CN103188892B - Multi-layer PCB manufacture method and device and thickness estimation method and apparatus thereof - Google Patents

Multi-layer PCB manufacture method and device and thickness estimation method and apparatus thereof Download PDF

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Publication number
CN103188892B
CN103188892B CN201110461581.5A CN201110461581A CN103188892B CN 103188892 B CN103188892 B CN 103188892B CN 201110461581 A CN201110461581 A CN 201110461581A CN 103188892 B CN103188892 B CN 103188892B
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China
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thickness
layer
metal
metal level
central layer
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Expired - Fee Related
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CN201110461581.5A
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CN103188892A (en
Inventor
柳良平
李国军
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Hangzhou Fangzheng Su'neng Technology Co Ltd
Peking University Founder Group Co Ltd
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Hangzhou Fangzheng Su'neng Technology Co Ltd
Peking University Founder Group Co Ltd
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Publication of CN103188892A publication Critical patent/CN103188892A/en
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Abstract

The invention provides the manufacture method of a kind of multi-layer PCB and device, method includes: obtain the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；Selection thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；Carry out pressing to make multi-layer PCB。The invention provides the thickness estimation method and apparatus of a kind of multi-layer PCB, method includes: obtain the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；Determine the gross thickness H=∑ H of multi-layer PCBMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。The present invention improves the fabricating quality of multi-layer PCB。

Description

Multi-layer PCB manufacture method and device and thickness estimation method and apparatus thereof
Technical field
The present invention relates to art of printed circuit boards, in particular to the manufacture method of a kind of multi-layer PCB and device and thickness estimation method and apparatus thereof。
Background technology
Fig. 1 illustrates the structural representation of a kind of four layers of PCB。These four layers of PCB include from outside to inside: M1, M2 are the Copper Foil of outer layer, C1 is core material, the metal level of L1, L2 respectively central layer C1 both sides, P1, P2 respectively metal level L1, L2 surface PP sheet for bonding, by PP sheet P1, P2 bonding between M1, C1, M2。
The thickness of slab of multi-layer PCB directly influences the size of electronic product。It addition, heat dispersion and the impedance behavior of electronic product are all had a great impact by the thickness of the dielectric layer of multi-layer PCB (i.e. PP)。
When making multi-layer PCB, in order to meet the requirement to product size and electric property, it is to avoid product thickness exceeds standard, it is necessary to select the Copper Foil of suitable thickness and PP to carry out pressing。
Summary of the invention
It is desirable to provide the manufacture method of a kind of multi-layer PCB and thickness estimation method thereof, to make the multi-layer PCB of qualified thickness。
In an embodiment of the present invention, it is provided that the manufacture method of a kind of multi-layer PCB, including: obtain require total thickness of slab H, each central layer Cj plate core thickness HCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；Selection thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；Carry out pressing to make multi-layer PCB。
In an embodiment of the present invention, it is provided that a kind of thickness estimation method of multi-layer PCB, including: obtain the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；Determine the gross thickness H=∑ H of multi-layer PCBMk+∑HLLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
In an embodiment of the present invention, it is provided that the producing device of a kind of multi-layer PCB, including: acquisition module, for obtaining the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；Selecting module, being used for selecting thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；Pressing module, is used for carrying out pressing to make multi-layer PCB。
In an embodiment of the present invention, it is provided that the thickness estimation device of a kind of multi-layer PCB, including: acquisition module, for obtaining the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；Determine module, for determining the gross thickness H=∑ H of multi-layer PCBMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
The manufacture method of the multi-layer PCB of the above embodiment of the present invention and device and thickness estimation method and apparatus thereof are because adopting the thickness of rational formula assessment multi-layer PCB, so improve the fabricating quality of multi-layer PCB。
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the application, and the schematic description and description of the present invention is used for explaining the present invention, is not intended that inappropriate limitation of the present invention。In the accompanying drawings:
Fig. 1 illustrates the structural representation of a kind of four layers of PCB；
Fig. 2 illustrates the flow chart of the manufacture method of a kind of multi-layer PCB according to embodiments of the present invention；
Fig. 3 illustrates the flow chart of the thickness estimation method of a kind of multi-layer PCB according to embodiments of the present invention；
Fig. 4 illustrates the schematic diagram of the producing device of a kind of multi-layer PCB according to embodiments of the present invention；
Fig. 5 illustrates the schematic diagram of the thickness estimation device of a kind of multi-layer PCB according to embodiments of the present invention；
Fig. 6 illustrates the structural representation of a kind of four layers of PCB according to embodiments of the present invention。
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, the present invention is described in detail。
Fig. 2 illustrates the flow chart of the manufacture method of a kind of multi-layer PCB according to embodiments of the present invention, including:
Step S10, obtains the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；
Step S20, selection thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet the computing formula H >=∑ H setMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；
Step S30, carries out pressing to make multi-layer PCB。
Fig. 3 illustrates the flow chart of the thickness estimation method of a kind of multi-layer PCB according to embodiments of the present invention, including:
Step S15, obtains the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；
Step S25, it is determined that the gross thickness H=∑ H of multi-layer PCBMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
Fig. 4 illustrates the schematic diagram of the producing device of a kind of multi-layer PCB according to embodiments of the present invention, including:
Acquisition module 10, for obtaining the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；
Selecting module 20, being used for selecting thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；
Pressing module 30, is used for carrying out pressing to make multi-layer PCB。
Fig. 5 illustrates the schematic diagram of the thickness estimation device of a kind of multi-layer PCB according to embodiments of the present invention, including:
Acquisition module 15, for obtaining the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；
Determine module 25, for determining the gross thickness H=∑ H of multi-layer PCBMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
The manufacture method of the multi-layer PCB of the above embodiment of the present invention and device and thickness estimation method and apparatus thereof are because adopting the thickness of rational formula assessment multi-layer PCB, so improve the fabricating quality of multi-layer PCB。
Fig. 6 illustrates the structural representation of a kind of four layers of PCB according to embodiments of the present invention。
Getting M1=M2=12 μm, L1=L2=35 μm, core thickness 380 μm, the PP2116RC56 theoretical pressing thickness under 100% residual copper rate is 105 μm。
It addition, getting the residual copper rate of L1 layer is 70%, obtaining the residual copper rate of L2 layer is 80%。
Finally, it can be estimated that going out the theoretical thickness of slab after four laminate pressings is H=12+105-35 (1-0.7)+35+380+35+105-35 (1-0.8)+12=666.5 μm。
By means of the invention it is possible to fast and effeciently select suitable Copper Foil and PP to meet client's requirement to thickness, the gross thickness of multi-layer PCB also can be evaluated before pressing in advance。
As can be seen from the above description, the present invention dimensional requirement according to client, it is possible to select the Copper Foil for lamination and PP sheet rapidly and accurately；Precision is high, and result of calculation is little with actual value error；Calculating process is simple。
Obviously, those skilled in the art should be understood that, each module of the above-mentioned present invention or each step can realize with general calculation element, they can concentrate on single calculation element, or it is distributed on the network that multiple calculation element forms, alternatively, they can realize with the executable program code of calculation element, thus, can be stored in storage device is performed by calculation element, or they are fabricated to respectively each integrated circuit modules, or the multiple modules in them or step are fabricated to single integrated circuit module realize。So, the present invention is not restricted to the combination of any specific hardware and software。
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations。All within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention。

