KR20100073362A - Printed circuit board with enhanced radiating ability and manufacturing process of the same - Google Patents

Printed circuit board with enhanced radiating ability and manufacturing process of the same Download PDF

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KR20100073362A
KR20100073362A KR1020080132012A KR20080132012A KR20100073362A KR 20100073362 A KR20100073362 A KR 20100073362A KR 1020080132012 A KR1020080132012 A KR 1020080132012A KR 20080132012 A KR20080132012 A KR 20080132012A KR 20100073362 A KR20100073362 A KR 20100073362A
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South Korea
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copper plate
copper
hole
circuit board
printed circuit
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KR1020080132012A
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Korean (ko)
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KR101049228B1 (en
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안복만
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안복만
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias

Abstract

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve a radiating property by arranging a thick copper plate between a pair of copper foils. CONSTITUTION: A printed circuit board includes a copper plate(12) and a pair of copper foils(22,22'). The copper plate relatively has a big thickness. A penetration hole(14) is formed on the copper plate due to a press punching. The penetration hole is filled with an epoxy resin(16). A via hole(18) forms in center of the epoxy resin. A pair of copper foils is respectively laminated on both sides of the copper plate due to prepregs(20,20'). A conductor pattern is formed on the surface of the copper plate.

Description

방열특성이 향상된 인쇄회로기판 및 그 제조방법{Printed circuit board with enhanced radiating ability and manufacturing process of the same}Printed circuit board with enhanced radiating ability and manufacturing process of the same}

본 발명은 방열특성이 향상된 인쇄회로기판 및 그 제조방법에 관한 것으로, 더욱 상세하게는 도체패턴(Conductive pattern)이 형성되는 상하 한 쌍의 동박(Copper foil) 사이에 상대적으로 두께가 매우 두꺼운 동판(Copper plate)을 배치하고 적층하여 방열특성을 크게 향상시킬 수 있도록 하고, 상기 동판에 형성되는 통공(Through Hole)을 드릴가공이 아닌 프레스 펀칭방식으로 가공하여 버(Burr)나 가공파편(Chips)가 발생되지 않도록 함으로써 전기적인 특성을 개선시킬 수 있도록 한 방열특성이 향상된 인쇄회로기판 및 그 제조방법에 관한 것이다. The present invention relates to a printed circuit board having improved heat dissipation characteristics and a method of manufacturing the same, and more particularly, a copper plate having a relatively thick thickness between a pair of upper and lower copper foils having a conductive pattern formed thereon. Copper plate) is placed and laminated to greatly improve heat dissipation characteristics, and the through hole formed in the copper plate is processed by press punching method, not by drilling, so that burrs or chips are processed. The present invention relates to a printed circuit board having improved heat dissipation properties, and a method of manufacturing the same.

일반적으로, 인쇄회로기판(Printed Circuit Board)은 전기적 절연체 위에 동박(Copper foil) 같은 전기전도성이 우수한 재질로 도체패턴을 형성하고, 상기 도체패턴상에는 전원 및 증폭기 같이 전력의 공급원을 포함하는 능동소자(Active Component)와 저항기, 콘덴서, 코일 등의 수동소자(Passive Component) 및 음향 또는 영상소자 등이 각각 그 기능을 수행함과 동시에 다른 소자를 지원할 수 있도록 상호 연결된 상태로 실장되어 있는 기구소자를 일컫는다.In general, a printed circuit board is a conductive pattern formed of a material having excellent electrical conductivity such as copper foil on an electrical insulator, and an active element including a power source such as a power supply and an amplifier on the conductive pattern. Active components), passive components such as resistors, capacitors, and coils, and acoustic or visual components, etc., respectively, perform their functions and are mechanical devices mounted in an interconnected state to support other components.

