JPS60250659A - 複合形半導体装置 - Google Patents

複合形半導体装置

Info

Publication number
JPS60250659A
JPS60250659A JP59106834A JP10683484A JPS60250659A JP S60250659 A JPS60250659 A JP S60250659A JP 59106834 A JP59106834 A JP 59106834A JP 10683484 A JP10683484 A JP 10683484A JP S60250659 A JPS60250659 A JP S60250659A
Authority
JP
Japan
Prior art keywords
terminals
terminal
external electrode
semiconductor device
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59106834A
Other languages
English (en)
Inventor
Yasuharu Sakamoto
坂本　康晴
Toshihiro Nakajima
中嶋　利廣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59106834A priority Critical patent/JPS60250659A/ja
Publication of JPS60250659A publication Critical patent/JPS60250659A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は複合形半導体装置に関し、特に複合形半導体
装置における外部電極端子の位置配列の改良に係るもの
である。
〔従　来　技　術〕
従来例によるこの種の複合形半導体装置、こ工では複合
形サイリスタアレイにおける外部電極端子の位置配列を
第２図に示す。この第２図構成においては、各外部端子
の外部接続部が一方の側にあって同一ピッチ間隔で整列
された形状のリードフレームを用い、同外部端子のうち
、内外端部にある７ノード端子１．２のダイポンド部に
サイリスタチップ３．３を、それぞれに半田４などの導
電材料によりグイポンドし、かつこのサイリスタチップ
３．３の各ゲート部５，５と、両アノード端子１．２の
各内側のゲート端子６．７とをｌワイヤ８．９などの導
電材料により、また同様にサイリスタチップ３．３の各
カソード部１０．１０と、両ゲート端子６，７間の共通
カソード端子１１とをＡｎワイヤ１２．１３などの導電
材料によりそれぞれにワイヤポンドし、さらにこれらの
各端子の外部接続部を除いてエポキシ樹脂１４などによ
り樹脂封止した上で、フレームのタイバーを切断除去し
て目的とする複合形サイリスタアレイを構成させるので
ある。すなわち、この構成により従来例での複合形サイ
リスタアレイにおいては、中央部に共通カソード端子１
１が、その両外側に各ゲート端子６．７が、さらにその
両外側に各７ノード端子１．２がそれぞれに等ピッチ間
隔で設けられた外部電極端子配列となっているのである
。− しかしながら、このような複合形サイリスタアレイの外
部電極端子配列では、各端子間の間隔が狭いと、高耐圧
素子の場合にゲート端子とアノード端子間で放電を生ず
ることがあつ・て、装置の絶縁耐力特性において信頼性
に欠けるという重大な欠点を有するものであった。
〔発明の概要〕
この発明は従来のこのような欠点に鑑み、ゲート端子と
アノード端子との各外部接続部が、共に反対側に形成さ
れる外部電極端子配列とすることにより、特に高耐圧素
子の場合にあって、装置の絶縁耐力特性の向上を図った
構成を提供するものである。
〔発明の実施例〕
以下この発明に係る複合形半導体装置の一実施例につき
第１図を参照して詳細に説明する。
第１図実施例は、この発明を複合形サイリスタアレイに
おける外部電極端子の位置配列に適用した場合の一例で
あって、前記第２図従来例と同一符号は同一または相当
部分を示しており、この実施例装置では、前記従来例装
置において共に一方の側に同一ピッチ間隔で配列されて
いた各外部電極端子、すなわち中央部の共通カソード端
子１１と、その両外側の各ゲート端子６，７と、さらに
その両外側の各アノード端子１．２のうち、両液外側の
各アノード端子１．２に対応する。ご覧では各アノード
端子１５．１６のみを他方の側、つまり各ゲート端子６
，７および共通カソード端子１１とは反対側に配列させ
た状態で、同様に樹脂封止して構成させたものである。
従ってこの実施例構成による高耐圧の複合形サイリスタ
アレイあって、各ゲート端子６．７およびに共通カソー
ド端子１１と各７ノード端子ｌ。
２間に対し、高電圧１例えば１，０ＯＯＶを印加した場
合、これらの各ゲート端子６，７およびに共通カソード
端子１１と各アノード端子１．２とが、相互に対向する
側に配置されていて、その絶縁距離が充分に大きくとら
れていることから、各端子間に放電などを生ずる惧れは
ない。
なお、前記実施例においては、複合形サイリスタアレイ
について述べたが、同様に複合形トライアックアレイ、
複合形トランジスタアレイについても適用できることは
勿論である。
〔発明の効果〕
以上詳述したようにこの発明によるときは、各外部電極
端子をもつリードフレームを用いて、このリードフレー
ムの各外部電極端子に対し、それぞれに半導体素子の該
当部を接続させ、かつこれらを各外部電極端子の外部接
続部を除き樹脂封止して構成する複合形半導体装置にお
いて、各外部電極端子のうち、端子間放電を生じ易い外
部電極端子の相互を、樹脂封止部の異なる側部に配設さ
せるようにしたので、□この外部電極端子相互間に充分
な絶縁距離を与えることができ、装置の絶縁耐力特性を
充分に維持し得て信頼性の向上に役立ち、しかも構成が
簡単で容易に実施できるなどの特長を有するものである
。
【図面の簡単な説明】
第１図はこの発明に係る複合形半導体装置の一実施例を
適用した複合形サイリスタアレイにおける外部電極端子
の位置配列を示す平面説明図、第２図は同上従来例での
複合形サイリスタアレイにおける外部電極端子の位置配
列を示す平面説明図である。 １．２および１５．１６・・・・アノード端子、３・・
・・サイリスタチップ、５およびｌＯ・・・・サイリス
タチップのゲート部およびカソード部、６，７および１
１・・・・ゲート端子およびカソード端子、８．９およ
び１２．１３・・・・Ａｎワイヤ、１４・・・・エポキ
シ樹脂。 代□理人大　岩　増　雄

Claims (1)

    【特許請求の範囲】
  1. リードフレームを用い、このリードフレームの各外部電
    極端子に各半導体素子を接続させると共に、各外部電極
    端子の外部接続部を除いて樹脂封止した複合形半導体装
    置において、前記各外部電極端子のうち、端子間放電を
    生じ易い各外部電極端子の相互を、樹脂封止部の異なる
    側部に配設させたことを特徴とする複合形半導体装置。
JP59106834A 1984-05-25 1984-05-25 複合形半導体装置 Pending JPS60250659A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59106834A JPS60250659A (ja) 1984-05-25 1984-05-25 複合形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59106834A JPS60250659A (ja) 1984-05-25 1984-05-25 複合形半導体装置

Publications (1)

Publication Number Publication Date
JPS60250659A true JPS60250659A (ja) 1985-12-11

Family

ID=14443751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59106834A Pending JPS60250659A (ja) 1984-05-25 1984-05-25 複合形半導体装置

Country Status (1)

Country Link
JP (1) JPS60250659A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489453A (en) * 1987-09-30 1989-04-03 Toshiba Corp Semiconductor device
US5821618A (en) * 1994-08-12 1998-10-13 Siemens Aktiengesellschaft Semiconductor component with insulating housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489453A (en) * 1987-09-30 1989-04-03 Toshiba Corp Semiconductor device
US5821618A (en) * 1994-08-12 1998-10-13 Siemens Aktiengesellschaft Semiconductor component with insulating housing

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