JP1632999S - - Google Patents

Info

Publication number
JP1632999S
JP1632999S JPD2018-12838F JP2018012838F JP1632999S JP 1632999 S JP1632999 S JP 1632999S JP 2018012838 F JP2018012838 F JP 2018012838F JP 1632999 S JP1632999 S JP 1632999S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-12838F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-12838F priority Critical patent/JP1632999S/ja
Priority to US29/672,087 priority patent/USD902877S1/en
Application granted granted Critical
Publication of JP1632999S publication Critical patent/JP1632999S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-12838F 2018-06-12 2018-06-12 Active JP1632999S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2018-12838F JP1632999S (ja) 2018-06-12 2018-06-12
US29/672,087 USD902877S1 (en) 2018-06-12 2018-12-03 Packaged semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-12838F JP1632999S (ja) 2018-06-12 2018-06-12

Publications (1)

Publication Number Publication Date
JP1632999S true JP1632999S (ja) 2019-06-03

Family

ID=66671668

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-12838F Active JP1632999S (ja) 2018-06-12 2018-06-12

Country Status (2)

Country Link
US (1) USD902877S1 (ja)
JP (1) JP1632999S (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1009818S1 (en) 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1646470S (ja) * 2019-05-14 2019-11-25
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD937231S1 (en) 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1711706S (ja) * 2021-07-29 2022-04-04

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3255055A (en) * 1963-03-20 1966-06-07 Hoffman Electronics Corp Semiconductor device
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5119269A (en) * 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
JP2522186B2 (ja) * 1993-10-15 1996-08-07 日本電気株式会社 半導体パッケ―ジ
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
KR100218368B1 (ko) * 1997-04-18 1999-09-01 구본준 리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
JP2003077939A (ja) * 2001-09-05 2003-03-14 Mitsubishi Electric Corp 半導体装置およびその製造方法
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1009818S1 (en) 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
USD902877S1 (en) 2020-11-24

Similar Documents

Publication Publication Date Title
BR112021012222A2 (ja)
BR122022006221A2 (ja)
BR122022015534A2 (ja)
BR112021008873A2 (ja)
BR122022002075A2 (ja)
AT524834A2 (ja)
AT524874A5 (ja)
AU2018438767B1 (ja)
AT524961A5 (ja)
AT524266A2 (ja)
BR122022005529A2 (ja)
BR122022016585A2 (ja)
BR112020012832A2 (ja)
BR202018071071U8 (ja)
BR102018070765A2 (ja)
BR102018016915A2 (ja)
BE2018C025I2 (ja)
BR112020025288A2 (ja)
BR202018008879U2 (ja)
BR202018007669U2 (ja)
BR102018007062A2 (ja)
BR202018006247U2 (ja)
BR202018004136U2 (ja)
BR202018002487U2 (ja)
BR202018002069U2 (ja)