이와 같은 인쇄회로기판은 우리가 흔히 볼 수 있는 가전제품인 세탁기, TV, 냉장고 뿐만 아니라 시스템 보드인 라우터, 서버 및 인공위성, 자동차 등에도 적용되어 그 활용분야가 대단히 높아지고 있으며, 최근에는 각종 멀티미디어기기, 통신기기 등 정보 단말기기나 정보통신용의 네트워크장비 및 디스플레이장치 관련 산업 분야가 확대되고 발전되면서 그에 적합한 인쇄회로기판의 수요가 급증하고 있다.Such printed circuit boards are applied to washing machines, TVs, and refrigerators as well as system boards such as routers, servers, satellites, and automobiles, which are commonly found in home appliances. As the industrial terminal related to information terminal devices such as devices and network equipment and display devices for information and communication are expanded and developed, the demand for suitable printed circuit boards is rapidly increasing.

이와 같이 각종 전자제품의 기능이 점점 복잡하고 다양해지는 반면, 그 크기는 점차 소형화 및 슬림(Slim)화되는 추세이기 때문에 단일의 절연기판에 여러층의 도체패턴(회로)를 구성하여 두께를 상대적으로 얇게 하면서 고밀도·다기능을 구현할 수 있도록 하고, 도체패턴을 구성하는 동박과 절연기판과의 밀착력이 강화되도록 하여 높은 신뢰성을 나타낼 수 있도록 하는 양면 인쇄회로기판 또는 다층 인쇄로회로기판이 요구되고 있다.As functions of various electronic products become more and more complicated and diverse as described above, their size is gradually being miniaturized and slimmed, so that a plurality of conductor patterns (circuits) are formed on a single insulating substrate so that the thickness is relatively small. There is a demand for double-sided printed circuit boards or multilayer printed circuit boards that can achieve high reliability by making thin, high-density and multi-functional, and enhancing adhesion between the copper foil constituting the conductor pattern and the insulating board.

한편, 각종 전자제품이 구동되는 경우 해당 전자제품에 장착된 인쇄회로기판상의 각각의 소자로부터 열이 발생되는데, 상기 인쇄회로기판상의 여러 소자로부터 발생된 열을 적절하게 외부로 방출시키지 못하는 경우 상기 소자들이 열에 의하여 그 기능이 저하되기 때문에 제품의 수명이 단축된다는 문제가 있다.Meanwhile, when various electronic products are driven, heat is generated from each device on a printed circuit board mounted on the electronic product. When the heat generated from various devices on the printed circuit board is not properly discharged to the outside, the device There is a problem that the life of the product is shortened because their function is reduced by heat.

또, 인쇄회로기판을 제조하는 과정에서 내부 코어층에는 통공(Through Hole)이 형성되는데, 종래에는 상기 통공이 드릴비트의 드릴링 동작에 의하여 형성됨에 따라 통공의 주변에 버(Burr)가 형성되고, 미세한 가공 파편이 발생되기 때문에 후속공정이 요구되면서 작업공수가 많아진다는 문제가 있고, 이와 같은 후속공정이 제대로 수행되지 않은 경우 완성된 인쇄회로기판에서 전기적인 단락현상이 발생되 는 등 치명적인 결함이 발생된다는 문제가 있다. In addition, a through hole is formed in an inner core layer in a process of manufacturing a printed circuit board. In the related art, as the through hole is formed by a drilling operation of a drill bit, a burr is formed around the through hole. Since fine processing fragments are generated, there is a problem that the number of labors is increased as a subsequent process is required, and when such a subsequent process is not performed properly, a fatal defect such as an electrical short circuit occurs in the finished printed circuit board. there is a problem.

본 발명은 이와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 도체패턴(Conductive pattern)이 형성되는 상하 한 쌍의 동박(Copper foil)사이에 상대적으로 매우 두꺼운 동판(Copper plate)을 배치하고 적층하여 방열특성을 크게 향상시킬 수 있도록 한 새로운 인쇄회로기판을 제공하는 것이다.The present invention is to solve such a conventional problem, the object is to place and laminate a relatively very thick copper plate (copper plate) between a pair of upper and lower copper foil (Conductive pattern) is formed It is to provide a new printed circuit board that can greatly improve the heat dissipation characteristics.

