US5640305A - Anchor for securing a heat sink to a printed circuit board - Google Patents

Anchor for securing a heat sink to a printed circuit board Download PDF

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Publication number
US5640305A
US5640305A US08/663,600 US66360096A US5640305A US 5640305 A US5640305 A US 5640305A US 66360096 A US66360096 A US 66360096A US 5640305 A US5640305 A US 5640305A
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United States
Prior art keywords
circuit board
printed circuit
spring
anchor
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US08/663,600
Inventor
Matthew Smithers
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Aavid Thermalloy LLC
Original Assignee
Thermalloy Inc
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Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Priority to US08/663,600 priority Critical patent/US5640305A/en
Assigned to THERMALLOY, INC. reassignment THERMALLOY, INC. CROSS-REFERENCED TO ASSIGNMENT FILED IN PARENT APPLICATION, SER NO. 08477794 FILED ON 06071995 RECORDED AT REEL 7675 FRAME 0310 ONE 10121996 Assignors: SMITHERS, MATTHEW
Application granted granted Critical
Publication of US5640305A publication Critical patent/US5640305A/en
Assigned to AAVID THERMALLOY, LLC reassignment AAVID THERMALLOY, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: THERMALLOY, INC.
Assigned to LASALLE BUSINESS CREDIT, INC., AS AGENT reassignment LASALLE BUSINESS CREDIT, INC., AS AGENT SECURITY AGREEMENT Assignors: AAVID THERMALLOY, LLC, A DELWARE LIMITED LIABILITY COMPANY
Assigned to THE PRUDENTIAL INSURANCE COMPANY OF AMERICA, AS COLLATERAL AGENT reassignment THE PRUDENTIAL INSURANCE COMPANY OF AMERICA, AS COLLATERAL AGENT ASSIGNMENT OF SECURITY INTEREST IN PATENTS Assignors: AAVID ACQUISITION, INC., AAVID THERMAL PRODUCTS, INC., AAVID THERMALLOY, LLC
Assigned to AAVID THERMAL PRODUCTS, INC., AAVID LABORATORIES, INC., AAVID THERMALLOY, LLC, THERMALLOY, INC. reassignment AAVID THERMAL PRODUCTS, INC. RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL Assignors: BANK OF AMERICA, N.A., SUCCESSOR BY MERGER TO LASALLE BUSINESS CREDIT, INC. AS AGENT
Assigned to GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT reassignment GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT SECURITY AGREEMENT Assignors: AAVID THERMALLOY, LLC
Assigned to AAVID THERMALLOY, LLC, AAVID THERMAL TECHNOLOGIES, INC., AAVID CORPORATION (F/K/A AAVID THERMAL PRODUCTS, INC.) reassignment AAVID THERMALLOY, LLC TERMINATION AND RELEASE OF ASSIGNMENT OF SECURITY INTEREST IN PATENTS BY SECURED PARTY PREVIOUSLY RECORDED AT REEL 025764 FRAME 0187 Assignors: THE PRUDENTIAL INSURANCE COMPANY OF AMERICA
Anticipated expiration legal-status Critical
Assigned to ANTARES CAPITAL LP, AS SUCCESSOR AGENT reassignment ANTARES CAPITAL LP, AS SUCCESSOR AGENT ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: GENERAL ELECTRIC CAPITAL CORPORATION, AS RETIRING AGENT
Assigned to AAVID THERMALLOY, LLC reassignment AAVID THERMALLOY, LLC RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 29414/899 Assignors: ANTARES CAPITAL LP, AS SUCCESSOR TO GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S24/00—Buckles, buttons, clasps
    • Y10S24/30—Separable-fastener or required component thereof
    • Y10S24/51—Separable-fastener or required component thereof including receiving member having cavity and mating member having insertable projection guided to interlock thereby

