CN104918424A - Method for stabilizing size of circuit board with core boards of different thicknesses - Google Patents
Method for stabilizing size of circuit board with core boards of different thicknesses Download PDFInfo
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- CN104918424A CN104918424A CN201510383420.7A CN201510383420A CN104918424A CN 104918424 A CN104918424 A CN 104918424A CN 201510383420 A CN201510383420 A CN 201510383420A CN 104918424 A CN104918424 A CN 104918424A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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Abstract
The invention provides a method for stabilizing the size of a circuit board with core boards of different thicknesses, comprising the following steps: step 1, establishing correspondence tables of thick core board thickness, thin core board thickness, thick core board compensation coefficient and thin core board compensation coefficient under different hot melting temperatures according to the hot melting temperature needed for bonding sheets in the circuit board press-fitting process; step 2, selecting the corresponding correspondence table according to the actual hot melting temperature of a bonding sheet; step 3, determining the thick core board compensation coefficient and the thin core board compensation coefficient according to the thick core board thickness and the thin core board thickness in the correspondence table; and step 4, calculating the thick core board size and the thin core board size after compensation according to the predetermined sizes of thick and thin core boards and the thick core board compensation coefficient and the thin core board compensation coefficient. By adopting the method of the invention, the size of a multilayer special-structure printed circuit board can be controlled effectively, and the problem of layer offset caused by size difference between inner layers is solved effectively.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly a kind of circuit board size antihunt means with different-thickness central layer.
Background technology
Along with printing printed circuit board (PCB) is to multilayer, high-accuracy, light and thin type development, dimensionally stable has become exception as accompanying in shadow, constantly the stability of challenge product, the quality management and control of puzzlement high-order product, when dimensionally stable is as abnormal appearance, the destructive power that it causes is scrapped exactly.Except part can spend the redemption of large cost.There is no the possibility of heavy industry.
Multilayer printed circuit board structure is divided into two kinds: the special construction shown in the normal configuration shown in Fig. 1 and Fig. 2, and it is identical that the difference of two kinds of structures is only that normal configuration core thickness is, and special construction core thickness is different.In the multilayer special construction central layer shown in Fig. 1, comprise three layers of central layer, wherein, the thickness of central layer 1, central layer 2 and central layer 3 is 0.2mm.In the multilayer special construction central layer shown in Fig. 2, comprise three layers of central layer, wherein, the thickness of central layer 1 is 0.2mm, and the thickness of central layer 2 is 1.0mm, and the thickness of central layer 3 is 0.2mm.
Substrate is when dispatching from the factory, resin in substrate have passed through pressing and produces the process being subject to heat of solution cooling meat, it is also the process that substrate internal stress is formed in the process of cooling meat, stress forms the rear surperficial Copper Foil to substrate and pulls, Copper Foil defines drag in this link, and after two power slowly reach balance, size tends towards stability.But also have a factor (acid anhydrides is built) for impact in this process.Be present in the curing accelerator in resin, it is to the comparatively responsive facile hydrolysis of water.In the process that it is deposited at substrate slowly absorb water change both the change of power.So all impact can be there is on harmomegathus in the resting period of substrate in the different batches of substrate.
Lamination is indispensable manufacture link during PCB produces at many levels.Lamination completes the combination of multi-level circuit, the double-sided copper-clad substrate making reason limited, can be obtained the expansion of level quantity by lamination.Lamination by placing PP sheet (semi-solid preparation resin) between internal substrate, to the heating of these PP sheets, PP sheet is dissolved again subsequently, again cooled and solidified is carried out to it after dissolving and reach interlaminar bonding, this each process is again the process that an internal stress is formed, this time internal stress directly has influence on the quality that PCB manufactures, mainly can cause multilayer flaggy partially, size difference.So the condition making this power be formed is different, the size of power is not identical yet.
