USD864882S1 - Part for semiconductor device - Google Patents

Part for semiconductor device Download PDF

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Publication number
USD864882S1
USD864882S1 US29/641,834 US201829641834F USD864882S US D864882 S1 USD864882 S1 US D864882S1 US 201829641834 F US201829641834 F US 201829641834F US D864882 S USD864882 S US D864882S
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United States
Prior art keywords
semiconductor device
view
sectional
taken along
along line
Prior art date
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Active
Application number
US29/641,834
Inventor
Takeshi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Assigned to HAMAMATSU PHOTONICS K.K. reassignment HAMAMATSU PHOTONICS K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKAMOTO, TAKESHI
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Publication of USD864882S1 publication Critical patent/USD864882S1/en
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FIG. 1 is a front view of a part for semiconductor device showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is an enlarged cross-sectional view taken along line 8-8 in FIG. 1;
FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 1;
FIG. 10 is an enlarged cross-sectional view taken along line 10-10 in FIG. 1;
FIG. 11 is an enlarged cross-sectional view of a portion labeled 11′-11′ in FIG. 1 and a portion labeled 11″-11″ in FIG. 5 taken along line 11-11 in FIG. 1; and,
FIG. 12 is an enlarged cross-sectional view of a portion labeled 12′-12′ in FIG. 1 and a portion labeled 12″-12″ in FIG. 5 taken along line 12-12 in FIG. 1.
The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a part for semiconductor device, as shown and described.
US29/641,834 2017-09-27 2018-03-26 Part for semiconductor device Active USD864882S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-021146 2017-09-27
JPD2017-21146F JP1603911S (en) 2017-09-27 2017-09-27

Publications (1)

Publication Number Publication Date
USD864882S1 true USD864882S1 (en) 2019-10-29

Family

ID=62104959

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/641,834 Active USD864882S1 (en) 2017-09-27 2018-03-26 Part for semiconductor device

Country Status (3)

Country Link
US (1) USD864882S1 (en)
JP (1) JP1603911S (en)
TW (1) TWD195586S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

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USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Patent Citations (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD432095S (en) * 1998-10-09 2000-10-17 Vishay Semiconductor Gmbh Light-emitting semi-conductor component
TW452191U (en) 1999-05-06 2001-08-21 Advanced Semiconductor Eng Semiconductor adhesive-film adhering platen with a positioning structure
TW404562U (en) 1999-05-06 2000-09-01 Advanced Semiconductor Eng Semiconductor glue film application platform with positioning structure
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
TW510503U (en) 1999-11-25 2002-11-11 Chipmos Technolgies Inc Distributing structure of wafer's testing pad and burning pad
TW446183U (en) 1999-11-25 2001-07-11 Chipmos Technologies Inc Wafer surface structure
TW491359U (en) 1999-11-25 2002-06-11 Chipmos Technologies Inc Connection distribution structure for etching pad mesh set of wafer
TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
TW443580U (en) 1999-11-25 2001-06-23 Chipmos Technologies Inc Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW461582U (en) 2000-11-07 2001-10-21 Chipmos Technologies Inc Laser repair and real-time detection device
TW529771U (en) 2001-11-28 2003-04-21 Advanced Semiconductor Eng Flip chip semiconductor device with solder balls
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
TW556957U (en) 2002-08-13 2003-10-01 Advanced Semiconductor Eng Semiconductor wafer and semiconductor device
TWM293525U (en) 2004-06-29 2006-07-01 Sino American Silicon Products Silicon wafer structure for power electronic device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
TWM352128U (en) 2008-10-08 2009-03-01 Int Semiconductor Tech Ltd Semiconductor structure having silver bump
TWM379066U (en) 2009-12-18 2010-04-21 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe card
TWM386593U (en) 2010-03-29 2010-08-11 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
TWM478909U (en) 2012-11-20 2014-05-21 Kun-Chieh Chang Composite array micro-lenses of LED chips
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
TWM482158U (en) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd Apparatus for mounting semiconductor dies
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device

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TWD195586S (en) 2019-01-21
JP1603911S (en) 2018-05-14

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