DE3115017A1 - Elektronisches bauelement - Google Patents

Elektronisches bauelement

Info

Publication number
DE3115017A1
DE3115017A1 DE19813115017 DE3115017A DE3115017A1 DE 3115017 A1 DE3115017 A1 DE 3115017A1 DE 19813115017 DE19813115017 DE 19813115017 DE 3115017 A DE3115017 A DE 3115017A DE 3115017 A1 DE3115017 A1 DE 3115017A1
Authority
DE
Germany
Prior art keywords
carrier
heat
semiconductors
integrated circuits
connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813115017
Other languages
English (en)
Inventor
Reinhard Stossun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19813115017 priority Critical patent/DE3115017A1/de
Publication of DE3115017A1 publication Critical patent/DE3115017A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE19813115017 1981-04-14 1981-04-14 Elektronisches bauelement Withdrawn DE3115017A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813115017 DE3115017A1 (de) 1981-04-14 1981-04-14 Elektronisches bauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813115017 DE3115017A1 (de) 1981-04-14 1981-04-14 Elektronisches bauelement

Publications (1)

Publication Number Publication Date
DE3115017A1 true DE3115017A1 (de) 1982-11-04

Family

ID=6130101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813115017 Withdrawn DE3115017A1 (de) 1981-04-14 1981-04-14 Elektronisches bauelement

Country Status (1)

Country Link
DE (1) DE3115017A1 (de)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3305167A1 (de) * 1983-02-15 1984-08-16 Bosch Gmbh Robert Elektrische schaltungsanordnung mit einer leiterplatte
FR2541511A1 (fr) * 1983-02-22 1984-08-24 Smiths Industries Plc Substrat pour support de circuits integres
EP0338447A2 (de) * 1988-04-21 1989-10-25 Bodenseewerk Gerätetechnik GmbH Vorrichtung zur Wärmeabfuhr von Bauelementen auf einer Leiterplatte
DE4010370A1 (de) * 1989-04-12 1990-10-18 Mitsubishi Electric Corp Halbleiterbauteil mit plattierter waermesenke und verfahren zu dessen herstellung
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
WO1993012539A1 (en) * 1991-12-19 1993-06-24 Raychem Corporation Thermal transfer posts for high density multichip substrates and formation method
EP0630176A1 (de) * 1993-06-14 1994-12-21 Blaupunkt-Werke GmbH Elektrische Baugruppe
WO1994029900A1 (en) * 1993-06-09 1994-12-22 Lykat Corporation Heat dissipative means for integrated circuit chip package
FR2706730A1 (fr) * 1993-06-18 1994-12-23 Sagem Module électronique de puissance ayant un support d'évacuation de la chaleur.
FR2708826A1 (fr) * 1993-08-06 1995-02-10 Bosch Gmbh Robert Appareil électrique, en particulier appareil de commutation ou de commande pour véhicules à moteur.
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package
DE19647916A1 (de) * 1996-11-20 1998-05-28 Ilfa Industrieelektronik Und L Leiterplattenanordnung
DE19654606A1 (de) * 1996-12-20 1998-07-02 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
US5939783A (en) * 1998-05-05 1999-08-17 International Business Machines Corporation Electronic package
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
US6222732B1 (en) 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
DE4222838C2 (de) * 1991-09-21 2002-03-28 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
DE4324210B4 (de) * 1992-07-17 2005-09-22 Papst Licensing Gmbh & Co. Kg Kühlanordnung für elektronische Leistungsbauelemente
EP2391192A1 (de) * 2010-05-26 2011-11-30 Jtekt Corporation Mehrschichtiges Leitungssubstrat
CN108099407A (zh) * 2016-11-25 2018-06-01 东芝泰格有限公司 液体喷射装置
DE10153173B4 (de) 2001-02-27 2019-09-05 Robert Bosch Gmbh Elektrischer Antrieb mit einem Wärmeleitelement zur Wärmeabführung von einer elektrischen Schaltung

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3305167A1 (de) * 1983-02-15 1984-08-16 Bosch Gmbh Robert Elektrische schaltungsanordnung mit einer leiterplatte
FR2541511A1 (fr) * 1983-02-22 1984-08-24 Smiths Industries Plc Substrat pour support de circuits integres
US5012387A (en) * 1988-04-21 1991-04-30 Bodenseewerk Geratetechnik Gmbh Printed circuit board with heat dissipating device
EP0338447A2 (de) * 1988-04-21 1989-10-25 Bodenseewerk Gerätetechnik GmbH Vorrichtung zur Wärmeabfuhr von Bauelementen auf einer Leiterplatte
DE3813364A1 (de) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech Vorrichtung zur waermeabfuhr von bauelementen auf einer leiterplatte
EP0338447A3 (de) * 1988-04-21 1990-10-03 Bodenseewerk Gerätetechnik GmbH Vorrichtung zur Wärmeabfuhr von Bauelementen auf einer Leiterplatte
US5138439A (en) * 1989-04-04 1992-08-11 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
DE4010370A1 (de) * 1989-04-12 1990-10-18 Mitsubishi Electric Corp Halbleiterbauteil mit plattierter waermesenke und verfahren zu dessen herstellung
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
DE4222838C2 (de) * 1991-09-21 2002-03-28 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
US6222732B1 (en) 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
EP0558712B2 (de) 1991-09-21 2010-04-07 Robert Bosch Gmbh Elektrisches gerät, insbesondere schalt- und steuergerät für kraftfahrzeuge
WO1993012539A1 (en) * 1991-12-19 1993-06-24 Raychem Corporation Thermal transfer posts for high density multichip substrates and formation method
DE4324210B4 (de) * 1992-07-17 2005-09-22 Papst Licensing Gmbh & Co. Kg Kühlanordnung für elektronische Leistungsbauelemente
WO1994029900A1 (en) * 1993-06-09 1994-12-22 Lykat Corporation Heat dissipative means for integrated circuit chip package
EP0630176A1 (de) * 1993-06-14 1994-12-21 Blaupunkt-Werke GmbH Elektrische Baugruppe
FR2706730A1 (fr) * 1993-06-18 1994-12-23 Sagem Module électronique de puissance ayant un support d'évacuation de la chaleur.
FR2708826A1 (fr) * 1993-08-06 1995-02-10 Bosch Gmbh Robert Appareil électrique, en particulier appareil de commutation ou de commande pour véhicules à moteur.
US5539618A (en) * 1993-08-06 1996-07-23 Robert Bosch Gmbh Electrical device, in particular switching or controlling device for motor vehicle
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19647916C2 (de) * 1996-11-20 1999-02-18 Ilfa Industrieelektronik Und L Leiterplattenanordnung
DE19647916A1 (de) * 1996-11-20 1998-05-28 Ilfa Industrieelektronik Und L Leiterplattenanordnung
US6116495A (en) * 1996-12-20 2000-09-12 Siemens Ag Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same
US5914861A (en) * 1996-12-20 1999-06-22 Siemens Ag Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
DE19654606A1 (de) * 1996-12-20 1998-07-02 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
US5939783A (en) * 1998-05-05 1999-08-17 International Business Machines Corporation Electronic package
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
DE10153173B4 (de) 2001-02-27 2019-09-05 Robert Bosch Gmbh Elektrischer Antrieb mit einem Wärmeleitelement zur Wärmeabführung von einer elektrischen Schaltung
EP2391192A1 (de) * 2010-05-26 2011-11-30 Jtekt Corporation Mehrschichtiges Leitungssubstrat
CN108099407A (zh) * 2016-11-25 2018-06-01 东芝泰格有限公司 液体喷射装置
CN108099407B (zh) * 2016-11-25 2019-11-19 东芝泰格有限公司 液体喷射装置

Similar Documents

Publication Publication Date Title
US5825625A (en) Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US5777844A (en) Electronic control with heat sink
US4763225A (en) Heat dissipating housing for an electronic component
US6365964B1 (en) Heat-dissipating assembly for removing heat from a flip chip semiconductor device
US2984774A (en) Transistor heat sink assembly
EP0527359B1 (de) Wärmeableiter
CA1297595C (fr) Circuit imprime equipe d'un drain thermique
KR0156013B1 (ko) 태브 집적회로에 대한 히트싱크 및 커버
KR940006251A (ko) 전자 소자용 냉각 장치
KR970077228A (ko) 반도체 장치 및 반도체 장치를 포함하는 구조물
US6581388B2 (en) Active temperature gradient reducer
US4029999A (en) Thermally conducting elastomeric device
KR970018887A (ko) 히트 싱크를 가지는 레이저 다이오드 소자
US5525428B1 (en) Substrate for semiconductor apparatus
GB2415293A (en) Electronic assembly with fluid cooling and associated methods
KR880001051A (ko) 히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장치
KR930005177A (ko) 3차원 멀티칩 모듈형 집적회로
EP0385605A3 (de) Zwischenteil zwischen einer integrierten Schaltung und einer Wärmesenke
US20050057903A1 (en) Cooling structure for electronic element
BR9901361A (pt) Aparelho eletrônico de resfriamento
IT1143676B (it) Processo per la fabbricazione di dispositivi microminiaturizzati a circuito integrato
MY118393A (en) An electronic package having active means to maintain its operating temperature constant
GB2358960B (en) Electrically isolated power semiconductor package
EP0350588A3 (de) Elektronische Packung mit verbesserter Wärmesenke
KR930005486B1 (ko) 전자기적 간섭, 정전방전, 극한 온도 및 기계적 쇼크보호용 회로 칩 패키지

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee