USD316848S - Mounting substrate for semiconductors - Google Patents

Mounting substrate for semiconductors Download PDF

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Publication number
USD316848S
USD316848S US07/140,434 US14043488F USD316848S US D316848 S USD316848 S US D316848S US 14043488 F US14043488 F US 14043488F US D316848 S USD316848 S US D316848S
Authority
US
United States
Prior art keywords
mounting substrate
semiconductors
semi
conductors
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/140,434
Inventor
Terutomi Hasegawa
Nobumichi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Terutomi Hasegawa
Nobumichi Goto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Terutomi Hasegawa, Nobumichi Goto filed Critical Terutomi Hasegawa
Application granted granted Critical
Publication of USD316848S publication Critical patent/USD316848S/en
Assigned to IBIDEN CO., LTD. reassignment IBIDEN CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: GOTO, NOBUMICHI, HASEGAWA, TERUTOMI
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top perspective view of a mounting substrate for semi-conductors showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.

Claims (1)

  1. The ornamental design for a mounting substrate for semi-conductors, as shown.
US07/140,434 1987-07-04 1988-01-04 Mounting substrate for semiconductors Expired - Lifetime USD316848S (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62-27280 1987-02-10
JP62-27276 1987-07-04
JP2728087 1987-07-04
JP2727687 1987-07-04

Publications (1)

Publication Number Publication Date
USD316848S true USD316848S (en) 1991-05-14

Family

ID=70292532

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/140,434 Expired - Lifetime USD316848S (en) 1987-07-04 1988-01-04 Mounting substrate for semiconductors

Country Status (1)

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US (1) USD316848S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
CMOS Chip pictured on p. 131, Electronics, 8-7-86.
Disc Controller pictured on p. 190, Electronic Design, 10-16-86.
Electronics, p. 7, Feb. 24, 1986 by Fijitsu Microelectronics, Inc.
NCR IC Package pictured on p. 7, Electronic Design, 10-16-86.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem

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