Definitions

  • This invention relates to securing electronic components together. More particularly, it relates to an anchor for mounting a heat sink and an electronic device on a printed circuit board with a spring.
  • Page 17 of that catalog shows two types of wire springs for securing a heat sink to a pin grid array (PGA).
  • an anchor can be inserted into a printed circuit board to secure a heat sink to an electronic device.
  • the anchor includes a plastic body having a projection for engaging a spring which clamps the heat sink to the electronic device.
  • a neck on the plastic body fits into an opening in the printed circuit board.
  • the plastic body has a hole which extends into a neck on the body.
  • a pin in the hole spreads the neck after insertion into the printed circuit board. The diameter of the hole in the neck is smaller than the diameter of the pin, so that the neck is spread as the pin is pushed into the neck.
  • the body of the anchor and the pin are plastic which may be formed in a continuous extruded strip.
  • the spring that clamps the heat sink to the electronic device may be a wire spring or a clip spring.
  • FIGS. 1, 1A and 1B are side, front and top views respectively of the anchor
  • FIGS. 2 and 2A are side and front cross-section views
  • FIGS. 3 and 3A are side and side cross-section views of the anchor with the neck spread to secure it to a printed circuit board;
  • FIG. 4 shows anchors which have been injected molded on a plastic strip
  • FIG. 5 is an exploded view showing the anchor used to secure a pin fin heat sink to an electronic device with a wire spring
  • FIG. 6 is an exploded view of an anchor used to secure a pin fin heat sink to an electronic device with a clip spring
  • FIG. 7 shows an assembled heat sink and electronic device anchored with a single clip spring.
  • An anchor of the present invention has a plastic body 11 which has a projection or protuberance 12 for engaging a spring which secures a heat sink to an electronic device. More particularly, the projection has an arcuate groove 13 which engages springs of the type shown on page 17 of the aforementioned Thermalloy catalog to secure a heat sink/electronic device assembly to a printed circuit board.
  • the anchor has a neck 14 which fits into an opening in the printed circuit board.
  • a hole 15 extends through the body into the neck of the anchor.
  • a pin 16 is in the hole.
  • neck 14 has a spreadable portion 17 with a hole 15a which is smaller than the diameter of pin 16. Since it is smaller than the diameter of the pin, the neck is spread as the pin 16 is pushed into the neck. The spread portion 17 locks the anchor to the printed circuit board 18 as is best shown in FIG. 3 and 3A.
  • FIG. 4 shows a plurality of anchors 11a-11d which have been injection molded on a common extrusion strip 18.
  • the bodies 11a-11d and the pins 16a-16d are all plastic and can be formed in a continuous extrusion process.
  • FIG. 5 is an exploded view which depicts the assembly of a wire spring 20 with a pin fin heat sink 21 and an electronic device 22. These components are secured to the printed circuit board 18 by the anchor 10.
  • the anchor 10 is secured to the printed circuit board by the spread portion of the neck below a hole in the printed circuit board as previously described.
  • the clip 23 holds the spring 20 in the heat sink 21 during shipment.
  • the assembly of components is made by securing two anchors 10 to the printed circuit board 18, then using the wire spring 20 to fasten the heat sink to the anchors.
  • FIG. 6 shows a different embodiment of an anchor 24. This modification has a protruberance 25 which engages holes 26 and 27 in two legs of the clip spring 28.
  • This clip spring is more fully described in co-pending application Ser. No. 349,672, filed Dec. 5, 1994, "Strap Spring For Heat Sink Clip Assembly", which is incorporated herein by reference.
  • FIG. 7 shows the completed assembly using an embodiment of a clip spring shown in the aforementioned co-pending application having only one leg.
  • a single anchor can be used to secure the clip spring to the printed circuit board and other anchors secure a like clip to the other side of the heat sink.

Abstract

An anchor for mounting a heat sink and an electronic device on a printed circuit board has a plastic body. An arcuate groove or protruberance is engaged by a spring. The anchor has a neck which is inserted into a hole in a printed circuit board. A pin in a hole in the body is pushed into the neck to spread it to secure the anchor to the printed circuit board. The assembly is formed by attaching a wire or clip spring to the anchor.

