JP1646470S - - Google Patents

Info

Publication number
JP1646470S
JP1646470S JP2019010384F JP2019010384F JP1646470S JP 1646470 S JP1646470 S JP 1646470S JP 2019010384 F JP2019010384 F JP 2019010384F JP 2019010384 F JP2019010384 F JP 2019010384F JP 1646470 S JP1646470 S JP 1646470S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019010384F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2019010384F priority Critical patent/JP1646470S/ja
Priority to US29/707,990 priority patent/USD914621S1/en
Application granted granted Critical
Publication of JP1646470S publication Critical patent/JP1646470S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019010384F 2019-05-14 2019-05-14 Active JP1646470S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019010384F JP1646470S (ja) 2019-05-14 2019-05-14
US29/707,990 USD914621S1 (en) 2019-05-14 2019-10-02 Packaged semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019010384F JP1646470S (ja) 2019-05-14 2019-05-14

Publications (1)

Publication Number Publication Date
JP1646470S true JP1646470S (ja) 2019-11-25

Family

ID=68610542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019010384F Active JP1646470S (ja) 2019-05-14 2019-05-14

Country Status (2)

Country Link
US (1) USD914621S1 (ja)
JP (1) JP1646470S (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL262934A (ja) * 1960-03-30
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
DE3535605C1 (de) * 1985-10-05 1986-12-04 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung
JPS63107159A (ja) * 1986-10-24 1988-05-12 Toshiba Corp 半導体装置
JPS63129652A (ja) * 1986-11-20 1988-06-02 Toshiba Corp 半導体装置
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
USD316251S (en) * 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
JP2695736B2 (ja) * 1992-12-11 1998-01-14 三菱電機株式会社 樹脂封止型半導体装置及びその抵抗線を備えたリードフレームの製造方法
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396696S (en) * 1997-01-30 1998-08-04 Sony Corporation Semiconductor package
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
JP2003077939A (ja) * 2001-09-05 2003-03-14 Mitsubishi Electric Corp 半導体装置およびその製造方法
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO2004084317A2 (en) * 2003-03-20 2004-09-30 Firecomms Limited An optical sub-assembly for a transceiver
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7227198B2 (en) * 2004-08-11 2007-06-05 International Rectifier Corporation Half-bridge package
DE102005018941B4 (de) * 2005-04-22 2010-07-08 Infineon Technologies Ag Halbleiterbauteil in einem Standardgehäuse und Verfahren zur Herstellung desselben
DE112005003614B4 (de) 2005-07-28 2014-08-21 Infineon Technologies Ag Halbleiterbaugruppe für ein Schaltnetzteil und Verfahren zu dessen Montage
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
CN201011655Y (zh) * 2007-01-10 2008-01-23 上海凯虹科技电子有限公司 一种大功率半导体器件的框架
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
JP6520437B2 (ja) 2015-06-12 2019-05-29 富士電機株式会社 半導体装置
JP6707328B2 (ja) 2015-09-01 2020-06-10 ローム株式会社 パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
JP1632999S (ja) * 2018-06-12 2019-06-03

Also Published As

Publication number Publication date
USD914621S1 (en) 2021-03-30

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112021018450A2 (ja)
BR112019016141A2 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
AU2020104490A5 (ja)
BR112021017637A2 (ja)
BR112021008711A2 (ja)
BR112019016138A2 (ja)
BR112019016142A2 (ja)
BR112021017728A2 (ja)
BR112021017355A2 (ja)
BR112021017703A2 (ja)
BR112021017173A2 (ja)
BR112021017083A2 (ja)
BR112021015080A2 (ja)
BR112021012348A2 (ja)
BR112021017234A2 (ja)
BR112021013944A2 (ja)
BR112021013128A2 (ja)
BR112021016821A2 (ja)
BR112021017732A2 (ja)
BR112021017310A2 (ja)
BR112021016996A2 (ja)