CN101656235A - Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof - Google Patents

Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof Download PDF

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Publication number
CN101656235A
CN101656235A CN200910180503A CN200910180503A CN101656235A CN 101656235 A CN101656235 A CN 101656235A CN 200910180503 A CN200910180503 A CN 200910180503A CN 200910180503 A CN200910180503 A CN 200910180503A CN 101656235 A CN101656235 A CN 101656235A
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microns
support plate
thickness
layer
encapsulating carrier
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CN200910180503A
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CN101656235B (en
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李金华
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XIAMEN CITY INNOV ELECTRONICS TECHNOLOGY Co Ltd
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XIAMEN CITY INNOV ELECTRONICS TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

The invention relates to a flex-rigid integrated circuit (IC) package substrate and a manufacturing method thereof. Aiming at improving the product quality and the product performance of the multi-layer integrated circuit package substrate, the invention adopts a high-Tg nonflowing PP sheet and pure copper foil materials and the newest wire bonding surface treatment technology and the automatic alignment and parallel exposure technology so that the minimum wire width/wire pitch of the substrate reaches 30 microns/30 microns, the pitch reaches 60 microns, the total thickness of four layers of flex-rigid substrates is less than or equal to 240 microns and the thickness tolerance is controlled within +/-5 microns. By adopting a method for combining ultraviolet with CO2 laser and a copper foiletching alignment technology, the invention can effectively avoid the problem of ensuring the drilling accuracy of blind holes by controlling the uniformity of the product thickness and improve the yield of blind buried drilling holes at 1 to 3 layers and 1 to 4 layers of four-order flex-rigid substrate products with the thickness of 240 microns by more than 30 percent.

