DE69325232D1 - Leistungshalbleitermodul - Google Patents

Leistungshalbleitermodul

Info

Publication number
DE69325232D1
DE69325232D1 DE69325232T DE69325232T DE69325232D1 DE 69325232 D1 DE69325232 D1 DE 69325232D1 DE 69325232 T DE69325232 T DE 69325232T DE 69325232 T DE69325232 T DE 69325232T DE 69325232 D1 DE69325232 D1 DE 69325232D1
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor module
module
power
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325232T
Other languages
English (en)
Other versions
DE69325232T2 (de
Inventor
Osamu Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu General Ltd
Original Assignee
Fujitsu General Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7306792U external-priority patent/JP2555796Y2/ja
Priority claimed from JP7306992U external-priority patent/JPH0638246U/ja
Priority claimed from JP073068U external-priority patent/JPH0638248U/ja
Application filed by Fujitsu General Ltd filed Critical Fujitsu General Ltd
Application granted granted Critical
Publication of DE69325232D1 publication Critical patent/DE69325232D1/de
Publication of DE69325232T2 publication Critical patent/DE69325232T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69325232T 1992-10-20 1993-10-19 Leistungshalbleitermodul Expired - Fee Related DE69325232T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7306792U JP2555796Y2 (ja) 1992-10-20 1992-10-20 パワーモジュール
JP7306992U JPH0638246U (ja) 1992-10-20 1992-10-20 パワーモジュール
JP073068U JPH0638248U (ja) 1992-10-20 1992-10-20 パワーモジュール

Publications (2)

Publication Number Publication Date
DE69325232D1 true DE69325232D1 (de) 1999-07-15
DE69325232T2 DE69325232T2 (de) 2000-02-17

Family

ID=27301113

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325232T Expired - Fee Related DE69325232T2 (de) 1992-10-20 1993-10-19 Leistungshalbleitermodul

Country Status (5)

Country Link
US (1) US5398160A (de)
EP (1) EP0594395B1 (de)
KR (1) KR100307465B1 (de)
CN (1) CN1036043C (de)
DE (1) DE69325232T2 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
JPH06326330A (ja) * 1993-05-13 1994-11-25 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP3051011B2 (ja) * 1993-11-18 2000-06-12 株式会社東芝 パワ−モジュ−ル
JPH07147347A (ja) * 1993-11-25 1995-06-06 Matsushita Electric Ind Co Ltd 集積回路装置
JPH07211856A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd 集積回路モジュール
US5754402A (en) * 1995-06-22 1998-05-19 Sumitomo Electric Industries, Ltd. Power amplifying module
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US5398160A (en) 1995-03-14
EP0594395B1 (de) 1999-06-09
KR100307465B1 (ko) 2001-12-15
CN1036043C (zh) 1997-10-01
EP0594395A3 (de) 1995-01-11
KR940010293A (ko) 1994-05-24

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