Description

This is a continuation of application Ser. No. 08/477,794 filed Jun. 7, 1995 now abandoned.
FIELD OF THE INVENTION
This invention relates to securing electronic components together. More particularly, it relates to an anchor for mounting a heat sink and an electronic device on a printed circuit board with a spring.
BACKGROUND OF THE INVENTION
A heat sink placed in contact with an electronic device transfers heat through conduction from the semi-conductor device contained in the electronic package. U.S. Pat. No. 4,884,331-Hinshaw shows a commonly used pin fin heat sink.
Springs or clips such as shown in U.S. Pat. No. 4,745,456 Clemens, or U.S. Pat. No. 4,660,123-Hermann have been used to secure heat sinks to electronic devices. The catalog Thermalloy Semiconductor Accessories, pp. 15-29, shows clips for attaching heat sinks to electronic devices.
Page 17 of that catalog shows two types of wire springs for securing a heat sink to a pin grid array (PGA). Co-pending application Ser. No. 349,672, filed Dec. 5, 1994, "Strap for Heat Sink Clip Assembly", shows and describes several different clips for securing a heat sink to an electronic device.
It is an object of the present invention to provide an anchor which can be inserted into a printed circuit board to secure a heat sink and an electronic device to the board.
SUMMARY OF THE INVENTION
In accordance with the present invention, an anchor can be inserted into a printed circuit board to secure a heat sink to an electronic device. The anchor includes a plastic body having a projection for engaging a spring which clamps the heat sink to the electronic device. A neck on the plastic body fits into an opening in the printed circuit board. The plastic body has a hole which extends into a neck on the body. A pin in the hole spreads the neck after insertion into the printed circuit board. The diameter of the hole in the neck is smaller than the diameter of the pin, so that the neck is spread as the pin is pushed into the neck.
The body of the anchor and the pin are plastic which may be formed in a continuous extruded strip. The spring that clamps the heat sink to the electronic device may be a wire spring or a clip spring.
The foregoing and other objects, features and advantages of the invention will be better understood from the following more detailed description and appended claims.
SHORT DESCRIPTION OF THE DRAWINGS
FIGS. 1, 1A and 1B are side, front and top views respectively of the anchor;
FIGS. 2 and 2A are side and front cross-section views;
FIGS. 3 and 3A are side and side cross-section views of the anchor with the neck spread to secure it to a printed circuit board;
FIG. 4 shows anchors which have been injected molded on a plastic strip;
FIG. 5 is an exploded view showing the anchor used to secure a pin fin heat sink to an electronic device with a wire spring;
FIG. 6 is an exploded view of an anchor used to secure a pin fin heat sink to an electronic device with a clip spring; and
FIG. 7 shows an assembled heat sink and electronic device anchored with a single clip spring.
DESCRIPTION OF THE PREFERRED EMBODIMENT
An anchor of the present invention, denoted by the reference numeral 10, has a plastic body 11 which has a projection or protuberance 12 for engaging a spring which secures a heat sink to an electronic device. More particularly, the projection has an arcuate groove 13 which engages springs of the type shown on page 17 of the aforementioned Thermalloy catalog to secure a heat sink/electronic device assembly to a printed circuit board.
The anchor has a neck 14 which fits into an opening in the printed circuit board. A hole 15 extends through the body into the neck of the anchor.
A pin 16 is in the hole. As best shown in FIGS. 2 and 2A, neck 14 has a spreadable portion 17 with a hole 15a which is smaller than the diameter of pin 16. Since it is smaller than the diameter of the pin, the neck is spread as the pin 16 is pushed into the neck. The spread portion 17 locks the anchor to the printed circuit board 18 as is best shown in FIG. 3 and 3A.
FIG. 4 shows a plurality of anchors 11a-11d which have been injection molded on a common extrusion strip 18. The bodies 11a-11d and the pins 16a-16d are all plastic and can be formed in a continuous extrusion process.
FIG. 5 is an exploded view which depicts the assembly of a wire spring 20 with a pin fin heat sink 21 and an electronic device 22. These components are secured to the printed circuit board 18 by the anchor 10. The anchor 10 is secured to the printed circuit board by the spread portion of the neck below a hole in the printed circuit board as previously described. The clip 23 holds the spring 20 in the heat sink 21 during shipment. The assembly of components is made by securing two anchors 10 to the printed circuit board 18, then using the wire spring 20 to fasten the heat sink to the anchors.
FIG. 6 shows a different embodiment of an anchor 24. This modification has a protruberance 25 which engages holes 26 and 27 in two legs of the clip spring 28. This clip spring is more fully described in co-pending application Ser. No. 349,672, filed Dec. 5, 1994, "Strap Spring For Heat Sink Clip Assembly", which is incorporated herein by reference.
FIG. 7 shows the completed assembly using an embodiment of a clip spring shown in the aforementioned co-pending application having only one leg. With this embodiment, a single anchor can be used to secure the clip spring to the printed circuit board and other anchors secure a like clip to the other side of the heat sink.
Various other modifications may be made. The appended claims, are, therefore to cover all such modifications within the spirit and scope of the invention.