Description

Flex-rigid road (IC) encapsulating carrier plate and manufacture method thereof
Technical field
The present invention relates to printed circuit board (PCB) base plate for packaging field, particularly a kind of flex-rigid road (IC) encapsulating carrier plate and manufacture method thereof.
Background technology
In recent years, use the flex-rigid multiple-layer circuit board on the folding mobile phone.The flex-rigid multiple-layer circuit board of prior art is by pre-soaked resin (PP sheet) adhesive sheet etc. of living, to form flexible substrate hot press that circuit forms on the base material of bending property excellences such as polyimide resin film or polyester resin film in forming on the hard substrates such as glass epoxy resin, glass polyimide resin between the rigid substrates that circuit forms, then, through perforate, electroplate, apply resist, operations such as etching are made.
Adopt polyimides as the intermediate insulation body in the middle of the prior art, and adopt epoxy resin as support, so that product has certain rigidity, but make and produce in the prior art to such an extent that have multilayer and get rigid-flexible circuit board and get thickness more than 800 microns, and the glass epoxy resin that prior art adopted is in uneven thickness, making needs to rely on control product thickness uniformity to guarantee that the blind hole borehole accuracy is difficult to realize, thereby influences properties of product and yield.In existing manufacturing process, usually adopt the Ultra-Violet Laser drilling technique, because when adopting the Ultra-Violet Laser drilling technique, can cause form unnecessary noise (i.e. boring the time can have influence on the circuit of other layer) in the multilayered rigidity and flexibility circuit board thus can cause line layer with layer between short circuit or open circuit, cause scrapping of product, have influence on production efficiency.
Summary of the invention
Technical problem to be solved by this invention is: the problem that the product thickness of producing at prior art is thicker, the present invention can provide to have has the more flex-rigid multiple-layer IC base plate for packaging of minimal thickness compared to prior art, thereby reach the thinner chip support plate of production, the consumer is light for associated electrical products such as mobile phones to satisfy, the requirement of thinning.
The present invention can also solve owing to need to rely on control product thickness uniformity to guarantee that the blind hole borehole accuracy is to poor efficiency of bringing on the production technology and product yield.
A kind of multilayered rigidity and flexibility mating type printed circuit of the present invention (IC) encapsulating carrier plate, do not flow PP sheet and the pure copper foil material that adopt high Tg are as base material, it is characterized in that: this support plate minimum feature and minimum line distance are 30 microns all, and the central point distances (pitch) each other of adjacent each bars finger of two fingers are 60 microns on the support plate.
Encapsulating carrier plate of the present invention, this support plate is 4 layers, and the thickness of support plate≤240 micron, simultaneously the thickness deviation of support plate be controlled at ± 5 microns, and thickness is that 240 microns the quadravalence rigid-flexible support plate 1-3 layer and the blind bury drills hole yield of 1-4 layer promote more than 30%.
The manufacture method of a kind of multilayered rigidity and flexibility mating type printed circuit of the present invention (IC) encapsulating carrier plate, do not flow PP sheet and the pure copper foil material of having taked high Tg are as base material, adopt automatic contraposition and parallel exposure technique and gold thread binding process for treating surface, and adopt ultraviolet and CO 2The method that laser combines is by the Copper Foil etching technology of stepping down, do not rely on control support plate thickness evenness to guarantee the blind hole borehole accuracy, make that support plate minimum feature and minimum line distance is 30 microns all, and the central point distance (pitch) each other of two adjacent each bar circuits of circuit is 60 microns on the support plate.
The manufacture method of encapsulating carrier plate of the present invention, this support plate are 4 layers, and the thickness of support plate≤240 micron, simultaneously the thickness deviation of support plate be controlled at ± 5 microns.Thickness is that the blind bury drills hole yield of 1～3 layer of the rigid-flexible support plate of 240 microns quadravalence and 1～4 layer promotes more than 30%.
Flex-rigid road (IC) encapsulating carrier plate and manufacture method thereof that manufacturing of the present invention is come out, live width, line-spacing by reasonable Arrangement make product have thin thickness, in this external production technology, for the control of noise and product yield requirement improve greatly.
Description of drawings
Fig. 1: be to be applicable to the blind schematic cross-section that buries flex-rigid road (IC) encapsulating carrier plate of high Tg quadravalence of the present invention;
Fig. 2: be the schematic cross-section that is applicable to the blind buried via hole of the description position of flex-rigid of the present invention road (IC) encapsulating carrier plate;
Fig. 3: be that the Pitch position that is applicable to flex-rigid of the present invention road (IC) encapsulating carrier plate concerns schematic diagram;
Fig. 4: be the product cut-away view that is applicable to flex-rigid of the present invention road (IC) encapsulating carrier plate.
Embodiment
