CN214751758U

CN214751758U - Atomizing phase change cooling system

Info

Publication number: CN214751758U
Application number: CN202023205841.6U
Authority: CN
Inventors: 方向阳; 徐德好
Original assignee: Nanjing Acme Thermal Energy Technology Co ltd
Current assignee: Nanjing Acme Thermal Energy Technology Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-11-16
Anticipated expiration: 2030-12-25

Abstract

The utility model discloses a spray type phase change cooling system, which comprises phase change cooling liquid, a micropump, a liquid collecting box, a condenser, a closed case, a spray plate and a server case; the micro pump, the liquid collecting tank and the condenser are all arranged in the closed case; the micro pump is arranged in the liquid collecting box, and phase-change cooling liquid is arranged in the liquid collecting box; the micropump is connected with the spraying plate through a liquid inlet pipeline and is used for pumping the phase-change cooling liquid in the liquid collecting box into the spraying plate cavity, and the spraying plate comprises an upper cover plate and a lower cover plate; the upper cover plate is matched with the lower cover plate, and a cavity structure of the spray plate is formed between the upper cover plate and the lower cover plate; the spraying plate is used as an upper cover structure of the server case and is fixed on the server case; a plurality of spray heads are arranged at the bottom of the spray plate; the upper side and the lower side of the side end of the bottom cover plate are respectively provided with a steam outlet and a liquid return port; and a condensation air outlet is arranged on the closed case, the condensation air outlet is connected with a condenser, and a liquid return port of the condenser is connected with the liquid collecting tank. The system adopts spray phase change cooling, and has high cooling efficiency.

Description

Atomizing phase change cooling system

Technical Field

The utility model belongs to large-scale data center cooling system field, especially an atomizing phase transition cooling system.

Background

With the development of the internet era, data centers are unprecedentedly prosperous as hardware facilities for supporting the internet industry. The global data center market scale is getting bigger and bigger, and the construction of the data center is developing towards large-scale and centralization, which brings serious heat dissipation problem. The data center with high Power consumption and intensive electronic devices has high Power consumption, how to improve the heat dissipation efficiency of the data center, solve the heat dissipation problem, and simultaneously, reducing the heat dissipation energy consumption of the data center, namely reducing the PUE value (ratio of the total energy consumption of the data center to the energy consumption of IT equipment) is the key of the data center cooling research.

The cooling technologies adopted in the data center at present mainly include an air cooling technology, a liquid (oil) cooling technology, a heat pipe cooling technology, and the like. The air cooling technology has heat dissipation dead angles and local turbulent flow, and the local temperature is increased rapidly due to poor local heat dissipation effect; the liquid (oil) cooling technology is through direct contact cooling, and patent numbers CN106659092A and CN108563305A respectively propose a liquid cooling spraying cabinet and a liquid cooling spraying system thereof, which are a spraying type liquid cooling server, and the heat dissipation capability of the spraying type liquid cooling server is superior to that of the traditional air conditioner cooling technology, but the heat exchange is carried out by sensible heat, and the improvement of the heat transfer capability is limited. Although the cooling efficiency of the heat pipe cooling technology is high, the cooling efficiency is limited by the condition of working temperature difference, and when the ambient temperature outside a machine room is too high, the cooling efficiency is sharply reduced. The immersion cooling is to immerse the heating electronic device in the insulating cooling liquid, and take away heat by utilizing the evaporation phase change of the cooling liquid, so that the heat transfer efficiency is high, but the immersion cooling needs a large amount of insulating liquid to immerse the working heating device, and the cost is high because the price of the insulating cooling working medium is high, so that the key for restricting the large-scale use of the immersion cooling is the key.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a spray phase change cooling system adopts direct contact's spraying phase change cooling, through vaporific liquid drop and electronic device surface direct contact, takes away the heat through atomizing liquid drop phase change latent heat, and shower nozzle quantity, position and flow are according to electronic device's position and heat flux density are freely defined, have realized high cooling efficiency, and the integrated level is high, reduces the energy consumption, reduces the noise; and spray phase change cooling is adopted, so that the problem of high cost of immersion cooling is solved.

Realize the utility model discloses the technical solution of purpose does:

a spray type phase change cooling system comprises phase change cooling liquid, a micro pump, a liquid collecting tank, a condenser, a closed case, a spray plate and a server case;

the micro pump, the liquid collecting tank and the condenser are all arranged in the closed case; the micro pump is arranged in the liquid collecting box, and phase-change cooling liquid is arranged in the liquid collecting box; the micropump is connected with the spray plate through a liquid inlet pipeline and is used for pumping the phase-change cooling liquid in the liquid collecting box into the cavity of the spray plate; the spraying plate comprises an upper cover plate and a lower cover plate; the upper cover plate is matched with the lower cover plate, and a cavity structure of the spray plate is formed between the upper cover plate and the lower cover plate; the spraying plate is used as an upper cover structure of the server case and is fixed on the server case; the bottom of the spray plate is provided with a plurality of spray heads, and the phase-change cooling liquid sprays vaporous cooling liquid through the spray heads to the surface of the electronic device for cooling; the upper side and the lower side of the side end of the bottom cover plate are respectively provided with a steam outlet and a liquid return port; and a condensation air outlet is arranged on the closed case, the condensation air outlet is connected with a condenser, and a liquid return port of the condenser is connected with the liquid collecting tank.