본 발명의 다른 목적은 상기 동판상에 형성되는 통공(Through Hole)을 드릴가공이 아닌 프레스 펀칭방식으로 가공하여 버(Burr)가 발생되지 않도록 함으로써 전기적인 특성을 개선시킬 수 있도록 한 새로운 인쇄회로기판을 제공하는 것이다.Another object of the present invention is to process a through hole formed on the copper plate by a press punching method rather than a drilling process to prevent the generation of burrs (Burr) by a new printed circuit board to improve the electrical characteristics To provide.

본 발명의 또 다른 목적은 방열특성과 전기적인 특성이 향상된 새로운 인쇄회로기판의 제조방법을 제공하는 것이다.Still another object of the present invention is to provide a method of manufacturing a new printed circuit board having improved heat dissipation and electrical properties.

상기의 목적을 달성하기 위하여, 본 발명에 따른 방열특성이 향상된 인쇄회로기판은 상대적으로 두꺼운 두께를 가지며, 면상의 정해진 위치에는 프레스 펀칭방식에 통공이 형성되고, 상기 통공의 내부에는 에폭시수지가 채워지며, 상기 통공에 채워진 에폭시수지의 중심에 비아홀(Via hole)이 형성된 상태에서 도금된 동판의 표면과 이면에 열전도성이 우수한 프리프레그를 매개로 가열압착되는 방식으로 적층되며, 표면에는 통상의 방식에 의하여 도체패턴이 형성되는 동박이 적층된 구조로 이루어져 도체패턴상에 실장된 각종 소자로부터 발생된 열이 중간의 동판을 통하여 효율적으로 방열되도록 구성된 특징을 갖는다. In order to achieve the above object, a printed circuit board having improved heat dissipation characteristics according to the present invention has a relatively thick thickness, and a hole is formed in a press punching method at a predetermined position on a surface, and an epoxy resin is filled in the hole. It is laminated on the surface of the plated copper plate in a state of forming a via hole in the center of the epoxy resin filled in the through-hole by heat-compression bonding with a prepreg having excellent thermal conductivity on the surface and the surface thereof, and a conventional method on the surface. It consists of a laminated structure of copper foil to form a conductor pattern has a feature configured to efficiently dissipate heat generated from various elements mounted on the conductor pattern through the intermediate copper plate.

상기의 다른 목적을 달성하기 위하여, 본 발명에 따른 인쇄회로기판의 제조방법은 상대적으로 두꺼운 두께를 가지며, 설계에 따라 정해진 크기로 재단된 동판상의 정해진 위치에 설계에 따라 정해진 크기를 갖는 통공(Through Hole)을 형성하는 통공형성단계(ST1)와; 상기 동판상에 형성된 통공의 내부에 에폭시수지(Epoxy Resin)를 채워 넣는 에폭시수지 충진단계(ST2)와; 상기 동판상의 통공에 채워진 후 경화된 에폭시수지를 다시 천공하여 비아홀(Via Hole)을 형성하는 비아홀 형성단계(ST3)와; 상기 비아홀의 내벽면에 전도성의 동막이 형성되도록 동판을 동 도금하는 도금단계(ST4)와; 도금된 동판의 표면(表面)과 이면(裏面)에 열전도성이 우수한 쉬트형상의 층간 접착제인 프리프레그(Prepreg)를 배치한 후 각 프리프레그의 바깥면에 동박을 밀착시킨 상태에서 가열 압착하여 동판의 표면과 이면에 동박을 적층하는 동박 적층단계(ST5)와; 상기 동판의 표면과 이면에 적층된 동박에 설계에 따라 정해진 패턴을 인쇄하고, 패턴상에 레지스트(Resist)를 도포한 후 에칭하여 도체패턴을 형성하는 단계(ST6)를 포함한다.In order to achieve the above another object, the manufacturing method of the printed circuit board according to the present invention has a relatively thick thickness, the through hole having a predetermined size according to the design at a predetermined position on the copper plate cut to a predetermined size according to the design A hole forming step (ST1) for forming a hole; An epoxy resin filling step (ST2) of filling an epoxy resin in the through hole formed on the copper plate; A via hole forming step (ST3) of forming a via hole by perforating the hardened epoxy resin again after filling the through hole on the copper plate; A plating step (ST4) of copper plating the copper plate so that a conductive copper film is formed on the inner wall surface of the via hole; Prepreg, a sheet-shaped interlayer adhesive with excellent thermal conductivity, is disposed on the surface and the back of the plated copper plate, and the sheet is heated and compressed in a state where the copper foil is closely adhered to the outer surface of each prepreg. Copper foil lamination step (ST5) for laminating the copper foil on the front and back of the; And printing a predetermined pattern according to a design on the copper foil laminated on the surface and the rear surface of the copper plate, applying a resist on the pattern, and etching to form a conductor pattern (ST6).

