IT993429B - Perfezionamento di una cassa per dispositivo a semiconduttori - Google Patents

Perfezionamento di una cassa per dispositivo a semiconduttori

Info

Publication number
IT993429B
IT993429B IT29390/73A IT2939073A IT993429B IT 993429 B IT993429 B IT 993429B IT 29390/73 A IT29390/73 A IT 29390/73A IT 2939073 A IT2939073 A IT 2939073A IT 993429 B IT993429 B IT 993429B
Authority
IT
Italy
Prior art keywords
terminal
semi
chip
conductor
degrees
Prior art date
Application number
IT29390/73A
Other languages
English (en)
Inventor
R Paletto
Original Assignee
Sgs Ates Componenti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Ates Componenti filed Critical Sgs Ates Componenti
Priority to IT29390/73A priority Critical patent/IT993429B/it
Priority to FR7346659A priority patent/FR2245084B1/fr
Priority to DE2364837A priority patent/DE2364837A1/de
Priority to ES1973199183U priority patent/ES199183Y/es
Priority to NL7400553A priority patent/NL7400553A/xx
Priority to JP1460274A priority patent/JPS5523463B2/ja
Priority to GB669474A priority patent/GB1467054A/en
Priority to US05/508,951 priority patent/US4032706A/en
Application granted granted Critical
Publication of IT993429B publication Critical patent/IT993429B/it
Priority to US05/671,374 priority patent/US4059810A/en
Priority to US05/808,371 priority patent/US4125740A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT29390/73A 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori IT993429B (it)

Priority Applications (10)

Application Number Priority Date Filing Date Title
IT29390/73A IT993429B (it) 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori
FR7346659A FR2245084B1 (it) 1973-09-26 1973-12-27
DE2364837A DE2364837A1 (de) 1973-09-26 1973-12-28 Verbesserungen an einem gehaeuse fuer vorrichtung mit halbleitern
ES1973199183U ES199183Y (es) 1973-09-26 1973-12-31 Caja para dispositivo de semiconductores.
NL7400553A NL7400553A (nl) 1973-09-26 1974-01-15 Huis voor een halfgeleiderinrichting.
JP1460274A JPS5523463B2 (it) 1973-09-26 1974-02-06
GB669474A GB1467054A (en) 1973-09-26 1974-02-14 Semiconductor devices
US05/508,951 US4032706A (en) 1973-09-26 1974-09-23 Resin-encased microelectronic module
US05/671,374 US4059810A (en) 1973-09-26 1976-03-29 Resin-encased microelectronic module
US05/808,371 US4125740A (en) 1973-09-26 1977-06-20 Resin-encased microelectronic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT29390/73A IT993429B (it) 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori

Publications (1)

Publication Number Publication Date
IT993429B true IT993429B (it) 1975-09-30

Family

ID=11226889

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29390/73A IT993429B (it) 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori

Country Status (8)

Country Link
US (1) US4032706A (it)
JP (1) JPS5523463B2 (it)
DE (1) DE2364837A1 (it)
ES (1) ES199183Y (it)
FR (1) FR2245084B1 (it)
GB (1) GB1467054A (it)
IT (1) IT993429B (it)
NL (1) NL7400553A (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
FR2462024A1 (fr) * 1979-07-17 1981-02-06 Thomson Csf Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
US4994897A (en) * 1989-10-26 1991-02-19 Motorola, Inc. Multi-level semiconductor package
JPH0422762A (ja) * 1990-05-16 1992-01-27 Mitsubishi Electric Corp イグナイタ
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
US7005728B1 (en) 2004-06-03 2006-02-28 National Semiconductor Corporation Lead configuration for inline packages
JP1646470S (it) * 2019-05-14 2019-11-25
JP2022063589A (ja) * 2020-10-12 2022-04-22 株式会社マキタ 作業機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368114A (en) * 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3416348A (en) * 1966-09-30 1968-12-17 Westinghouse Electric Corp Flat-pack lead bending device
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
NL6903229A (it) * 1969-03-01 1970-09-03
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation

Also Published As

Publication number Publication date
GB1467054A (en) 1977-03-16
JPS5061980A (it) 1975-05-27
DE2364837A1 (de) 1975-04-24
NL7400553A (nl) 1975-04-01
ES199183U (es) 1975-07-16
ES199183Y (es) 1975-11-16
US4032706A (en) 1977-06-28
FR2245084B1 (it) 1976-10-08
FR2245084A1 (it) 1975-04-18
JPS5523463B2 (it) 1980-06-23

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