Compared with the prior art, the utility model, it is showing the advantage and is:

(1) the utility model adopts spray cooling, through the direct contact of the vaporific liquid drop and the surface of the electronic device, the latent heat of phase change of the vaporific liquid drop is taken away the heat, thereby realizing high cooling efficiency and low energy consumption; the spraying form is adopted, and the problem of large spraying or air cooling noise is solved.

(2) The utility model discloses an atomising head is integrated in the server upper cover plate, and the spray cooling board uses as server upper cover plate function, and the integrated level is high, practices thrift the space, can replace so the upper cover plate of service in actual use realizes spray cooling. The assembly is simple, the cost is low, and the popularization is easy.

(3) The number of the spray heads and the spray flow are controlled according to the arrangement number of the positions of the heating devices in the server and the heat consumption of the heating devices, the problem of local overheating caused by high heat consumption of part of the electronic devices is solved, and the problem of high cost caused by the fact that a large amount of working media are needed to immerse the electronic devices is solved by adopting spray phase change cooling.

Drawings

FIG. 1 is a schematic diagram of a spray phase change cooling system.

Fig. 2 is a schematic diagram of a spray phase change cold plate and the server chassis.

Fig. 3 is a schematic diagram of the structure of the spray head and a sectional view of the structure of the spray head of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments.

Combine fig. 1, fig. 2, the utility model discloses an atomizing phase transition cooling system, including phase transition coolant liquid 1, micropump 2, collection liquid case 3, electronic expansion valve 4, condenser 5, airtight quick-witted case 6, spraying board 7, server machine case 8.

The micropump 2, the liquid collecting tank 3, the electronic expansion valve 4 and the condenser 5 are all arranged in the closed case 6; the micropump 2 is arranged in the liquid collecting tank 3, and the phase-change cooling liquid 1 is arranged in the liquid collecting tank 3; the micropump 2 is connected with the spray plate 7 through a liquid inlet pipeline and is used for pumping the phase-change cooling liquid in the liquid collecting tank 3 into the cavity of the spray plate 7; the spraying plate 7 comprises an upper cover plate 75 and a lower cover plate 71; the upper cover plate 75 is matched with the lower cover plate 71, and a cavity structure of the spray plate 7 is formed between the upper cover plate and the lower cover plate; the spraying plate 7 is used as an upper cover structure of the server case 8 and is fixed on the server case 8; the spray nozzle 72 and the lower cover plate 71 are integrated, and the conical guide mechanism of the spray nozzle 72 and the upper cover plate 75 are integrated. The bottom of the spray plate 71 is provided with a plurality of spray nozzles 72, and the phase-change cooling liquid 1 sprays mist cooling liquid through the spray nozzles 72 to the surface of the electronic device 83 for cooling. The upper side and the lower side of the side end of the bottom cover plate are respectively provided with a steam outlet 82 and a liquid return port 81, the closed case 6 is provided with a condensation air outlet, the condensation air outlet is connected with the condenser 5, and the liquid return port of the condenser 5 is connected with the liquid collecting tank 3; when electron device 83 surface temperature does not reach the cooling boiling point, passes through along with the accumulation back of a large amount of coolant liquid return port 81 discharges and gets into collection liquid case 3, works as electron device 83 surface temperature reaches the vaporization of cooling boiling point, and gaseous state coolant liquid is discharged airtight quick-witted case 6 from steam outlet 82, then gets into through condensation air inlet on airtight quick-witted case 6 under the effect of pressure condensing equipment 5, and the liquid coolant liquid after the condensation gets into under the action of gravity collection liquid case 3, does not take place in time at the place that does not have the heat loss simultaneously phase transition coolant liquid and also passes through return port 81 discharges and gets into collection liquid case 3 to the completion system is in proper order.

The spraying plate 7 is provided with a liquid inlet 73, a liquid inlet pipeline flows into the spraying plate 7 through the liquid inlet 73, the spraying nozzle 72 is integrated on the spraying plate 7, the phase-change cooling liquid is atomized into small liquid drops through a nozzle and is impacted on the surface of a device to be cooled to form a liquid film, the liquid film exchanges heat with the surface of the device, the liquid film is evaporated and absorbed to form steam, and then the high-efficiency heat transfer is realized by a method of discharging heat through condensation and heat release; in order to ensure that the flow rate of each spray nozzle 72 is consistent, the flow speed in the spray plate 7 is controlled to be below 0.5m/s, and meanwhile, a plurality of support pillars 74 are arranged in the spray plate 7 to enable the internal cooling liquid to uniformly flow into the cavity of the spray plate 7, it should be understood that the low-speed flow in the spray plate 7 and the support pillars 74 both ensure that the flow rates of different nozzle outlets are consistent, and meanwhile, the support pillars 74 can strengthen the strength of the spray plate 7 to avoid deformation of a cover plate caused by overhigh internal pressure of the cavity, and when the whole system is stable, the spray plate 7 should be in a constant-pressure and constant-flow state.