본 발명에서 상기 동판에 대한 통공형성단계에서는 드릴가공이 아닌 프레스를 이용한 판칭방식에 의하여 통공을 형성하여 버(Burr)나 가공파편이 발생되지 않도록 하는 특징을 갖는다. In the present invention, the through-hole forming step for the copper plate has a feature of forming a through-hole by a plate-forming method using a press, not a drill, so that no burr or processing fragments are generated.

본 발명을 적용하면, 상대적으로 두께가 두꺼운 동판을 도체패턴이 형성되는한 쌍의 동박 사이에 배치한 상태에서 가열·압착하는 적층한 구조로 만들어짐에 따라 전자제품의 구동시 인쇄회로기판상에 실장된 각 소자들로부터 발생되는 열이 중간의 동판으로 전달된 후 외부로 방출되기 때문에 방열효율이 크게 향상된다는 효과가 있다.According to the present invention, a relatively thick copper plate is formed in a laminated structure that is heated and pressed in a state where a copper pattern is disposed between a pair of copper foils on which a conductor pattern is formed. Since heat generated from each mounted element is transferred to the intermediate copper plate and then released to the outside, the heat radiation efficiency is greatly improved.

또, 상기 동판에 형성되는 통공이 일반적인 드릴가공에 의하여 형성되는 것이 아니라 프레스로 펀칭하여 가공하기 때문에 통공의 가장자리면에 버(Burr)와 가공파편이 발생되지 않아 전기적인 특성이 개선된다는 효과가 있다. In addition, since the through hole formed in the copper plate is not formed by general drill processing, but is punched and processed by a press, burrs and processing fragments are not generated at the edge of the through hole, thereby improving electrical characteristics. .

이하, 첨부된 도면에 의하여 본 발명의 바람직한 실시예를 보다 상세하게 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 방열특성이 향상된 인쇄회로기판의 구조를 나타내는 분리사시도이고 도 2는 본 발명에 따른 인쇄회로기판에 적용되는 동판을 나타내는 확대 사시도이다.1 is an exploded perspective view illustrating a structure of a printed circuit board having improved heat dissipation characteristics according to the present invention, and FIG. 2 is an enlarged perspective view illustrating a copper plate applied to a printed circuit board according to the present invention.

또, 도 3은 본 발명에 의하여 제조된 인쇄회로기판의 확대 단면도이고, 도 4는 본 발명에 따른 인쇄회로기판의 제조공정을 나타내는 플로우차트이다.3 is an enlarged cross-sectional view of a printed circuit board manufactured according to the present invention, and FIG. 4 is a flowchart showing a manufacturing process of the printed circuit board according to the present invention.

이를 참조하면, 본 발명에 따른 인쇄회로기판(10)은 상대적으로 두꺼운 두께를 갖는 동판(12)의 표면과 이면에 각각 도체패턴이 형성되는 동박(22)(22')이 적층되어 전자제품에 적용되어 구동될 때 소자로부터 발생되는 열이 동판(12)으로 전달된 후 외부로 방출될 수 있도록 하는 것이다. Referring to this, in the printed circuit board 10 according to the present invention, copper foils 22 and 22 'having conductor patterns formed on the front and rear surfaces of the copper plate 12 having a relatively thick thickness are laminated to the electronic product. When applied and driven, heat generated from the device may be transferred to the copper plate 12 and then released to the outside.

이와 같은 본 발명에 따른 인쇄회로기판(10)을 다음과 같은 공정에 의하여 제조된다.Such a printed circuit board 10 according to the present invention is manufactured by the following process.

도 1 및 도 4에 도시된 바와 같이, 먼저 상대적으로 두꺼운 0.8∼1.2㎜의 두께를 갖는 동판(12)을 재단기(Sawing Machine)로 설계에 따라 정해진 크기에 맞추어 재단하고, 재단된 동판(12)상의 정해진 위치에 설계에 따라 정해진 크기를 갖는 통공(14)을 형성한다(ST1). 1 and 4, first, the copper plate 12 having a relatively thick thickness of 0.8 to 1.2 mm is cut to a predetermined size according to the design by a cutting machine (Sawing Machine), and the cut copper plate 12 A through hole 14 having a predetermined size is formed at a predetermined position on the image (ST1).

상기 동판(12)을 재단할 때에는 휨현상(Warp), 의도하지 않은 구멍(Pit)이나 홈(Dent)은 물론, 긁힘현상(Scratch) 찍힘 현상이 발생되지 않도록 주의하여야 한다. When cutting the copper plate 12, care should be taken not to cause warp, unintended pits or grooves, as well as scratches.

상기 동판(12)상에 통공(14)을 형성하고자 하는 경우, 기존의 드릴비트를 이용한 드릴가공대신 다수매의 동판(14)을 정확하게 스택킹(Stacking)한 상태에서 설게에 따라 정해진 위치를 프레스로 정확하게 펀칭하는 방식으로 통공(14)을 형성하여 통공의 주변에 버(Burr) 및 가공파편이 발생되지 않도록 하는 것이 중요하다.In the case where the through hole 14 is to be formed on the copper plate 12, instead of the conventional drill bit, a plurality of sheets of copper plate 14 are accurately stacked, and a predetermined position according to the design is pressed. It is important to form the through holes 14 in a precisely punched manner so that burrs and processed debris are not generated around the through holes.

이와 같이 프레스로 펀칭하여 동판(12)상에 통공(14)을 형성하는 과정에서도 역시 작은 조각이 발생되지 않도록 하는 것이 중요하다.As such, it is important that small pieces are not generated in the process of forming the through holes 14 on the copper plate 12 by punching with a press.

이와 같이 상기 동판(12)상에 통공(14)을 형성한 후에는 다시 통공(14)의 내부에 에폭시수지(Epoxy Resin:16)를 채워 넣고(ST2), 통공(14)에 채워진 에폭시수지(16)가 경화된 후 그 중심을 천공하여 비아홀(18)을 형성한다(ST3). After forming the through hole 14 on the copper plate 12 as described above, the epoxy resin (Epoxy Resin: 16) is filled in the inside of the through hole 14 again (ST2), and the epoxy resin filled in the through hole 14 ( After the 16 is cured, the center is drilled to form the via hole 18 (ST3).

그런 다음, 상기 에폭시수지(16)의 중심에 비아홀(18)이 형성된 동판(12)을 동(銅) 도금하여 상기 비아홀(18)의 내벽면에 전도성의 동막(銅膜))이 형성되도록 한다(ST4). Then, the copper plate 12 having the via hole 18 formed in the center of the epoxy resin 16 is copper plated to form a conductive copper film on the inner wall surface of the via hole 18. (ST4).