There is following shortcoming in prior art: the source that (1) copper-clad base plate is produced at printed circuit board does not obtain conservative control, causes producing printed circuit board many sizes; (2) special construction (namely having the board structure of circuit of different-thickness central layer) does not have rational correcting mode, makes to occur that layer is inclined at thin central layer (copper-clad plate as 0.2mm) and thick central layer when copper-clad plate pressing () as 1.0mm; (3) live at the mercy of the elements especially on multi-level special construction printed circuit board, reasonably do not control or modification method; (4) production and the quality of high-end printed circuit board is constrained.
Summary of the invention
The invention provides one to control effectively to multilayer special construction printed circuit board size, efficiently solve the circuit board size antihunt means with different-thickness central layer of the inclined problem of layer that size difference between interior-layer layer causes.
For solving the problem, as one aspect of the present invention, provide a kind of circuit board size antihunt means with different-thickness central layer, comprise: step 1, according to the heat of solution temperature that bonding sheet in press fit of circuit boards operation needs, set up the mapping table between the thick core thickness at different heat of solution temperature, thin core thickness and thick central layer penalty coefficient and thin central layer penalty coefficient; Step 2, according to the heat of solution temperature of actual bonding sheet, selects corresponding mapping table; Step 3, in this mapping table, determines thick central layer penalty coefficient and thin central layer penalty coefficient according to thick core thickness, thin core thickness; Step 4, according to the preliminary dimension of thick central layer and thin central layer and described thick central layer penalty coefficient and thin central layer penalty coefficient, the thick central layer size after calculation compensation and thin central layer size.
Preferably, described mapping table comprises: thick core thickness region, thin core thickness region, thin central layer penalty coefficient region and thick central layer coefficient region; Wherein, described thick core thickness region is arranged on left side one row in described thin central layer penalty coefficient region, described thin core thickness region is arranged on the top a line in described thin central layer penalty coefficient region, and the below a line in described thin central layer penalty coefficient region and right one row are respectively arranged with thick central layer coefficient region described in a line; When the crossover location be listed in described thin central layer penalty coefficient region at another thickness place in the row at a thickness place in described thick core thickness region and described thin core thickness region is the thin central layer pressing with the thick central layer of this thickness and this another thickness, the thin central layer penalty coefficient corresponding to thin central layer; When the row at a thickness place in described thick core thickness region and the correspondence position be listed in corresponding thick central layer coefficient region at another thickness place in described thin core thickness region are the thin central layer pressing with the thick central layer of this thickness with this another thickness, the thick central layer coefficient corresponding to thick central layer; Described thick central layer penalty coefficient obtains according to described thin central layer penalty coefficient and thick central layer coefficient calculations.
Preferably, the computing formula of described thick central layer penalty coefficient is as follows:
Thick central layer penalty coefficient=thin central layer penalty coefficient * (thick central layer coefficient+0.8)/2
Preferably, described thick central layer penalty coefficient comprises warp-wise thick central layer penalty coefficient and the thick central layer penalty coefficient of broadwise, and described thin central layer penalty coefficient comprises warp-wise thin central layer penalty coefficient and the thin central layer penalty coefficient of broadwise.
Preferably, described step 4 calculates the thick central layer size after described compensation and thin central layer size according to following formula:
A＝B(1+C/10000)
Wherein, A be compensate after thick central layer size or thin central layer size; B is the preliminary dimension of thick central layer or thin central layer; C is thick central layer penalty coefficient or thin central layer penalty coefficient.
Owing to have employed technique scheme, therefore, can control effectively to multilayer special construction printed circuit board size, efficiently solve the inclined problem of layer that size difference between interior-layer layer causes, thus improve the making yield of multilayer special construction printed circuit board, improve special multiple-plate making ability.
Accompanying drawing explanation
Fig. 1 such as to schematically show at the structural representation of the circuit board of core thickness;
Fig. 2 schematically shows the structural representation of the circuit board of different core thickness;
Fig. 3 schematically shows flow chart of the present invention.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
Its change in size difference can be completely different when producing for two kinds of structures in Fig. 1 and Fig. 2, due to the consistency of thickness of normal configuration central layer, therefore only need to consider that the residual copper of central layer is revised size impact.During special construction, need to consider that the power of thickness of slab on the stress and thick central layer that also need to consider other layer outside change in size impact is poor.But, but not for the solution of special construction in prior art.
