USD864883S1 - Part for semiconductor device - Google Patents
Part for semiconductor device Download PDFInfo
- Publication number
- USD864883S1 USD864883S1 US29/641,840 US201829641840F USD864883S US D864883 S1 USD864883 S1 US D864883S1 US 201829641840 F US201829641840 F US 201829641840F US D864883 S USD864883 S US D864883S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- sectional
- taken along
- along line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.
Claims (1)
- The ornamental design for a part for semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-021144 | 2017-09-27 | ||
JPD2017-21144F JP1604002S (en) | 2017-09-27 | 2017-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD864883S1 true USD864883S1 (en) | 2019-10-29 |
Family
ID=62104990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/641,840 Active USD864883S1 (en) | 2017-09-27 | 2018-03-26 | Part for semiconductor device |
Country Status (3)
Country | Link |
---|---|
US (1) | USD864883S1 (en) |
JP (1) | JP1604002S (en) |
TW (1) | TWD195624S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
Citations (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD395423S (en) * | 1997-03-13 | 1998-06-23 | Sony Corporation | Semiconductor package |
USD395638S (en) * | 1997-01-30 | 1998-06-30 | Sony Corporation | Semiconductor package |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
TW404562U (en) | 1999-05-06 | 2000-09-01 | Advanced Semiconductor Eng | Semiconductor glue film application platform with positioning structure |
USD432095S (en) * | 1998-10-09 | 2000-10-17 | Vishay Semiconductor Gmbh | Light-emitting semi-conductor component |
TW443580U (en) | 1999-11-25 | 2001-06-23 | Chipmos Technologies Inc | Distribution structure of net-shaped connecting wire for the scorching pad of wafer |
TW446183U (en) | 1999-11-25 | 2001-07-11 | Chipmos Technologies Inc | Wafer surface structure |
TW452191U (en) | 1999-05-06 | 2001-08-21 | Advanced Semiconductor Eng | Semiconductor adhesive-film adhering platen with a positioning structure |
TW461582U (en) | 2000-11-07 | 2001-10-21 | Chipmos Technologies Inc | Laser repair and real-time detection device |
TW491359U (en) | 1999-11-25 | 2002-06-11 | Chipmos Technologies Inc | Connection distribution structure for etching pad mesh set of wafer |
TW495035U (en) | 1999-11-25 | 2002-07-11 | Chipmos Technologies Inc | Distribution structure of test pad network connection of wafer |
TW510503U (en) | 1999-11-25 | 2002-11-11 | Chipmos Technolgies Inc | Distributing structure of wafer's testing pad and burning pad |
TW529771U (en) | 2001-11-28 | 2003-04-21 | Advanced Semiconductor Eng | Flip chip semiconductor device with solder balls |
USD476959S1 (en) * | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
TW556957U (en) | 2002-08-13 | 2003-10-01 | Advanced Semiconductor Eng | Semiconductor wafer and semiconductor device |
TWM293525U (en) | 2004-06-29 | 2006-07-01 | Sino American Silicon Products | Silicon wafer structure for power electronic device |
TWM352128U (en) | 2008-10-08 | 2009-03-01 | Int Semiconductor Tech Ltd | Semiconductor structure having silver bump |
USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD589012S1 (en) * | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
TWM379066U (en) | 2009-12-18 | 2010-04-21 | Quality Pro Technology Co Ltd | Improved structure of semiconductor wafer probe card |
TWM386593U (en) | 2010-03-29 | 2010-08-11 | Quality Pro Technology Co Ltd | Improved structure of semiconductor wafer probe |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
TWM478909U (en) | 2012-11-20 | 2014-05-21 | Kun-Chieh Chang | Composite array micro-lenses of LED chips |
TWM482158U (en) | 2013-08-29 | 2014-07-11 | Gallant Micro Machining Co Ltd | Apparatus for mounting semiconductor dies |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
USD727861S1 (en) * | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
-
2017
- 2017-09-27 JP JPD2017-21144F patent/JP1604002S/ja active Active
-
2018
- 2018-03-26 US US29/641,840 patent/USD864883S1/en active Active
- 2018-03-27 TW TW107301729D01F patent/TWD195624S/en unknown
Patent Citations (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD395638S (en) * | 1997-01-30 | 1998-06-30 | Sony Corporation | Semiconductor package |
USD395423S (en) * | 1997-03-13 | 1998-06-23 | Sony Corporation | Semiconductor package |
USD432095S (en) * | 1998-10-09 | 2000-10-17 | Vishay Semiconductor Gmbh | Light-emitting semi-conductor component |
TW452191U (en) | 1999-05-06 | 2001-08-21 | Advanced Semiconductor Eng | Semiconductor adhesive-film adhering platen with a positioning structure |
TW404562U (en) | 1999-05-06 | 2000-09-01 | Advanced Semiconductor Eng | Semiconductor glue film application platform with positioning structure |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
TW510503U (en) | 1999-11-25 | 2002-11-11 | Chipmos Technolgies Inc | Distributing structure of wafer's testing pad and burning pad |
TW446183U (en) | 1999-11-25 | 2001-07-11 | Chipmos Technologies Inc | Wafer surface structure |
TW491359U (en) | 1999-11-25 | 2002-06-11 | Chipmos Technologies Inc | Connection distribution structure for etching pad mesh set of wafer |
TW495035U (en) | 1999-11-25 | 2002-07-11 | Chipmos Technologies Inc | Distribution structure of test pad network connection of wafer |
TW443580U (en) | 1999-11-25 | 2001-06-23 | Chipmos Technologies Inc | Distribution structure of net-shaped connecting wire for the scorching pad of wafer |
TW461582U (en) | 2000-11-07 | 2001-10-21 | Chipmos Technologies Inc | Laser repair and real-time detection device |
TW529771U (en) | 2001-11-28 | 2003-04-21 | Advanced Semiconductor Eng | Flip chip semiconductor device with solder balls |
USD476959S1 (en) * | 2002-07-31 | 2003-07-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
TW556957U (en) | 2002-08-13 | 2003-10-01 | Advanced Semiconductor Eng | Semiconductor wafer and semiconductor device |
TWM293525U (en) | 2004-06-29 | 2006-07-01 | Sino American Silicon Products | Silicon wafer structure for power electronic device |
USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD589012S1 (en) * | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
TWM352128U (en) | 2008-10-08 | 2009-03-01 | Int Semiconductor Tech Ltd | Semiconductor structure having silver bump |
TWM379066U (en) | 2009-12-18 | 2010-04-21 | Quality Pro Technology Co Ltd | Improved structure of semiconductor wafer probe card |
TWM386593U (en) | 2010-03-29 | 2010-08-11 | Quality Pro Technology Co Ltd | Improved structure of semiconductor wafer probe |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
TWM478909U (en) | 2012-11-20 | 2014-05-21 | Kun-Chieh Chang | Composite array micro-lenses of LED chips |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
USD785577S1 (en) * | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD727861S1 (en) * | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
TWM482158U (en) | 2013-08-29 | 2014-07-11 | Gallant Micro Machining Co Ltd | Apparatus for mounting semiconductor dies |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
USD773413S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
USD773412S1 (en) * | 2015-02-04 | 2016-12-06 | Mitsubishi Electric Corporation | Semiconductor device |
USD767516S1 (en) * | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937233S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWD195624S (en) | 2019-01-21 |
JP1604002S (en) | 2018-05-14 |
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Legal Events
Date | Code | Title | Description |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |