JP2017103381A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2017103381A JP2017103381A JP2015236373A JP2015236373A JP2017103381A JP 2017103381 A JP2017103381 A JP 2017103381A JP 2015236373 A JP2015236373 A JP 2015236373A JP 2015236373 A JP2015236373 A JP 2015236373A JP 2017103381 A JP2017103381 A JP 2017103381A
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- Prior art keywords
- light emitting
- mounting surface
- emitting device
- light
- hole
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
Description
12 絶縁基板
12a 枠部
12b 裏面
13 貫通孔
14 金属基板
15 実装部
15a 外周実装面
16a 第1段差実装面
16b 段差部
17a 第2段差実装面
17b 段差部
18 封止樹脂体
19a,19b 電極パッド
20 凹部
25 ワイヤ
26a,26b 電極パターン
27 発光素子
31,32,33 発光装置
35 実装部
35a 外周実装面
36a 段差実装面
41 発光装置
42 絶縁基板
44 金属基板
45 実装面
46a 第1段差実装面
46b 段差部
47a 第2段差実装面
47b 段差部
48 封止樹脂体
Claims (6)
- 中央に貫通孔を有する絶縁基板と、絶縁基板の裏面側に配置され前記貫通孔に露出する実装部を有する金属基板と、前記実装部に実装される複数の発光素子とを備えた発光装置において、
前記実装部は前記貫通孔の中心部と外周部とで発光素子を実装する高さ位置が異なる複数の段差実装面を有し、この複数の段差実装面が前記貫通孔の中心部より外周部の方が高くなっていることを特徴とする発光装置。 - 前記複数の段差実装面の高さ位置が前記貫通孔の中心部から外周部に向かって放射状に高くなっている請求項1に記載の発光装置。
- 前記複数の段差実装面はその間に設けられた段差部によって仕切られている請求項1又は2に記載の発光装置。
- 中央に貫通孔を有する絶縁基板と、絶縁基板の裏面側に配置され前記貫通孔に露出する実装部を有する金属基板と、前記実装部に実装される複数の発光素子とを備えた発光装置において、
前記実装部は前記貫通孔の中心部に設けられた第1段差実装面と、第1段差実装面の周縁を取り囲むように設けられ第1段差実装面より高い第2段差実装面とを有し、各段差実装面が段差部によって仕切られていることを特徴とする発光装置。 - 中央に貫通孔を有する絶縁基板と、絶縁基板の裏面側に配置され前記貫通孔に露出する実装部を有する金属基板と、前記実装部に実装される複数の発光素子とを備えた発光装置において、
前記実装部は前記貫通孔の中心部に設けられた第1段差実装面と、第1段差実装面の周縁を取り囲むように設けられ第1段差実装面より高い第2段差実装面と、第2段差実装面の周縁を取り囲むように設けられ第2段差実装面より高い外周実装面とを有し、各実装面が段差部によって仕切られていることを特徴とする発光装置。 - 前記段差部が垂直壁又は傾斜壁からなる請求項3乃至5のいずれかに記載の発光装置。
Priority Applications (1)
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JP2015236373A JP2017103381A (ja) | 2015-12-03 | 2015-12-03 | 発光装置 |
Applications Claiming Priority (1)
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JP2015236373A JP2017103381A (ja) | 2015-12-03 | 2015-12-03 | 発光装置 |
Publications (1)
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JP2017103381A true JP2017103381A (ja) | 2017-06-08 |
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JP2015236373A Pending JP2017103381A (ja) | 2015-12-03 | 2015-12-03 | 発光装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115831041A (zh) * | 2023-01-09 | 2023-03-21 | 北京数字光芯集成电路设计有限公司 | 一种阶梯式线阵MicroLED、扫描装置及扫描方法 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005158958A (ja) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | 発光装置 |
JP2007116125A (ja) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2007150233A (ja) * | 2005-11-02 | 2007-06-14 | Trion:Kk | 色温度可変発光デバイス |
JP2007220830A (ja) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
JP2008210568A (ja) * | 2007-02-23 | 2008-09-11 | Koizumi Lighting Technology Corp | 多点光源集積体の光源配置構造 |
