DE69319026D1 - Halbleiter-Leistungsmodul - Google Patents

Halbleiter-Leistungsmodul

Info

Publication number
DE69319026D1
DE69319026D1 DE69319026T DE69319026T DE69319026D1 DE 69319026 D1 DE69319026 D1 DE 69319026D1 DE 69319026 T DE69319026 T DE 69319026T DE 69319026 T DE69319026 T DE 69319026T DE 69319026 D1 DE69319026 D1 DE 69319026D1
Authority
DE
Germany
Prior art keywords
power module
semiconductor power
semiconductor
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69319026T
Other languages
English (en)
Other versions
DE69319026T2 (de
Inventor
Akihiro Nagatomo
Hiroshi C O Fukuryo Se Yoshida
Masaki C O Fukuryo S Nishiyama
Seiichi C Omitsubishi D Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69319026D1 publication Critical patent/DE69319026D1/de
Publication of DE69319026T2 publication Critical patent/DE69319026T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
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DE69319026T 1992-06-30 1993-06-29 Halbleiter-Leistungsmodul Expired - Fee Related DE69319026T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4172774A JP2725952B2 (ja) 1992-06-30 1992-06-30 半導体パワーモジュール

Publications (2)

Publication Number Publication Date
DE69319026D1 true DE69319026D1 (de) 1998-07-16
DE69319026T2 DE69319026T2 (de) 1998-12-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE69319026T Expired - Fee Related DE69319026T2 (de) 1992-06-30 1993-06-29 Halbleiter-Leistungsmodul

Country Status (4)

Country Link
US (1) US5471089A (de)
EP (1) EP0578108B1 (de)
JP (1) JP2725952B2 (de)
DE (1) DE69319026T2 (de)

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