USD883241S1 - Power module - Google Patents

Power module Download PDF

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Publication number
USD883241S1
USD883241S1 US29/671,493 US201829671493F USD883241S US D883241 S1 USD883241 S1 US D883241S1 US 201829671493 F US201829671493 F US 201829671493F US D883241 S USD883241 S US D883241S
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US
United States
Prior art keywords
power module
ornamental
module
power
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/671,493
Inventor
Peter Beckedahl
Juergen Steger
Ingo Bogen
Sandro Bulovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE402018100539 priority Critical
Priority to DE402018100539 priority
Application filed by Semikron Elektronik GmbH and Co KG filed Critical Semikron Elektronik GmbH and Co KG
Assigned to SEMIKRON ELEKTRONIK GMBH & CO. KG reassignment SEMIKRON ELEKTRONIK GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STEGER, JUERGEN, BECKEDAHL, PETER, BOGEN, INGO, Bulovic, Sandro
Application granted granted Critical
Publication of USD883241S1 publication Critical patent/USD883241S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front top perspective view of a power module.

FIG. 2 is a right side view thereof.

FIG. 3 is a left side view thereof.

FIG. 4 is a front view thereof.

FIG. 5 is a rear view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines in the drawing show portions of power module that do not form a part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power module, as shown and described.
US29/671,493 2018-06-04 2018-11-28 Power module Active USD883241S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE402018100539 2018-06-04
DE402018100539 2018-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/728,407 USD892754S1 (en) 2018-06-04 2020-03-18 Power module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/728,407 Division USD892754S1 (en) 2018-06-04 2020-03-18 Power module

Publications (1)

Publication Number Publication Date
USD883241S1 true USD883241S1 (en) 2020-05-05

Family

ID=66097812

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/671,493 Active USD883241S1 (en) 2018-06-04 2018-11-28 Power module
US29/728,407 Active USD892754S1 (en) 2018-06-04 2020-03-18 Power module

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/728,407 Active USD892754S1 (en) 2018-06-04 2020-03-18 Power module

Country Status (2)

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US (2) USD883241S1 (en)
JP (3) JP1629563S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130134572A1 (en) * 2011-09-12 2013-05-30 Infineon Technologies Ag Semiconductor device including cladded base plate
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20150223339A1 (en) * 2012-10-15 2015-08-06 Fuji Electric Co., Ltd. Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
US10090774B1 (en) * 2017-05-05 2018-10-02 Semikron Elektronik Gmbh & Co. Kg Power electronic arrangement with DC voltage connection element
US10163761B2 (en) * 2014-05-15 2018-12-25 Semikron Elektronik Gmbh & Co., Kg Power semiconductor arrangement
US10270358B2 (en) * 2017-07-14 2019-04-23 Semikron Elektronik Gmbh & Co. Kg Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130134572A1 (en) * 2011-09-12 2013-05-30 Infineon Technologies Ag Semiconductor device including cladded base plate
US20140376184A1 (en) * 2012-04-16 2014-12-25 Fuji Electric Co. Ltd. Semiconductor device and cooler thereof
US20150223339A1 (en) * 2012-10-15 2015-08-06 Fuji Electric Co., Ltd. Semiconductor device
US20140168900A1 (en) * 2012-12-14 2014-06-19 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
US10163761B2 (en) * 2014-05-15 2018-12-25 Semikron Elektronik Gmbh & Co., Kg Power semiconductor arrangement
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US20160276927A1 (en) * 2015-03-16 2016-09-22 Cree, Inc. High speed, efficient sic power module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
US10090774B1 (en) * 2017-05-05 2018-10-02 Semikron Elektronik Gmbh & Co. Kg Power electronic arrangement with DC voltage connection element
US10270358B2 (en) * 2017-07-14 2019-04-23 Semikron Elektronik Gmbh & Co. Kg Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module

Also Published As

Publication number Publication date
JP1629563S (en) 2019-04-15
JP1629564S (en) 2019-04-15
USD892754S1 (en) 2020-08-11
JP1629565S (en) 2019-04-15

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