JP2009502024A (ja) * | 2005-06-27 | 2009-01-22 | ラミナ ライティング インコーポレーテッド | 発光ダイオードパッケージ及びその製造方法 |
JP2009266974A (ja) * | 2008-04-23 | 2009-11-12 | Mitsubishi Electric Corp | 発光装置並びに発光器具 |
US20090302345A1 (en) * | 2008-06-06 | 2009-12-10 | Bill Chuang | Led lamp module and fabrication method thereof |
CN201412712Y (zh) * | 2009-06-10 | 2010-02-24 | 中国政法大学 | 密集封装的led光源 |
JP2011521448A (ja) * | 2008-05-13 | 2011-07-21 | シーメンス アクチエンゲゼルシヤフト | Ledアレイ |
JP2013162123A (ja) * | 2012-02-07 | 2013-08-19 | Lextar Electronics (Suzhou) Corp | 固体発光素子 |
DE102013201952A1 (de) * | 2013-02-06 | 2014-08-21 | Osram Gmbh | Halbleiter-Leuchtmodul mit lichtdurchlässiger Vergussmasse |
WO2014157905A1 (ko) * | 2013-03-25 | 2014-10-02 | 엘지이노텍(주) | 발광소자 패키지 |
JP2014192407A (ja) * | 2013-03-28 | 2014-10-06 | Citizen Electronics Co Ltd | 半導体発光装置 |
DE102013220674A1 (de) * | 2013-10-14 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Leuchtvorrichtung |
JP2015173193A (ja) * | 2014-03-12 | 2015-10-01 | シチズン電子株式会社 | 光源ユニット |
-
2015
- 2015-12-03 JP JP2015236373A patent/JP2017103381A/ja active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005158958A (ja) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | 発光装置 |
JP2009502024A (ja) * | 2005-06-27 | 2009-01-22 | ラミナ ライティング インコーポレーテッド | 発光ダイオードパッケージ及びその製造方法 |
JP2007116125A (ja) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2007150233A (ja) * | 2005-11-02 | 2007-06-14 | Trion:Kk | 色温度可変発光デバイス |
JP2007220830A (ja) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
JP2008210568A (ja) * | 2007-02-23 | 2008-09-11 | Koizumi Lighting Technology Corp | 多点光源集積体の光源配置構造 |
JP2009266974A (ja) * | 2008-04-23 | 2009-11-12 | Mitsubishi Electric Corp | 発光装置並びに発光器具 |
JP2011521448A (ja) * | 2008-05-13 | 2011-07-21 | シーメンス アクチエンゲゼルシヤフト | Ledアレイ |
US20090302345A1 (en) * | 2008-06-06 | 2009-12-10 | Bill Chuang | Led lamp module and fabrication method thereof |
CN201412712Y (zh) * | 2009-06-10 | 2010-02-24 | 中国政法大学 | 密集封装的led光源 |
JP2013162123A (ja) * | 2012-02-07 | 2013-08-19 | Lextar Electronics (Suzhou) Corp | 固体発光素子 |
DE102013201952A1 (de) * | 2013-02-06 | 2014-08-21 | Osram Gmbh | Halbleiter-Leuchtmodul mit lichtdurchlässiger Vergussmasse |
WO2014157905A1 (ko) * | 2013-03-25 | 2014-10-02 | 엘지이노텍(주) | 발광소자 패키지 |
JP2014192407A (ja) * | 2013-03-28 | 2014-10-06 | Citizen Electronics Co Ltd | 半導体発光装置 |
DE102013220674A1 (de) * | 2013-10-14 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Leuchtvorrichtung |
JP2015173193A (ja) * | 2014-03-12 | 2015-10-01 | シチズン電子株式会社 | 光源ユニット |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115831041A (zh) * | 2023-01-09 | 2023-03-21 | 北京数字光芯集成电路设计有限公司 | 一种阶梯式线阵MicroLED、扫描装置及扫描方法 |
CN115831041B (zh) * | 2023-01-09 | 2023-04-18 | 北京数字光芯集成电路设计有限公司 | 一种阶梯式线阵MicroLED、扫描装置及扫描方法 |
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