USD754084S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD754084S1
USD754084S1 US29/472,087 US201329472087F USD754084S US D754084 S1 USD754084 S1 US D754084S1 US 201329472087 F US201329472087 F US 201329472087F US D754084 S USD754084 S US D754084S
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US
United States
Prior art keywords
semiconductor device
elevational view
right
shown
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/472,087
Inventor
Tatsuya Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013-019030 priority Critical
Priority to JP2013-019057 priority
Priority to JP2013019056 priority
Priority to JP2013019030 priority
Priority to JP2013019057 priority
Priority to JP2013-019056 priority
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWASE, TATSUYA
Application granted granted Critical
Publication of USD754084S1 publication Critical patent/USD754084S1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top, right and rear side perspective view of a semiconductor device, showing my new design;

FIG. 2 is a front, right and bottom side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is another top, right, and rear side perspective view thereof, shown in a used condition; and,

FIG. 10 is another rear elevational view thereof, shown in a used condition.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/472,087 2013-08-21 2013-11-08 Semiconductor device Active USD754084S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013019056 2013-08-21
JP2013019030 2013-08-21
JP2013019057 2013-08-21
JP2013-019056 2013-08-21
JP2013-019030 2013-08-21
JP2013-019057 2013-08-21

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/555,470 USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

Related Child Applications (1)

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US29/555,470 Division USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device

Publications (1)

Publication Number Publication Date
USD754084S1 true USD754084S1 (en) 2016-04-19

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US29/472,087 Active USD754084S1 (en) 2013-08-21 2013-11-08 Semiconductor device
US29/555,470 Active USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 Active USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

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US29/555,470 Active USD785577S1 (en) 2013-08-21 2016-02-22 Semiconductor device
US29/591,886 Active USD805485S1 (en) 2013-08-21 2017-01-25 Semiconductor device

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US (3) USD754084S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module

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USD742581S1 (en) * 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
CN104619117A (en) * 2015-02-20 2015-05-13 王镇山 Magnetic combined structure between circuit boards
JP1577498S (en) * 2016-09-30 2017-05-29
JP1584883S (en) * 2017-01-31 2017-08-28
JP1584651S (en) * 2017-01-31 2017-08-28

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USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device

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US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD803663S1 (en) 2014-11-20 2017-11-28 Green Inova Lighting Technology Limited Bracket
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module

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Publication number Publication date
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USD805485S1 (en) 2017-12-19

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