Claims (7)

What is claimed is:
1. The combination of a printed circuit board, a heat sink, an electronic device, a spring securing said heat sink to said electronic device, and an anchor inserted into an opening in said printed circuit board comprising:
a printed circuit board having a plurality of openings which are spaced on said printed circuit board;
said anchor comprising:
a plastic body having a width which is substantially the same size but slightly larger than each of said openings and substantially smaller than the spacing between any two of said openings in said printed circuit board, said body having a continuous projection which extends the entire width of the body, said project engaging said spring, said body having a neck of smaller size which fits into one of said openings in said circuit board, and a hole in said body; and
a pin in said hole in said body, said pin spreading said neck to lock said anchor to said printed circuit board by the spread portion of said neck;
said spring engaging said projection on said body and engaging said heat sink which holds said electronic device on said printed circuit board.
2. The combination recited in claim 1 wherein said neck has a hole which is smaller than the diameter of said pin so that said neck is spread as said pin enters said neck.
3. The combination recited in claim 1 wherein said continuous projection engaging said spring is a projection having an arcuate groove.
4. The combination recited in claim 3 said spring being a wire fitting in said arcuate groove and over said heat sink to secure said electronic device.
5. The combination recited in claim 1 wherein said continuous projection engaging said spring is a protuberance and wherein said spring is a clip having a leg with a hole in the extremity thereof, said protuberance fitting into said hole to secure said clip spring.
6. The combination recited in claim 5 wherein said clip is U-shaped with two legs, and wherein two of said anchors are secured on said printed circuit board, a protruberance on each anchor fitting into a hole in each leg.
7. The combination cited in claim 1 wherein said pin is plastic.
US08/663,600 1995-06-07 1996-06-14 Anchor for securing a heat sink to a printed circuit board Expired - Lifetime US5640305A (en)

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US08/663,600 US5640305A (en) 1995-06-07 1996-06-14 Anchor for securing a heat sink to a printed circuit board

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US47779495A 1995-06-07 1995-06-07
US08/663,600 US5640305A (en) 1995-06-07 1996-06-14 Anchor for securing a heat sink to a printed circuit board