상기 동판(12)에 대한 동 도금은 비금속으로 된 통공(Through Hole)의 내벽에 전도성 물질을 코팅하는 방식인 무전해 동도금방식에 의하여 이루어지며, 이 때 비아홀(18)의 내벽면에 형성되는 동막의 두께는 0.5∼10㎛ 정도이다. Copper plating on the copper plate 12 is made by electroless copper plating, which is a method of coating a conductive material on an inner wall of a non-metallic through hole, and at this time, a copper film formed on the inner wall of the via hole 18. The thickness of is about 0.5 ~ 10㎛.

한편, 이와 같이 도금된 동판(12)의 표면(表面)과 이면(裏面)에는 각각 도체패턴이 형성되는 동박(22)(22')이 본딩(Bonding)방식에 의하여 적층되는데, 이를 위하여 상기 동판(12)의 표면과 이면에 열전도성이 우수한 쉬트형상의 층간 접착제인 프리프레그(20)(20')를 배치한 다음 상기 각 프리프레그(20)(20')의 바깥면에 동박(22)(22')을 밀착시킨 상태에서 가열·압착하면 상기 동판(12)의 표면과 이면에 동박(22)(22')이 적층된다(ST5).Meanwhile, copper foils 22 and 22 'on which the conductor patterns are formed are laminated on the surface and the back surface of the copper plate 12 plated in this manner by a bonding method. Prepreg 20, 20 ', which is a sheet-shaped interlayer adhesive having excellent thermal conductivity, is disposed on the front and back surfaces of (12), and then copper foil 22 is formed on the outer surface of each of the prepregs 20, 20'. When heating and pressing in the state in which 22 'is in close contact, copper foils 22 and 22' are laminated on the front and rear surfaces of the copper plate 12 (ST5).

상기와 같은 방식으로 동판(12)의 표면과 이면에 동박(22)(22')이 적층된 상태에서 상기 동박(22)(22')의 표면에 설계에 따라 정해진 패턴을 인쇄하고, 패턴상에 레지스트를 도포한 후 에칭하여 도체패턴을 형성하면 본 발명에 따른 방열특성이 향상되고, 전기적인 특성이 개선된 인쇄회로기판(10)이 제조된다(ST6).The copper foils 22 and 22 'are laminated on the surface and the back of the copper plate 12 in the same manner as described above, and a pattern determined according to the design is printed on the surface of the copper foils 22 and 22'. When the resist is coated on the substrate and then etched to form a conductor pattern, a heat dissipation characteristic according to the present invention is improved and a printed circuit board 10 having improved electrical characteristics is manufactured (ST6).

이렇게 제조된 본 발명에 따른 인소쇄회로기판(10)의 도체패턴상에 전자제품의 기능에 따라 각종 소자를 실장하고, 전자제품에 적용하는 경우 상기 각 소자로부터 발생되는 열은 프리프레그(20)(20')와 에폭시수지(16)을 통하여 중간의 동판(12)으로 전달된 후 외부로 방출되기 때문에 방열효율이 크게 향상되는 것이며, 동판(12)상의 통공(14)이 종래의 드릴가공방식이 아닌 프레스 펀칭방식에 의하여 형성되기 때문에 통공(14)의 주변에 버(Burr)가 발생되지 않아 인쇄회로기판의 전기적 특성의 저하가 발생되지 않게 되는 것이다. The various elements are mounted on the conductor pattern of the printed circuit board 10 according to the present invention according to the function of the electronic product, and when applied to the electronic product, the heat generated from the respective elements is prepreg 20. Since 20 'and the epoxy resin 16 are transferred to the intermediate copper plate 12 and then released to the outside, the heat dissipation efficiency is greatly improved, and the through hole 14 on the copper plate 12 is conventionally drilled. Since it is formed by a press punching method, a burr is not generated around the through hole 14 so that the electrical characteristics of the printed circuit board are not deteriorated.

도 1은 본 발명에 따른 방열특성이 향상된 인쇄회로기판의 구조를 나타내는 분리사시도이다.1 is an exploded perspective view illustrating a structure of a printed circuit board having improved heat dissipation characteristics according to the present invention.