The present invention relates to a kind of flex-rigid road (IC) encapsulating carrier plate and manufacture method thereof, for product quality and the properties of product that improve the multilayer printed circuit encapsulating carrier plate, the present invention has taked do not flow PP sheet and the pure copper foil material of high Tg, adopt Wire bonding process for treating surface and contraposition and parallel exposure technique automatically, make support plate minimum feature/line-spacing reach 30 microns/30 microns, pitch reaches 60 microns, the wherein thickness of 4 layers of rigid-flexible support plate≤240 micron, and thickness deviation are controlled at ± and 5 microns.The present invention has adopted ultraviolet and CO 2Method that laser combines and the Copper Foil etching technology of stepping down, avoided need relying on control product thickness uniformity guarantee the blind hole borehole accuracy effectively, making thickness is that 240 microns the rigid-flexible support plate product of quadravalence 1-3 layer and the blind bury drills of 1-4 layer hole yield promotes more than 30%.
In order to further specify the present invention, be illustrated by specific embodiment now: Fig. 1 is applicable to the blind schematic cross-section that buries flex-rigid road (IC) encapsulating carrier plate of high Tg quadravalence of the present invention; Wherein this base plate for packaging has following hierarchical structure: adopt the two-sided copper etching of no glue to form the line layer copper layer 5 of circuit as internal layer circuit such as Fig. 1, insulating barrier PI layer 6 and line layer copper layer 7, the copper layer 5 that is forming then, be symmetrically formed layer of prepreg 4,8 on PI layer 6 and the copper layer 7 successively, the second bronze medal layer 3,9, copper coating layer 2,10 and black press polish welding resistance invisible ink layer 1,11, final formation has the blind structure of burying flex-rigid road (IC) encapsulating carrier plate of high Tg quadravalence.
Accompanying drawing 2 has been put down in writing the generation type of blind hole position, wherein the bilateral symmetry at PI layer 4 forms copper layer 3,5, thereby and then be symmetrically formed layer of prepreg 2,6 and copper layer 1,7 successively and constitute blind holes and form the basis, for convenience the layer structure in the accompanying drawing 2 is designated as: the 1st layer (corresponding to copper layer 1), the 2nd layer (corresponding to semi-solid preparation layer 2), the 3rd layer (corresponding to copper layer 3), the 4th layer (corresponding to the PI layer), the 5th layer (corresponding to copper layer 5), the 6th layer (corresponding to semi-solid preparation layer 6) and the 7th layer (corresponding to copper layer 7).Wherein the left hand view of Fig. 2 described about among the present invention through hole run through copper layer 3,5 and
PI layer 4 is to be used for conducting by this regional circuit; The figure of the centre of Fig. 2 has described and has adopted Ultra-Violet Laser and CO among the present invention 2Thereby forming the 1st layer to the 7th layer blind hole, the laser drill mode makes the the the 1st, the 3rd, the 5th, the 7th layer of conducting circuit, but this moment the 7th layer of not breakdown formation blind hole, this be since the 7th layer be to be used to finally to contact that the base plate for packaging at its place uses such as the junction of products such as mobile phone, if breakdown accidentally, can influence the performance of entire I C support plate in its applied product because the 7th laminar surface is rough.The accompanying drawing on Fig. 2 right side has been put down in writing and has been formed on the 1st layer to the 5th layer blind hole, thereby because has avoided the conducting of 6-7 layer to make the 5th layer circuit and the 7th layer circuit form short circuit like this.
Fig. 3 understands the locations of structures of Pitch of the present invention specifically, and wherein the side on the shaping limit forms a plurality of fingers among Fig. 3, has explained the line-spacing S=30 micron between each finger; The live width of finger is 30 microns, simultaneously, if with the center of each finger as nominal, the spacing at the center of adjacent finger is designated as Pitch, Pitch is 60 microns.
Fig. 4 understands specifically that also the live width that satisfies simultaneously between the finger and line-spacing all are that 30 microns and Pitch are 60 microns blind flex-rigid road (IC) encapsulating carrier plate that buries of of the present invention high Tg quadravalence.
Manufacturing process of the present invention adopts following process mode:
Open material → boring (corresponding to Fig. 2 left hand view explanation) → internal layer circuit (forming) → ectonexine and fit that (Reference numeral is that 4 and 5 and 7 and 8 applying belongs to internal layer and fits among Fig. 1 by etching; 3 and 4 and 8 and 9 applying belongs to outer and fits) → lamination → CO 2Laser and Ultra-Violet Laser boring → heavy copper facing (being used for conducting between the through hole of the circuit between layer and the layer or the blind hole) → outer-layer circuit (promptly forming) → outer welding resistance printing ink (forming) → surface treatment (be used for protecting pad to be easy to and the binding of IC plate such as surface gold-plating, silver-plated, nickel plating, the while surface treatment also will be handled finger) → character silk printing → electric performance test → visual examination → packing by printing, exposure by etching.
Hierarchical specification among Fig. 1:
1, black matt welding resistance invisible ink is 15 microns
2, copper coating thickness is 15 microns
3, CU (copper) is 18 microns
4, prepreg is 50 microns
5, CU (copper) is 12 microns
6, PI is 15 microns
7, CU (copper) is 12 microns
8, prepreg is 50 microns
9, CU (copper) is 18 microns
10, copper coating thickness is 15 microns
11, black matt welding resistance invisible ink is 15 microns.

Claims (8)

1. a multilayered rigidity and flexibility mating type printed circuit (IC) encapsulating carrier plate, do not flow PP sheet and the pure copper foil material that adopt high Tg are as base material, it is characterized in that: this support plate minimum feature and minimum line distance are 30 microns all, and the central point distance (pitch) each other of two adjacent each bar circuits of circuit is 60 microns on the support plate.
2. encapsulating carrier plate according to claim 1 is characterized in that: this support plate is 4 layers.
3. encapsulating carrier plate according to claim 2 is characterized in that: the thickness of support plate≤240 micron, simultaneously the thickness deviation of support plate be controlled at ± 5 microns.
4. encapsulating carrier plate according to claim 3 is characterized in that: thickness is that the blind bury drills hole yield of 240 microns quadravalence rigid-flexible support plate 1-3 layer and 1-4 layer promotes more than 30%.
5. the manufacture method of a multilayered rigidity and flexibility mating type printed circuit (IC) encapsulating carrier plate, do not flow PP sheet and the pure copper foil material of having taked high Tg are as base material, adopt automatic contraposition and parallel exposure technique and gold thread binding process for treating surface, the Copper Foil etching technology of stepping down, and adopt ultraviolet and CO 2The method that laser drill combines is passed through, do not rely on control support plate thickness evenness to guarantee the blind hole borehole accuracy, make that support plate minimum feature and minimum line distance is 30 microns all, and the central point distances (pitch) each other of adjacent each bars finger of two fingers are 60 microns on the support plate.
6. the manufacture method of encapsulating carrier plate according to claim 5, it is characterized in that: this support plate is 4 layers.
7. the manufacture method of encapsulating carrier plate according to claim 6 is characterized in that; The thickness of support plate≤240 micron, simultaneously the thickness deviation of support plate be controlled at ± 5 microns.
8. the manufacture method of encapsulating carrier plate according to claim 7 is characterized in that: thickness is that the blind bury drills hole yield of 240 microns quadravalence rigid-flexible support plate 1-3 layer and 1-4 layer promotes more than 30%.
CN200910180503.0A 2009-10-19 2009-10-19 Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof Active CN101656235B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102740598A (en) * 2011-04-13 2012-10-17 昆山华晨电子有限公司 Three-layer anti-fake label PCB plate and preparation process thereof
CN103188892A (en) * 2011-12-30 2013-07-03 北大方正集团有限公司 Method and device for manufacturing multi-layer PCB (Printed Circuit Board) and thickness estimating method and thickness estimating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330805A (en) * 2007-06-18 2008-12-24 比亚迪股份有限公司 Method for preparing firm flexible printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330805A (en) * 2007-06-18 2008-12-24 比亚迪股份有限公司 Method for preparing firm flexible printed board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DKN RESEARCH,NY INDUSTRY: "Total Printing Process Technologies for Advanced High Density Printable Flexible Electronics", 《NEWS RELEASE FROM DKN RESEARCH & NY INDUSTRY》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102740598A (en) * 2011-04-13 2012-10-17 昆山华晨电子有限公司 Three-layer anti-fake label PCB plate and preparation process thereof
CN102740598B (en) * 2011-04-13 2016-06-22 昆山华晨电子有限公司 Three layers security label PCB and preparation technology thereof
CN103188892A (en) * 2011-12-30 2013-07-03 北大方正集团有限公司 Method and device for manufacturing multi-layer PCB (Printed Circuit Board) and thickness estimating method and thickness estimating device
CN103188892B (en) * 2011-12-30 2016-06-22 北大方正集团有限公司 Multi-layer PCB manufacture method and device and thickness estimation method and apparatus thereof

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Address after: 361000, No. 101, No. 1 Xiang Xiang Road, torch hi tech Zone (Xiangan), Xiamen, Fujian

Applicant after: Xiamen Innov Electronic Technology Co., Ltd.

Address before: 361009 No. 1 Xiang Xiang Road, Torch Industrial Zone, Xiamen, Fujian, Xiamen, Xiangan

Applicant before: Xiamen City Innov Electronics Technology Co., Ltd.

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Free format text: CORRECT: APPLICANT; FROM: XIAMEN CITY INNOV ELECTRONICS TECHNOLOGY CO., LTD. TO: XIAMEN INNOV ELECTRONICS TECHNOLOGY CO., LTD.

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