USD838680S1 - Modular electronic device - Google Patents

Modular electronic device Download PDF

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Publication number
USD838680S1
USD838680S1 US29/536,825 US201529536825F USD838680S US D838680 S1 USD838680 S1 US D838680S1 US 201529536825 F US201529536825 F US 201529536825F US D838680 S USD838680 S US D838680S
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US
United States
Prior art keywords
electronic device
modular electronic
modular
view
device shown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/536,825
Inventor
Zhenshan Wang
Kejia Pan
Bin Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microduino Technologies (beijing) Ltd Inc
Meike Technology Beijing Ltd
Microduino Inc
Original Assignee
Meike Technology Beijing Ltd
Microduino Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meike Technology Beijing Ltd, Microduino Inc filed Critical Meike Technology Beijing Ltd
Priority to US29/536,825 priority Critical patent/USD838680S1/en
Assigned to Microduino Technologies (Beijing) Ltd. Inc., Microduino Inc. reassignment Microduino Technologies (Beijing) Ltd. Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, BIN, PAN, KEJIA, WANG, ZHENSHAN
Assigned to Meike Technology (Beijing) Ltd., Microduino Inc. reassignment Meike Technology (Beijing) Ltd. CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNEE ADDRESS AND SECOND ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 036365 FRAME: 0511. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: WANG, ZHENSHAN, FENG, BIN, PAN, KEJIA
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Publication of USD838680S1 publication Critical patent/USD838680S1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toys (AREA)
  • Combinations Of Printed Boards (AREA)

Description

FIG. 1 is a top perspective view of a modular electronic device in accordance with the present invention;
FIG. 2 is a bottom perspective view of the modular electronic device shown in FIG. 1;
FIG. 3 is a top view of the modular electronic device shown in FIG. 1;
FIG. 4 is a bottom view of the modular electronic device shown in FIG. 1;
FIG. 5 is a left side view of the modular electronic device shown in FIG. 1;
FIG. 6 is a right side view of the modular electronic device shown in FIG. 1;
FIG. 7 is a front view of the modular electronic device shown in FIG. 1; and,
FIG. 8 is a back view of the modular electronic device shown in FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a modular electronic device, as shown and described.
US29/536,825 2015-02-20 2015-08-19 Modular electronic device Active USD838680S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/536,825 USD838680S1 (en) 2015-02-20 2015-08-19 Modular electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201510085854.9A CN104619117A (en) 2015-02-20 2015-02-20 Magnetic combined structure between circuit boards
CN201510085854 2015-02-20
US14/721,341 US9801300B2 (en) 2015-02-20 2015-05-26 Electrical modules and modular electronic building systems
US29/536,825 USD838680S1 (en) 2015-02-20 2015-08-19 Modular electronic device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US14/721,341 Continuation US9801300B2 (en) 2015-02-20 2015-05-26 Electrical modules and modular electronic building systems

Publications (1)

Publication Number Publication Date
USD838680S1 true USD838680S1 (en) 2019-01-22

Family

ID=53153318

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/721,341 Expired - Fee Related US9801300B2 (en) 2015-02-20 2015-05-26 Electrical modules and modular electronic building systems
US29/536,825 Active USD838680S1 (en) 2015-02-20 2015-08-19 Modular electronic device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US14/721,341 Expired - Fee Related US9801300B2 (en) 2015-02-20 2015-05-26 Electrical modules and modular electronic building systems

Country Status (2)

Country Link
US (2) US9801300B2 (en)
CN (3) CN104619117A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD902897S1 (en) 2019-11-13 2020-11-24 Honeywell International Building control module
USD973147S1 (en) * 2021-05-11 2022-12-20 Guangdong Qunyu Interactive Technology Co., Ltd. Toy block
USD985516S1 (en) 2021-02-26 2023-05-09 Honeywell International Inc. Building controller
USD1034490S1 (en) * 2022-05-09 2024-07-09 Shenzhen Deruisi Electronic Technology Co., Ltd. Bracket for heat sink of CPU

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US8602833B2 (en) 2009-08-06 2013-12-10 May Patents Ltd. Puzzle with conductive path
US11330714B2 (en) 2011-08-26 2022-05-10 Sphero, Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US9019718B2 (en) * 2011-08-26 2015-04-28 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
CN104619117A (en) * 2015-02-20 2015-05-13 王镇山 Magnetic combined structure between circuit boards
USD817412S1 (en) * 2016-10-14 2018-05-08 Microduino Inc. Connector modules
CN106602301A (en) * 2016-12-28 2017-04-26 李金颖 Design-it-yourself modular electronic plug-in
WO2018148911A1 (en) * 2017-02-16 2018-08-23 深圳市创客工场科技有限公司 Electronic toy block system
CN106997710A (en) * 2017-06-14 2017-08-01 哈尔滨工业大学 A kind of building block type electronic experiment teaching aid
CN107185259A (en) * 2017-06-30 2017-09-22 美科科技（北京）有限公司 Electronic module and modular electronic construction system for multi-orientation connection
CN107230872A (en) * 2017-07-13 2017-10-03 上海易教信息科技有限公司 A kind of electronic building blocks monomer and electronic building blocks mould
US20190091596A1 (en) * 2017-09-26 2019-03-28 Elenco Electronics, Inc. Two-sided grid with electrically conductive connections for a snap-together electronic toy set
TWI650633B (en) 2017-10-06 2019-02-11 財團法人國家實驗研究院 Modular electronic combination device
CN107694127A (en) * 2017-11-06 2018-02-16 中国地质大学（武汉） A kind of pieced electronic building blocks of stacked
US20190190193A1 (en) * 2017-12-18 2019-06-20 Littlebits Electronics Inc. Modular electronic building systems and methods of using the same
WO2019126137A1 (en) * 2017-12-18 2019-06-27 Littlebits Electronics Inc. Modular electronic building systems and methods of using the same
CN108126356A (en) * 2017-12-22 2018-06-08 广州途道信息科技有限公司 The programmed method of electronic modular system
US20190280421A1 (en) * 2018-03-07 2019-09-12 Xcelsis Corporation Configurable smart object system with grid or frame-based connectors
US10862252B2 (en) * 2018-05-04 2020-12-08 The Ricker Lyman Robotic Company, Inc. Surface-contact ethernet connector, network equipment chassis including the same and operating method thereof
EP3637963B1 (en) * 2018-10-12 2024-02-07 AT&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier structures connected by cooperating magnet structures
CN209169986U (en) * 2018-11-19 2019-07-26 富士能电子(昆山)有限公司 Power supply unit
US20220001292A1 (en) * 2020-06-18 2022-01-06 Saifeng Chen Programmable toy building blocks system
US20230410680A1 (en) * 2020-10-07 2023-12-21 Cartesia Solutions S.R.L. Ludic-educational modular system

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD902897S1 (en) 2019-11-13 2020-11-24 Honeywell International Building control module
USD985516S1 (en) 2021-02-26 2023-05-09 Honeywell International Inc. Building controller
USD973147S1 (en) * 2021-05-11 2022-12-20 Guangdong Qunyu Interactive Technology Co., Ltd. Toy block
USD1034490S1 (en) * 2022-05-09 2024-07-09 Shenzhen Deruisi Electronic Technology Co., Ltd. Bracket for heat sink of CPU

Also Published As

Publication number Publication date
US20160249478A1 (en) 2016-08-25
CN104619117A (en) 2015-05-13
US9801300B2 (en) 2017-10-24
CN105206959A (en) 2015-12-30
CN205069932U (en) 2016-03-02

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