TW529771U - Flip chip semiconductor device with solder balls - Google Patents

Flip chip semiconductor device with solder balls

Info

Publication number
TW529771U
TW529771U TW90220902U TW90220902U TW529771U TW 529771 U TW529771 U TW 529771U TW 90220902 U TW90220902 U TW 90220902U TW 90220902 U TW90220902 U TW 90220902U TW 529771 U TW529771 U TW 529771U
Authority
TW
Taiwan
Prior art keywords
semiconductor device
solder balls
flip chip
chip semiconductor
flip
Prior art date
Application number
TW90220902U
Other languages
Chinese (zh)
Inventor
Chia-Hung Cheng
Jen-Kuang Fang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW90220902U priority Critical patent/TW529771U/en
Publication of TW529771U publication Critical patent/TW529771U/en

Links

TW90220902U 2001-11-28 2001-11-28 Flip chip semiconductor device with solder balls TW529771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90220902U TW529771U (en) 2001-11-28 2001-11-28 Flip chip semiconductor device with solder balls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90220902U TW529771U (en) 2001-11-28 2001-11-28 Flip chip semiconductor device with solder balls

Publications (1)

Publication Number Publication Date
TW529771U true TW529771U (en) 2003-04-21

Family

ID=28451137

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90220902U TW529771U (en) 2001-11-28 2001-11-28 Flip chip semiconductor device with solder balls

Country Status (1)

Country Link
TW (1) TW529771U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165481B (en) * 2011-12-13 2015-07-15 颀邦科技股份有限公司 Bump manufacture technology and structure thereof
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
CN113629165A (en) * 2020-05-07 2021-11-09 中芯国际集成电路制造(上海)有限公司 Semiconductor structure and forming method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165481B (en) * 2011-12-13 2015-07-15 颀邦科技股份有限公司 Bump manufacture technology and structure thereof
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
CN113629165A (en) * 2020-05-07 2021-11-09 中芯国际集成电路制造(上海)有限公司 Semiconductor structure and forming method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model