In order to eliminate accumulated phase change cooling after insufficient phase change occurs, so that a liquid film is not formed on the surface of the device, and the phase change effect is reduced, the spraying plate 7 and the electronic device (printed board) 8 are arranged at a lower position of the server in parallel and are arranged at a certain angle with the closed case 6, and when the cooling liquid accumulated due to the non-occurrence of phase change can be discharged by utilizing the inclination, the installation angle of the server and the closed case 6 is preferably 5-20 degrees.

Preferably, in order to solve the different heat generation power consumption of the electronic device 83, the electronic expansion valve 4 is arranged in the liquid inlet pipeline, the change of the heat consumption of the electronic device 83 is solved by controlling the flow rate of the spray, and the electronic expansion valve 4 feeds back by a temperature sensor of a heat consumption surface, but is not limited to the above.

In order to solve the problem of uneven heat dissipation distribution of the electronic device 83, it is preferable to adjust the heights of the spray plate 7 and the electronic device 83 and arrange a plurality of spray heads at a place with high heat flux density to release the problem, and the spray heads 72 spray a circular area, the size of the circular area is related to the outlet angle and height of the spray heads 72, and the height of the spray heads 72 from the heat source of the electronic device 83 is 5-30 mm. The diameter size of the spray holes 722 of the spray head 72 is 0.2-1 mm, and it is understood that the diameter of the spray holes 722 directly determines the diameter size of the atomized particles; the lower end of the upper cover plate 75 is provided with a guide structure 721 corresponding to the spray holes 722 of the spray head 72, the distance between the conical guide structure 721 and the spray holes 722 is 0.1mm, the conical guide structure 721 and the spray head cone angle 723 determine the outlet angle of the spray head, and the above parameters are preferably, but not limited to, 90 degrees to 120 degrees.

Preferably, the cooling fluid is an insulating phase-change cooling fluid, including but not limited to a fluorinated fluid.

The condensing device 5 is located above the spray phase change cooling plate device, and can dissipate heat by using fin air cooling, but not limited to this way, and the phase change cooling liquid 1 returns to the liquid collecting tank 3 by gravity.

Claims

1. A spray type phase-change cooling system is characterized by comprising phase-change cooling liquid (1), a micro pump (2), a liquid collecting tank (3), a condenser (5), a closed case (6), a spray plate (7) and a server case (8);

the micropump (2), the liquid collecting tank (3) and the condenser (5) are all arranged in the closed case (6); the micropump (2) is arranged in the liquid collecting box (3), and the phase-change cooling liquid (1) is arranged in the liquid collecting box (3); the micropump (2) is connected with the spraying plate (7) through a liquid inlet pipeline and is used for pumping the phase-change cooling liquid in the liquid collecting box (3) into the cavity of the spraying plate (7); the spraying plate (7) comprises an upper cover plate (75) and a lower cover plate (71); the upper cover plate (75) is matched with the lower cover plate (71), and a cavity structure of the spray plate (7) is formed between the upper cover plate and the lower cover plate; the spraying plate (7) is used as an upper cover structure of the server case (8) and is fixed on the server case (8); a plurality of spray heads (72) are arranged at the bottom of the spray plate (7), and the phase-change cooling liquid (1) sprays mist cooling liquid to the surface of the electronic device (83) through the spray heads (72) for cooling; the upper side and the lower side of the side end of the lower cover plate are respectively provided with a steam outlet (82) and a liquid return port (81); and a condensation air outlet is arranged on the closed case (6), the condensation air outlet is connected with the condenser (5), and a liquid return port of the condenser (5) is connected with the liquid collecting tank (3).

2. The aerosol phase change cooling system of claim 1, wherein the spray nozzle (72) and the lower cover plate (71) are integrated.

3. The spray phase change cooling system of claim 1, characterized in that a plurality of support posts (74) are provided within the spray plate (7).

4. The spray phase change cooling system of claim 1, wherein said spray plate (7) and said electronics (83) are parallel and are mounted at a slant to said enclosed cabinet (6).

5. The spray phase change cooling system of claim 4 wherein the slope is from 5 ° to 20 °.

6. Spray phase change cooling system according to claim 1, characterized in that the liquid feed line is provided with an electronic expansion valve (4).

7. The spray phase change cooling system of claim 1, wherein the height of the spray head (72) from the heat source of the electronic device (83) is 5-30 mm.

8. The spray phase change cooling system of claim 1, wherein the spray orifice of the spray head (72) has a diameter size of 0.2 to 1 mm.

9. The spray phase change cooling system of claim 1, wherein the lower end of the upper cover plate (75) is provided with a guide structure (721) corresponding to the spray holes of the spray head (72), and the distance between the guide structure (721) and the mist is 0.1 mm.