supply and control running.
20. cooling heat radiation system as claimed in claim 19, it is characterized in that: this cooling device also comprises a temperature sensing spare in order to this heat source temperature of sensing, this power supply is connected with this temperature sensing spare with control module, and with the parameter of the measured temperature of this temperature sensing spare as this transmission supplementary module running of control.
21. cooling heat radiation system as claimed in claim 19, it is characterized in that: this condenser also comprises a temperature sensing spare and the pressure-sensing spare in order to this condensation chamber internal pressure of sensing in order to this condensation cavity temperature of sensing, this power supply is connected with this temperature sensing spare, pressure-sensing spare with control module, and transmits the parameter that supplementary module operates with the measured temperature of this temperature sensing spare, the measured pressure of this pressure-sensing spare as controlling this.
22. cooling device as each described cooling heat radiation system in the claim 1 to 10.
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| CN 201010120010 CN102157467A (en) | 2010-02-12 | 2010-02-12 | Cooling heat-dissipation system and cooling device thereof |
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| CN 201010120010 CN102157467A (en) | 2010-02-12 | 2010-02-12 | Cooling heat-dissipation system and cooling device thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101048A1 (en) * | 2012-12-27 | 2014-07-03 | Feng Jin | High-efficiency heat dissipation device |
| CN104111711A (en) * | 2013-04-19 | 2014-10-22 | 微曜科技股份有限公司 | phase change heat dissipation system |
| CN104677158A (en) * | 2014-12-16 | 2015-06-03 | 西北工业大学 | Forced cooling device based on latent heat exchanging |
| CN108445998A (en) * | 2018-02-28 | 2018-08-24 | 重庆补贴猫电子商务有限公司 | Computer cooling device |
| CN110220174A (en) * | 2019-06-15 | 2019-09-10 | 绵阳恒酷热技术有限公司 | A kind of phase transformation takes hot LED illumination System |
| CN110534487A (en) * | 2018-05-24 | 2019-12-03 | 大众汽车有限公司 | The motor vehicle of component and band member with the cooling power optimized through insertion element |
| CN111678071A (en) * | 2020-07-30 | 2020-09-18 | 浙江欧易新能源有限公司 | Dull and stereotyped lamp of low energy consumption LED of high light efficiency |
| CN112051912A (en) * | 2020-09-30 | 2020-12-08 | 兰洋(宁波)科技有限公司 | Single-phase immersed liquid heat exchange system and heat exchange method |
| CN114501945A (en) * | 2022-01-26 | 2022-05-13 | 华南理工大学 | Spraying liquid cooling phase change module for server, control method and manufacturing method thereof |
| WO2022198537A1 (en) * | 2021-03-25 | 2022-09-29 | Huawei Technologies Co., Ltd. | Jet impingement cooling device and method of manufacturing the same |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101048A1 (en) * | 2012-12-27 | 2014-07-03 | Feng Jin | High-efficiency heat dissipation device |
| CN104111711A (en) * | 2013-04-19 | 2014-10-22 | 微曜科技股份有限公司 | phase change heat dissipation system |
| CN104677158A (en) * | 2014-12-16 | 2015-06-03 | 西北工业大学 | Forced cooling device based on latent heat exchanging |
| CN108445998B (en) * | 2018-02-28 | 2020-03-06 | 重庆补贴猫电子商务有限公司 | Cooling device for computer |
| CN108445998A (en) * | 2018-02-28 | 2018-08-24 | 重庆补贴猫电子商务有限公司 | Computer cooling device |
| CN110534487A (en) * | 2018-05-24 | 2019-12-03 | 大众汽车有限公司 | The motor vehicle of component and band member with the cooling power optimized through insertion element |
| CN110534487B (en) * | 2018-05-24 | 2023-12-29 | 大众汽车有限公司 | Component with optimized cooling power by means of an insert element and motor vehicle with a component |
| CN110220174A (en) * | 2019-06-15 | 2019-09-10 | 绵阳恒酷热技术有限公司 | A kind of phase transformation takes hot LED illumination System |
| CN111678071A (en) * | 2020-07-30 | 2020-09-18 | 浙江欧易新能源有限公司 | Dull and stereotyped lamp of low energy consumption LED of high light efficiency |
| CN112051912A (en) * | 2020-09-30 | 2020-12-08 | 兰洋(宁波)科技有限公司 | Single-phase immersed liquid heat exchange system and heat exchange method |
| WO2022198537A1 (en) * | 2021-03-25 | 2022-09-29 | Huawei Technologies Co., Ltd. | Jet impingement cooling device and method of manufacturing the same |
| CN114501945A (en) * | 2022-01-26 | 2022-05-13 | 华南理工大学 | Spraying liquid cooling phase change module for server, control method and manufacturing method thereof |
| CN114501945B (en) * | 2022-01-26 | 2022-10-25 | 华南理工大学 | Spraying liquid cooling phase change module for server, control method and manufacturing method thereof |
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Application publication date: 20110817 |