Claims (4)

1. the manufacture method of a multilayer board, it is characterised in that including:
Obtain the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；
Selection thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；
Carry out pressing to make described multilayer board。
2. the thickness estimation method of a multilayer board, it is characterised in that including:
Obtain the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；
Determine the gross thickness H=∑ H of described multilayer boardMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
3. the producing device of a multilayer board, it is characterised in that including:
Acquisition module, for obtaining the plate core thickness H of total thickness of slab H of requirement, each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri；
Selecting module, being used for selecting thickness is HpiEach PP sheet Pi be individually positioned in the surface of each metal level Li, thickness is HMkMetal forming Mk be placed on outer layer, wherein, HpiAnd HMkMeet H >=∑ HMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]；
Pressing module, is used for carrying out pressing to make described multilayer board。
4. the thickness estimation device of a multilayer board, it is characterised in that including:
Acquisition module, for obtaining the plate core thickness H of each central layer CjCj, each central layer Cj the thickness H of metal level LiLiAnd metal residual rate Ri, it is placed on the thickness H of the metal forming Mk of outer layerMk, and be placed on the thickness H of each PP sheet Pi on surface of each metal level Lipi；
Determine module, for determining the gross thickness H=∑ H of described multilayer boardMk+∑HLi+∑Hcj+∑[Hpi-HLi(1-Ri)]。
CN201110461581.5A 2011-12-30 2011-12-30 Multi-layer PCB manufacture method and device and thickness estimation method and apparatus thereof Expired - Fee Related CN103188892B (en)

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CN103442517B (en) * 2013-08-27 2016-04-06 无锡市同步电子科技有限公司 A kind of printed circuit board weight predictor method
CN107995779B (en) * 2017-12-29 2020-06-16 江苏弘信华印电路科技有限公司 Design method for improving flatness of rigid-flexible combined plate
CN110022648A (en) * 2018-01-08 2019-07-16 深南电路股份有限公司 A kind of back drilling method and system of PCB
CN111295053B (en) * 2020-03-31 2021-07-16 生益电子股份有限公司 PCB (printed circuit board) with embedded heat conductor and preparation method thereof
CN112188761A (en) * 2020-09-30 2021-01-05 生益电子股份有限公司 PCB processing method and PCB

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CN101656235A (en) * 2009-10-19 2010-02-24 厦门市英诺尔电子科技有限公司 Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof

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KR20080024627A (en) * 2006-09-14 2008-03-19 삼성전기주식회사 Multi layer printed circuit board and manufacturing method thereof
JP2009016818A (en) * 2007-07-04 2009-01-22 Samsung Electro-Mechanics Co Ltd Multilayer printed circuit board and method of manufacturing the same

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CN101656235A (en) * 2009-10-19 2010-02-24 厦门市英诺尔电子科技有限公司 Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof

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