도 2는 본 발명에 따른 인쇄회로기판에 적용되는 동판을 나타내는 확대 사시도이다.2 is an enlarged perspective view illustrating a copper plate applied to a printed circuit board according to the present invention.

도 3은 본 발명에 의하여 제조된 인쇄회로기판의 확대 단면도이다.3 is an enlarged cross-sectional view of a printed circuit board manufactured according to the present invention.

도 4는 본 발명에 따른 인쇄회로기판의 제조공정을 나타내는 플로우차트이다.4 is a flowchart illustrating a manufacturing process of a printed circuit board according to the present invention.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

10 : 인쇄회로기판 12 : 동판10: printed circuit board 12: copper plate

14 : 통공(Hole) 16 : 에폭시수지14: hole 16: epoxy resin

18 : 비아홀 20,20' : 프리프레그(Prepreg)18: Via Hole 20,20 ': Prepreg

22,22' : 동박. 22,22 ': copper foil.

Claims (4)

상대적으로 두꺼운 두께를 가지며, 면상의 정해진 위치에는 프레스 펀칭방식에 의한 통공(14)이 형성되고, 상기 통공(14)의 내부에는 에폭시수지(16)가 채워지며, 상기 통공(14)에 채워진 에폭시수지(16)의 중심에 비아홀(18)이 형성된 상태에서 동 도금된 동판(12)과; It has a relatively thick thickness, and the through hole 14 is formed by a press punching method in a predetermined position on the surface, the epoxy resin 16 is filled in the inside of the through hole 14, the epoxy filled in the through hole 14 A copper plate 12 copper-plated in a state where the via hole 18 is formed in the center of the resin 16; 상기 동판(12)의 표면(表面)과 이면(裏面)에 각각 배치된 상태에서 열전도성이 우수한 층간 접착제인 프리프레그(20)(20')를 매개로 가열·압착되어 적층되고, 표면에는 도체패턴이 형성되는 동박(22)(22')으로 이루어져 도체패턴상에 실장된 각종 소자로부터 발생된 열이 중간에 배치된 동판(12)으로 전달된 후 외부로 방출되도록 구성된 것을 특징으로 하는 방열특성이 향상된 인쇄회로기판.In the state which is arrange | positioned in the surface and back surface of the said copper plate 12, respectively, it is laminated | stacked by heating and crimping | compression-bonding through the prepreg 20 (20 ') which is an interlayer adhesive which is excellent in thermal conductivity, and a conductor The heat dissipation characteristics of the copper foils 22 and 22 'formed of a pattern are configured so that heat generated from various elements mounted on the conductor pattern is transferred to the copper plate 12 disposed in the middle and then released to the outside. This enhanced printed circuit board. 제1항에 있어서, The method of claim 1, 상기 동박(22)(22') 사이에 개재되는 동판(12)은 0.8∼1.2㎜의 두께인 것을 특징으로 하는 방열특성이 향상된 인쇄회로기판.Printed circuit board with improved heat dissipation characteristics, characterized in that the copper plate (12) interposed between the copper foil (22) (22 ') is 0.8 ~ 1.2㎜ thickness. 상대적으로 두꺼운 두께를 가지며, 설계에 따라 정해진 크기로 재단된 동판(12)상의 정해진 위치에 설계에 따라 정해진 크기를 갖는 통공(14)을 형성하는 통공 형성단계(ST1)와;A through hole forming step (ST1) having a relatively thick thickness and forming a through hole 14 having a predetermined size according to the design at a predetermined position on the copper plate 12 cut to a predetermined size according to the design; 상기 동판(12)상에 형성된 통공(14)의 내부에 에폭시수지(16)를 채워 넣는 에폭시수지 충진단계(ST2)와; An epoxy resin filling step (ST2) of filling the epoxy resin 16 into the through hole 14 formed on the copper plate 12; 상기 동판(12)상의 통공(14)에 채워진 후 경화된 에폭시수지(16)를 다시 천공하여 비아홀(18)을 형성하는 비아홀 형성단계(ST3)와;A via hole forming step (ST3) of filling the through hole 14 on the copper plate 12 and perforating the hardened epoxy resin 16 to form the via hole 18; 상기 에폭시수지(16)의 중심에 비아홀(18)이 형성된 동판(12)을 도금하여 상기 