TW529771U - Flip chip semiconductor device with solder balls - Google Patents
Flip chip semiconductor device with solder ballsInfo
- Publication number
- TW529771U TW529771U TW90220902U TW90220902U TW529771U TW 529771 U TW529771 U TW 529771U TW 90220902 U TW90220902 U TW 90220902U TW 90220902 U TW90220902 U TW 90220902U TW 529771 U TW529771 U TW 529771U
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- solder balls
- flip chip
- chip semiconductor
- flip
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90220902U TW529771U (en) | 2001-11-28 | 2001-11-28 | Flip chip semiconductor device with solder balls |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90220902U TW529771U (en) | 2001-11-28 | 2001-11-28 | Flip chip semiconductor device with solder balls |
Publications (1)
Publication Number | Publication Date |
---|---|
TW529771U true TW529771U (en) | 2003-04-21 |
Family
ID=28451137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90220902U TW529771U (en) | 2001-11-28 | 2001-11-28 | Flip chip semiconductor device with solder balls |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW529771U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165481B (en) * | 2011-12-13 | 2015-07-15 | 颀邦科技股份有限公司 | Bump manufacture technology and structure thereof |
TWD195624S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195587S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195586S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
CN113629165A (en) * | 2020-05-07 | 2021-11-09 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
-
2001
- 2001-11-28 TW TW90220902U patent/TW529771U/en not_active IP Right Cessation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165481B (en) * | 2011-12-13 | 2015-07-15 | 颀邦科技股份有限公司 | Bump manufacture technology and structure thereof |
TWD195624S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195587S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195586S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
USD864883S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864882S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
CN113629165A (en) * | 2020-05-07 | 2021-11-09 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |