JP2009502024A - 発光ダイオードパッケージ及びその製造方法 - Google Patents
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Abstract
Description
PWB層及び/又は金属ベース上へのより少ない予め穴開けされたプリプレグ材料の使い尽くしと、積層工程の応力のために階段状のキャビティ1900のより少ない分解とをもたらす。
20 放熱板スタッド
30 アセンブリ
40 LEDダイス
50 導電体
60 ワイヤーボンド
70 反射体
80 封止剤
100 光源パッケージ
Claims (61)
- 1つ又は複数の開口部を有するプリント配線板(PWB)と、
前記1つ又は複数の開口部内に固定された1つ又は複数の放熱板スタッドと、
前記1つ又は複数の放熱板スタッド上に取り付けられた1つ又は複数のLEDダイスであって、前記1つ又は複数の放熱板スタッドが、前記1つ又は複数のLEDダイスの熱膨張係数(TCE)と略等しい熱膨張係数(TCE)を有する材料からなるところのLEDダイスと、
を有する発光ダイオード(LED)アセンブリ。 - 前記PWB上に配置される1つ又は複数の反射体をさらに有し、前記1つ又は複数の反射体は、前記1つ又は複数のLEDダイスの周囲に1つ又は複数のキャビティを形成する、請求項1に記載のLEDアセンブリ。
- 前記1つ又は複数のLEDダイスは、少なくとも部分的に前記キャビティ内で封入される、請求項2に記載のLEDアセンブリ。
- 前記PWB上に配置される1つ又は複数の導電体をさらに有し、前記1つ又は複数のLEDダイスは、前記導電体に電気的に接続される、請求項1に記載のLEDアセンブリ。
- 前記PWBは、前記LEDパッケージを第2のPWBに取り付けるための1つ又は複数のカステレーションを有する、請求項1に記載のLEDパッケージ。
- 前記1つ又は複数の放熱板スタッドは、前記1つ又は複数の開口部に適合するように刻み付けられている、請求項1に記載のLEDパッケージ。
- 前記1つ又は複数の開口部は、その中に前記1つ又は複数の放熱板スタッドを接続する半田材料で鍍金される、請求項1に記載のLEDパッケージ。
- 前記1つ又は複数の放熱板スタッドは、前記1つ又は複数の開口部に適合するようにピーニングされている、請求項1に記載のLEDパッケージ。
- 1つ又は複数の開口部を有するPWBと、
前記PWBを少なくとも部分的に覆う金属放熱板層であって、前記金属放熱板層の1つ又は複数の部分が、前記1つ又は複数の開口部に現れて形成される凹面を有するところの金属放熱板層と、
前記1つ又は複数の凹面部分に取り付けられる1つ又は複数のLEDと、
を有するLEDパッケージ。 - 前記1つ又は複数の凹面は、反射性材料を有する、請求項9に記載のLEDパッケージ。
- 1つ又は複数の開口部を有するPWBと、
少なくとも部分的に前記PWBの下に置かれる金属放熱層であって、前記金属放熱層の1つ又は複数の部分が前記1つ又は複数の開口部に現れて形成される凹面を有するところの金属放熱層と、
前記1つ又は複数の凹面部分に取り付けられる1つ又は複数のLEDダイスと、
を有するLEDパッケージ。 - 前記金属放熱板層の前記凹面の部分は、外部の放熱板に熱的に結合される、請求項11に記載のLEDパッケージ。
- 放熱板と、
少なくとも部分的に前記放熱板内に組み込まれる1つ又は複数の放熱板スタッドと、
前記放熱板を覆うPWBであって、前記PWBが前記1つ又は複数の放熱板スタッドに現れる1つ又は複数の開口部を有するところのPWBと、
前記1つ又は複数の放熱板スタッドに取り付けられる1つ又は複数のLEDダイスと、
を有するLEDパッケージ。 - 前記PWBに配置される1つ又は複数の反射体をさらに有し、前記1つ又は複数の反射体は、前記1つ又は複数のLEDダイスを少なくとも部分的に囲う1つ又は複数のキャビティを形成する、請求項13に記載のLEDパッケージ。
- 前記1つ又は複数のLEDダイスは、前記1つ又は複数のキャビティ内に少なくとも部分的に封入される、請求項14に記載のLEDパッケージ。
- 前記PWBに配置される1つ又は複数の導電体をさらに有し、前記1つ又は複数のLEDダイスは、前記導電体に電気的に接続される、請求項13に記載のLEDパッケージ。
- 前記PWBは、ガラス繊維強化積層材料を有する、請求項13に記載のLEDパッケージ。
- 前記PWBは、高温ガラス繊維強化積層体材料を有する、請求項13に記載のLEDパッケージ。
- 前記1つ又は複数の放熱板スタッドは、前記1つ又は複数のLEDダイスの前記TCEに略等しいTCEを有する材料からなる、請求項13に記載のLEDパッケージ。
- 金属層と、
2つ又はそれ以上の誘電体層を有するPWBアセンブリであって、前記アセンブリは、1つ又は複数の階段状の開口部を有し、前記PWBは、前記金属層を覆うところのPWBアセンブリと、
前記PWBアセンブリの前記1つ又は複数の階段状の開口部内に配置され、前記金属層に取り付けられる1つ又は複数のアイソレーターと、
前記1つ又は複数のアイソレーターに取り付けられる1つ又は複数のLEDと、
を有するLEDパッケージ。 - 前記1つ又は複数のアイソレーターは、前記1つ又は複数のLEDダイスの前記TCEと略等しいTCEを有する材料からなる、請求項20に記載のLEDパッケージ。
- 前記1つ又は複数のLEDダイス上に配置される光学素子をさらに有する、請求項20に記載のLEDパッケージ。
- 金属層と、
2つ又はそれ以上の誘電体層を有するPWBアセンブリであって、前記アセンブリが、1つ又は複数の階段状の開口部を有し、前記PWBが、前記金属層を覆うところのPWBアセンブリと、
前記金属層に配置される1つ又は複数のLEDダイスであって、前記金属層が前記1つ又は複数のLEDダイスのTCEに略等しいTCEを有する材料からなるところのLEDダイスと、
を有するLEDパッケージ。 - 複数のPWB層を提供する段階であって、前記各々のPWB層が少なくとも1つの金属層と少なくとも1つの誘電体層とを有するところの段階と、
前記複数のPWB層の前記少なくとも1つの金属層をパターニングする段階と、
各々のPWB層内に開口部を形成する段階であって、前記PWB層が多層アセンブリに共に積層される際に、前記開口部が1つ又は複数の階段状のキャビティを形成するように位置合わせされてサイジングされるところの段階と、
1つ又は複数の階段状のキャビティを有する多層のPWBアセンブリを形成するために前記複数のPWB層を共に積層する段階と、
を有する多層PWBアセンブリの組立方法。 - 前記積層する段階は、前記PWB層間に積層体層を配置することを含む、請求項24に記載の方法。
- 前記積層体層は、予め穴を開けられたプリプレグ材料である、請求項25に記載の方法。
- 前記多層のPWBアセンブリを通る1つ又は複数の鍍金されたビアを提供する段階をさらに有する、請求項26に記載の方法。
- 前記積層体層は、感圧粘着剤をさらに有する、請求項25に記載の方法。
- 前記多層のPWBアセンブリを通る1つ又は複数のビアを提供する段階をさらに有する、請求項24に記載の方法。
- 前記1つ又は複数のビアを鍍金する段階をさらに有する、請求項29に記載の方法。
- 請求項24に記載の方法によって組み立てられるPWBアセンブリ。
- 請求項27に記載の方法によって組み立てられるPWBアセンブリ。
- 絶縁層に階段状のキャビティを有する多層PWBアセンブリを配置する段階であって、前記絶縁層が、前記階段状のキャビティに現れる開口部を有するところの段階と、
前記多層PWBアセンブリと、前記絶縁層と、前記金属ベースを共に積層する段階と、
前記階段状のキャビティに1つ又は複数のLEDダイスを配置する段階と、
を有するLEDパッケージの組立方法。 - 前記1つ又は複数のLEDダイスは、前記金属ベースに配置される、請求項33に記載の方法。
- 前記1つ又は複数のLEDダイスは、前記金属ベースに配置されるアイソレーターに取り付けられる、請求項33に記載の方法。
- 前記アイソレーターは、前記1つ又は複数のLEDダイスの前記TCEに略等しいTCEを有する材料からなる、請求項35に記載の方法。
- 前記絶縁層は、誘電材料を有する、請求項33に記載の方法。
- 前記絶縁層は、高温ガラス繊維強化材料を有する、請求項33に記載の方法。
- 前記絶縁層は、1つ又は複数の積層材料の層を有する、請求項33に記載の方法。
- 前記1つ又は複数の積層材料の層は、予め穴を開けられたプリプレグ材料を有する、請求項39に記載の方法。
- 前記1つ又は複数の積層材料の層は、感圧粘着剤を有する、請求項39に記載の方法。
- 前記1つ又は複数のLEDダイスの少なくとも一部分上に封止剤を配置する段階をさらに有する、請求項33に記載の方法。
- 前記多層PWBアセンブリに反射体を取り付ける段階をさらに有する、請求項33に記載の方法。
- 前記積層する段階中に前記積層材料が前記階段状のキャビティ内に入ることを防止するために、前記1つ又は複数の積層材料の層と前記階段状のキャビティとの間に1つ又は複数の堰堤を配置する段階をさらに有する、請求項33に記載の方法。
- 請求項33に記載の方法によって組み立てられるLEDパッケージ。
- 前記絶縁層は、予め穴を開けられたプリプレグ材料を有する、請求項45に記載のLEDパッケージ。
- 前記積層材料が前記階段状のキャビティ内に入ることを防止するために、前記1つ又は複数の積層材料の層と前記階段状のキャビティとの間に1つ又は複数の堰堤をさらに有する、請求項45に記載の方法。
- 階段状のキャビティと、絶縁層と、積層材料によって積層された金属ベースと、を有する多層のPWBアセンブリと、
前記階段状のキャビティ内に配置される1つ又は複数のLEDダイスと、
を有するLEDパッケージ。 - 前記PWBアセンブリは、1つ又は複数のビアを有する、請求項48に記載のLEDパッケージ。
- 前記1つ又は複数のビアは、前記絶縁層によって前記金属ベースから電気的に絶縁される、請求項49に記載のLEDパッケージ。
- 前記積層体材料は、感圧粘着剤を有する、請求項48に記載のLEDパッケージ。
- 前記積層体材料は、プリプレグ材料を有する、請求項48に記載のLEDパッケージ。
- 前記プリプレグ材料は、前記階段状のキャビティに現れる開口部を有する、請求項52に記載のLEDパッケージ。
- 前記1つ又は複数のLEDダイスは、前記金属ベースに配置される、請求項48に記載のLEDパッケージ。
- 前記金属ベースは、前記1つ又は複数のLEDダイスの前記TCEと略等しいTCEを有する材料からなる、請求項54に記載のLEDパッケージ。
- 前記1つ又は複数のLEDダイスは、前記金属ベースに配置されるアイソレーターに取り付けられる、請求項48に記載のLEDパッケージ。
- 前記アイソレーターは、前記1つ又は複数のLEDダイスの前記TCEと略等しいTCEを有する材料からなる、請求項56に記載のLEDパッケージ。
- 前記絶縁層は、ガラス繊維強化材料を有する、請求項48に記載のLEDパッケージ。
- 前記絶縁層は、1つ又は複数の積層材料の層を有する、請求項48に記載のLEDパッケージ。
- 前記1つ又は複数の積層材料の層は、予め穴を開けられたプリプレグ材料を有する、請求項59に記載のLEDパッケージ。
- 前記1つ又は複数の積層材料の層は、感圧粘着剤を有する、請求項60に記載のLEDパッケージ。
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Also Published As
Publication number | Publication date |
---|---|
JP2012114470A (ja) | 2012-06-14 |
EP1897146A2 (en) | 2008-03-12 |
US20120110842A1 (en) | 2012-05-10 |
WO2007002644A3 (en) | 2009-04-16 |
KR20080042798A (ko) | 2008-05-15 |
TW200709475A (en) | 2007-03-01 |
WO2007002644A2 (en) | 2007-01-04 |
US20070007558A1 (en) | 2007-01-11 |
JP5600699B2 (ja) | 2014-10-01 |
US8129734B2 (en) | 2012-03-06 |
US20080296599A1 (en) | 2008-12-04 |
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