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Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5734556A (en) * 1996-06-26 1998-03-31 Sun Microsystems, Inc. Mechanical heat sink attachment having two pin headers and a spring clip
US5847928A (en) * 1996-07-09 1998-12-08 Thermalloy, Inc. Strap spring for attaching heat sinks to circuit boards
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6181559B1 (en) 1998-07-21 2001-01-30 Samsung Electronics Co., Ltd. Device for attaching a heat sink
US6347036B1 (en) 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6353537B2 (en) * 1998-12-17 2002-03-05 Canon Kabushiki Kaisha Structure for mounting radiating plate
US6424530B1 (en) * 2001-02-13 2002-07-23 Foxconn Precision Components Co., Ltd. Clip for heat sink
US6496371B2 (en) 2001-03-30 2002-12-17 Intel Corporation Heat sink mounting method and apparatus
US6510054B1 (en) * 2001-07-20 2003-01-21 Hon Hai Precision Ind. Co., Ltd. Heat sink clip assembly with handles
US6507981B1 (en) 2000-11-20 2003-01-21 International Business Machines Corporation Fastener carrier
US6538891B1 (en) * 2002-02-21 2003-03-25 Hon Hai Precision Ind. Co., Ltd. Heat sink clip assembly
US20030235037A1 (en) * 2002-06-20 2003-12-25 Samsung Electronics Co., Ltd. Heatsink mounting unit
US6714416B1 (en) * 2002-11-13 2004-03-30 Cisco Technology, Inc. Mechanisms and techniques for fastening a heat sink to a circuit board component
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
US6947283B2 (en) * 2002-10-01 2005-09-20 Intel Corporation Heat sink and retaining clip assembly
US20060114659A1 (en) * 2004-12-01 2006-06-01 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US20060114658A1 (en) * 2004-12-01 2006-06-01 George Sya Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7113406B1 (en) 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
US7139174B1 (en) 2003-10-29 2006-11-21 Cisco Technology, Inc. Techniques for attaching a heat sink assembly to a circuit board component
US7167369B1 (en) * 2003-12-08 2007-01-23 Cisco Technology, Inc. Methods and apparatus for installing a heat sink using surface mount technology
US20070086169A1 (en) * 2005-10-19 2007-04-19 Inventec Corporation Fastening structure
US20070223159A1 (en) * 2000-05-03 2007-09-27 Belgacem Haba Semiconductor Module with Serial Bus Connection to Multiple Dies
US20080068809A1 (en) * 2006-09-20 2008-03-20 Cisco Technology, Inc. Heatsink attachment mechanism
US20080101037A1 (en) * 2006-10-31 2008-05-01 Thom Augustin Securing object relative to PC board using retention device attached to surface-mounted attachment mechanisms
US20080186670A1 (en) * 2007-01-15 2008-08-07 Coolit Systems Inc. Electronics cooling system
US20090154109A1 (en) * 2007-12-14 2009-06-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly
US20090154108A1 (en) * 2007-12-18 2009-06-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Clip and heat dissipation assembly using the same
US20090237885A1 (en) * 2008-03-20 2009-09-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
US20110141699A1 (en) * 2009-12-16 2011-06-16 International Business Machines Corporation Apparatus and method for attaching selected components to a printed circuit board
US8063485B1 (en) 2008-06-27 2011-11-22 Advanced Thermal Solutions, Inc. Electronics package with integrated lugs for cooling attachment
US20120120606A1 (en) * 2010-11-11 2012-05-17 Hon Hai Precision Industry Co., Ltd. Printed circuit board with heat sink
US20130094149A1 (en) * 2010-06-18 2013-04-18 Tetsuji Kataoka Structure for mounting heat sink, and heat sink mounted using the structure
US20130100614A1 (en) * 2011-10-19 2013-04-25 Sercomm Corporation Electronic device using fastener for fixing
RU2634070C1 (en) * 2016-08-10 2017-10-23 Артем Анатольевич Кузьмин Protective apron for cars
US10257961B2 (en) 2013-09-23 2019-04-09 Coriant Operations, Inc. Fixation of heat sink on SFP/XFP cage
US10978372B1 (en) 2019-11-11 2021-04-13 Google Llc Heat sink load balancing apparatus

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Cited By (57)

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Publication number Priority date Publication date Assignee Title
US5734556A (en) * 1996-06-26 1998-03-31 Sun Microsystems, Inc. Mechanical heat sink attachment having two pin headers and a spring clip
US5847928A (en) * 1996-07-09 1998-12-08 Thermalloy, Inc. Strap spring for attaching heat sinks to circuit boards
US6313993B1 (en) * 1996-07-09 2001-11-06 Thermalloy, Inc. Strap spring for attaching heat sinks to circuit boards
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6181559B1 (en) 1998-07-21 2001-01-30 Samsung Electronics Co., Ltd. Device for attaching a heat sink
US6353537B2 (en) * 1998-12-17 2002-03-05 Canon Kabushiki Kaisha Structure for mounting radiating plate
US6347036B1 (en) 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US20070222061A1 (en) * 2000-05-03 2007-09-27 Belgacem Haba Semiconductor Module With Serial Bus Connection to Multiple Dies
US20070230134A1 (en) * 2000-05-03 2007-10-04 Belgacem Haba Semiconductor Module with Serial Bus Connection to Multiple Dies
USRE42785E1 (en) 2000-05-03 2011-10-04 Rambus Inc. Semiconductor module with serial bus connection to multiple dies
US20070223159A1 (en) * 2000-05-03 2007-09-27 Belgacem Haba Semiconductor Module with Serial Bus Connection to Multiple Dies
USRE42318E1 (en) * 2000-05-03 2011-05-03 Rambus Inc. Semiconductor module with serial bus connection to multiple dies
USRE42429E1 (en) 2000-05-03 2011-06-07 Rambus Inc. Semiconductor module with serial bus connection to multiple dies
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