비아홀(18)의 내벽면에 전도성의 동막이 형성되도록 하는 도금단계(ST4)와;A plating step (ST4) for plating a copper plate (12) having a via hole (18) formed at the center of the epoxy resin (16) to form a conductive copper film on the inner wall surface of the via hole (18); 도금된 동판(12)의 표면(表面)과 이면(裏面)에 열전도성이 우수한 쉬트형상의 층간 접착제인 프리프레그(20)(20')를 배치하고, 각 프리프레그(20)(20')의 바깥면에 동박(22)(22')을 밀착시킨 상태에서 가열·압착하여 동판(12)의 표면과 이면에 동박(22)(22')을 적층하는 동박 적층단계(ST5)와;On the surface and the back surface of the plated copper plate 12, prepreg 20, 20 ', which is a sheet-shaped interlayer adhesive having excellent thermal conductivity, is disposed, and each prepreg 20, 20' is disposed. A copper foil laminating step (ST5) for laminating copper foils 22 and 22 'on the front and back surfaces of the copper plate 12 by heating and compressing the copper foils 22 and 22' on the outer surface thereof; 상기 동판(12)의 표면과 이면에 적층된 동박(22)(22')에 설계에 따라 정해진 패턴을 인쇄하고, 패턴상에 레지스트를 도포한 후 에칭하여 도체패턴을 형성하는 단계(ST6)를 포함하는 것을 특징으로 하는 방열특성이 향상된 인쇄회로기판의 제조방법.Printing a predetermined pattern according to a design on the copper foils 22 and 22 'laminated on the front and rear surfaces of the copper plate 12, applying a resist on the pattern, and etching to form a conductor pattern (ST6). Method of manufacturing a printed circuit board with improved heat radiation characteristics comprising a. 제3항에 있어서,The method of claim 3, 상기 동판(12)에 대한 통공형성단계(ST1)에서는 드릴가공이 아닌 프레스를 이용한 펀칭방식에 의하여 통공(14)을 형성하여 버(Burr)가 발생되지 않도록 하는 것을 특징으로 하는 방열특성이 향상된 인쇄회로기판의 제조방법. In the through hole forming step (ST1) for the copper plate 12 to form a through hole 14 by a punching method using a press rather than a drill processing to improve heat dissipation characteristics, characterized in that the burr (Burr) is not generated Method of manufacturing a circuit board.
KR1020080132012A 2008-12-23 2008-12-23 Printed circuit board with improved heat dissipation and its manufacturing method KR101049228B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291942A (en) * 2011-06-30 2011-12-21 中山市达进电子有限公司 Method for making aluminum-based circuit board with conduction holes
KR101219423B1 (en) * 2011-07-05 2013-01-11 대덕전자 주식회사 Method of improving the adhesion-strength between copper core and insulating material
CN103978516A (en) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 Through hole punching technology for rolled flexible circuit board

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
KR102511542B1 (en) 2015-12-02 2023-03-20 삼성디스플레이 주식회사 Circuit board and display device including the same

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Publication number Priority date Publication date Assignee Title
JP4008782B2 (en) * 2002-08-23 2007-11-14 日本特殊陶業株式会社 Manufacturing method of multilayer wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291942A (en) * 2011-06-30 2011-12-21 中山市达进电子有限公司 Method for making aluminum-based circuit board with conduction holes
KR101219423B1 (en) * 2011-07-05 2013-01-11 대덕전자 주식회사 Method of improving the adhesion-strength between copper core and insulating material
CN103978516A (en) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 Through hole punching technology for rolled flexible circuit board

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