Please refer to Fig. 3, the invention provides a kind of circuit board size antihunt means with different-thickness central layer, comprising:
Step 1, according to the heat of solution temperature that bonding sheet in press fit of circuit boards operation needs, sets up the mapping table between the thick core thickness at different heat of solution temperature, thin core thickness and thick central layer penalty coefficient and thin central layer penalty coefficient; Especially, this mapping table can according at heat of solution temperature different in bonding processes, and thick central layer and the thin central layer practical distortion amount on warp-wise and broadwise is determined through the mode of experiment.
As following two forms, respectively illustrate in an embodiment, when heat of solution temperature be more than or equal to 155 degrees Celsius and be less than 155 degrees Celsius time corresponding relation.
Table 1:TG (solution temperature of bonding sheet) >=155 DEG C of penalty coefficient tables:
Table 2:TG (solution temperature of bonding sheet) < 155 penalty coefficient table:
Visible in table 1 and table 2, compensation through broadwise is different, this is because bonding sheet warp-wise when making is subject to external force impact, when printed circuit makes, bonding sheet will dissolve and again solidify in bonding processes, so the change in size of warp-wise is greater than broadwise.
Step 2, according to the heat of solution temperature of actual bonding sheet, selects corresponding mapping table.If heat of solution temperature is more than or equal to 155 degrees Celsius, then select above-mentioned table 1, otherwise option table 2.
Step 3, in this mapping table, determines thick central layer penalty coefficient and thin central layer penalty coefficient according to thick core thickness, thin core thickness;
Step 4, according to the preliminary dimension of thick central layer and thin central layer and described thick central layer penalty coefficient and thin central layer penalty coefficient, the thick central layer size after calculation compensation and thin central layer size.
The film is the main tool that PCB produces, and carry the prime responsibility of PCB figure and picture transfer, the quality of the film directly affects the effect of graphic making, and the change in size of the film is also the change affecting PCB dimension of picture equally.Like this, the thick central layer size after the compensation calculated and the size of thin central layer size to the film can be utilized to revise, the change in size occurred during to utilize the film to prevent different core thickness to produce, cause layer inclined in order to avoid produce, the problems such as off normal.
Owing to have employed technique scheme, therefore, can control effectively to multilayer special construction printed circuit board size, efficiently solve the inclined problem of layer that size difference between interior-layer layer causes, thus improve the making yield of multilayer special construction printed circuit board.Owing to overcoming the inclined problem of layer, therefore, special multiple-plate making ability is improved, such as, originally need design to be more than or equal to the via hole of 10mil to be connected to conductor in the prior art, and by the method in the present invention, then only need to be more than or equal to 6mil.
Please refer to table 1 and Fig. 2, preferably, described mapping table comprises: thick core thickness region, thin core thickness region, thin central layer penalty coefficient region and thick central layer coefficient region; Wherein, described thick core thickness region is arranged on left side one row in described thin central layer penalty coefficient region, described thin core thickness region is arranged on the top a line in described thin central layer penalty coefficient region, and the below a line in described thin central layer penalty coefficient region and right one row are respectively arranged with thick central layer coefficient region described in a line;
When the crossover location be listed in described thin central layer penalty coefficient region at another thickness place in the row at a thickness place in described thick core thickness region and described thin core thickness region is the thin central layer pressing with the thick central layer of this thickness and this another thickness, the thin central layer penalty coefficient corresponding to thin central layer;
When the row at a thickness place in described thick core thickness region and the correspondence position be listed in corresponding thick central layer coefficient region at another thickness place in described thin core thickness region are the thin central layer pressing with the thick central layer of this thickness with this another thickness, the thick central layer coefficient corresponding to thick central layer;
Described thick central layer penalty coefficient obtains according to described thin central layer penalty coefficient and thick central layer coefficient calculations.
In table 1 and table 2, thick core thickness region is provided with multirow according to the difference of thickness, thin core thickness region is provided with multiple row according to the difference of thickness, thin central layer penalty coefficient region then presents corresponding with thick core thickness region and thin core thickness region latticed, and thick central layer coefficient region is the multirow corresponding with thick core thickness region or the multiple row corresponding with thin core thickness region.
During use, the row in thick core thickness region and the intersection point being listed in thin central layer penalty coefficient region in thin core thickness region are thin central layer penalty coefficient.Row corresponding to thick core thickness region in thick central layer coefficient region or the row corresponding with thin core thickness region are corresponding thick central layer coefficient.
Preferably, the computing formula of described thick central layer penalty coefficient is as follows:
Thick central layer penalty coefficient=thin central layer penalty coefficient * (thick central layer coefficient+0.8)/2 (formula 1)
Preferably, described thick central layer penalty coefficient comprises warp-wise thick central layer penalty coefficient and the thick central layer penalty coefficient of broadwise, and described thin central layer penalty coefficient comprises warp-wise thin central layer penalty coefficient and the thin central layer penalty coefficient of broadwise.
Preferably, described step 4 calculates the thick central layer size after described compensation and thin central layer size according to following formula:
A=B (1+C/10000) (formula 2)
Wherein, A be compensate after thick central layer size or thin central layer size; B is the preliminary dimension of thick central layer or thin central layer; C is thick central layer penalty coefficient or thin central layer penalty coefficient.By this formula, ten thousand/thick central layer penalty coefficient or thin central layer penalty coefficient times can be amplified to the warp-wise of central layer and broadwise, thus realize the function of compensation.
Below, with a specific embodiment, implementation process of the present invention is described.
Please refer to Fig. 2, in the multilayer special construction central layer shown in Fig. 2, comprise three layers of central layer, wherein, the thickness of central layer 1 is 0.2mm, and the thickness of central layer 2 is 1.0mm, and the thickness of central layer 3 is 0.2mm.Be provided with bonding sheet between adjacent central layer, such as, bonding sheet can be prepreg or PP.
Suppose that the bonding sheet TG value of the structure centre when pressing working procedure is produced in Fig. 2 is >=155 DEG C.
First, according to the solution temperature option table 1 of bonding sheet, and in thin core thickness region, find out row at the thickness place of 0.2mm.Then find out a line at 1.0mm thickness place in thick core thickness region then.Then, find the crossover location of these row and this row in thin central layer penalty coefficient region, thus the thin central layer penalty coefficient of the warp-wise obtaining thin central layer is 4.5, the thin central layer penalty coefficient of broadwise is 3.
Further, to find out in two thick central layer coefficient regions and arrange corresponding value 0.85 with one of the thin core thickness place of 0.2mm respectively, and the capable corresponding value 0.75 at thick central layer place with 1.0mm thickness.
Formula 1 is utilized to calculate the penalty coefficient of thick central layer:
Thick central layer penalty coefficient=4.5* (the 0.85+0.8)/2=3.7 of warp-wise
Thick central layer penalty coefficient=3* (the 0.85+0.8)/2=2.5 of broadwise
Suppose that central layer is of a size of warp-wise 20 inches, broadwise 18 inches, that use formula 2 compensates calculating:
(1) central layer of 0.2mm thickness of slab
Warp-wise size=20/10000*4.5+20=20.009 inch, is namely exaggerated 4.5/10000ths to the size of warp-wise
Broadwise size=18/10000*3+18=18.0054 inch, is namely exaggerated 3/10000ths to the size of broadwise
(2) central layer of 1.0mm thickness of slab
Warp-wise size=20/10000*3.7+20=20.0074 inch, is namely exaggerated 3.7/10000ths to the size of warp-wise
Broadwise size=18/10000*2.5+18=18.0045 inch, is namely exaggerated 2.5/10000ths to the size of broadwise
Like this, the compensation of two kinds of thickness core plate structures completes, and makes by the result of above-mentioned calculating.
Concrete manufacturing process can be as follows:
Step 1, sawing sheet uses plate shearing machine sawing sheet according to design size.
Step 2, carries out after sawing sheet toasting and carries out baking 2 hours according to the GT of copper-clad plate itself, has reached and has removed central layer inherent strain.
Step 3, internal layer circuit makes, and uses the data after pre-compensation (have engineering to follow to carry out size according to upper table to internal layer circuit data large in advance, ensure that after pressing printed circuit board is of a size of customer requirement) to make.
Step 4, the pressing of pressing normal mode.
Step 5, the printed circuit board through above-mentioned technique also needs to make according to the existing production procedure of industry, comprises boring, heavy copper, plate electricity, outer-layer circuit, welding resistance, silk-screen character, sharp processing, electric performance test, and the operation such as Surface testing.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. there are circuit board size antihunt means for different-thickness central layer, it is characterized in that, comprising:
Step 1, according to the heat of solution temperature that bonding sheet in press fit of circuit boards operation needs, sets up the mapping table between the thick core thickness at different heat of solution temperature, thin core thickness and thick central layer penalty coefficient and thin central layer penalty coefficient;
Step 2, according to the heat of solution temperature of actual bonding sheet, selects corresponding mapping table;
Step 3, in this mapping table, determines thick central layer penalty coefficient and thin central layer penalty coefficient according to thick core thickness, thin core thickness;
Step 4, according to the preliminary dimension of thick central layer and thin central layer and described thick central layer penalty coefficient and thin central layer penalty coefficient, the thick central layer size after calculation compensation and thin central layer size.
2. method according to claim 1, is characterized in that, described mapping table comprises: thick core thickness region, thin core thickness region, thin central layer penalty coefficient region and thick central layer coefficient region; Wherein, described thick core thickness region is arranged on left side one row in described thin central layer penalty coefficient region, described thin core thickness region is arranged on the top a line in described thin central layer penalty coefficient region, and the below a line in described thin central layer penalty coefficient region and right one row are respectively arranged with thick central layer coefficient region described in a line;
When the crossover location be listed in described thin central layer penalty coefficient region at another thickness place in the row at a thickness place in described thick core thickness region and described thin core thickness region is the thin central layer pressing with the thick central layer of this thickness and this another thickness, the thin central layer penalty coefficient corresponding to thin central layer;
When the row at a thickness place in described thick core thickness region and the correspondence position be listed in corresponding thick central layer coefficient region at another thickness place in described thin core thickness region are the thin central layer pressing with the thick central layer of this thickness with this another thickness, the thick central layer coefficient corresponding to thick central layer;
Described thick central layer penalty coefficient obtains according to described thin central layer penalty coefficient and thick central layer coefficient calculations.
3. according to the method described in claim 1 to 2, it is characterized in that, the computing formula of described thick central layer penalty coefficient is as follows:
Thick central layer penalty coefficient=thin central layer penalty coefficient * (thick central layer coefficient+0.8)/2.
4. the method according to claims 1 to 3, it is characterized in that, described thick central layer penalty coefficient comprises warp-wise thick central layer penalty coefficient and the thick central layer penalty coefficient of broadwise, and described thin central layer penalty coefficient comprises warp-wise thin central layer penalty coefficient and the thin central layer penalty coefficient of broadwise.
5. the method according to Claims 1-4, is characterized in that, described step 4 calculates the thick central layer size after described compensation and thin central layer size according to following formula:
A＝B(1+C/10000)
Wherein, A be compensate after thick central layer size or thin central layer size; B is the preliminary dimension of thick central layer or thin central layer; C is thick central layer penalty coefficient or thin central layer penalty coefficient.
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| CN111372394A (en) * | 2020-03-13 | 2020-07-03 | 江西景旺精密电路有限公司 | Method for improving deviation of multilayer PCB (printed circuit board) and multilayer PCB |
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