CN108012469A - A kind of production method and inner figure data of multilayer circuit inner cord production plate - Google Patents
A kind of production method and inner figure data of multilayer circuit inner cord production plate Download PDFInfo
- Publication number
- CN108012469A CN108012469A CN201711421727.7A CN201711421727A CN108012469A CN 108012469 A CN108012469 A CN 108012469A CN 201711421727 A CN201711421727 A CN 201711421727A CN 108012469 A CN108012469 A CN 108012469A
- Authority
- CN
- China
- Prior art keywords
- production
- production board
- board unit
- plate
- internal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 235000012550 Pimpinella anisum Nutrition 0.000 description 1
- 240000004760 Pimpinella anisum Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Abstract
The invention discloses the production method and inner figure data of a kind of multilayer circuit inner cord production plate,Inner figure data includes multiple production board unit figures,Include production board inner line figure in each production board unit figure,It is characterized in that,Region between adjacent production board unit figure,Or the region between adjacent production board unit figure and the region without production board inner line figure in production board unit figure are provided with the circular pattern of one or more equidistant arrangements,The circular pattern and the production board inner line figure correspond to internal layer production plate Shang Youtong areas,A diameter of 1.25mm of the circular pattern,Distance of center circle between adjacent circular figure is 1.5mm,The circular pattern and the production board unit figure are more than or equal to 1.5mm with the distance of the production board inner line figure.The present invention can effectively solve copper sheet ridging defect, plate sticks up defect and avoid the layering caused by resin unsmooth flowing or thickness of slab inequality defect.
Description
Technical field
The present invention relates to printed circuit board production field, more particularly, to a kind of multilayer circuit inner cord production plate
Production method and inner figure data.
Background technology
The production process of multilayer circuit board is usually：Sawing sheet → inner figure → internal layer AOI → pressing → drilling → heavy copper,
Plate electricity → outer graphics → graphic plating → alkali etching → outer layer AOI → welding resistance → character → surface treatment → shaping → silk-screen
Carbon oil → test → FQC → FQA → packaging, wherein, sawing sheet technique is that the substrate aniseed of purchase is divided into several production plates,
Usually optimal sawing sheet size is 41 " * 49 ", afterwards, carry out the typesetting design on production plate, the finished product mainly provided with client
Plate is combined, and the production board of multiple and different functions, line construction and shape is combined, to reach production plate most
Big utilization rate.Inner figure technique first makes the inner figure data of internal layer production plate first, is provided inner figure by mask
The pattern transfer of material is produced on plate to internal layer.Referring to Fig. 1, include multiple production boards in the inner figure data 1 of the prior art
Unit figure 12 (contour pattern of i.e. each production board), each production board unit figure 12 is interior to include production board internal layer circuit figure
Shape 13 (corresponding production board inner plating Shang Youtong areas).Plate is produced using internal layer made of above-mentioned inner figure data, in internal layer
Prepreg and outer copper foil are added on production plate, prepreg is made by heat cure by the method for high temperature and pressure, so that by one
Block or polylith core material are bonded into one block of multi-layer board with copper foil.Since internal layer produces the line pattern skewness on plate, with
And the gap between each production board, cause You Tong areas and without copper area skewness, cause process for pressing Zhong Wutong areas and You Tong areas
Pressure is uneven, produces the defects of copper sheet wrinkles.The solution of the prior art is, as shown in Figure 1：To ignore finished product Slab element figure
The You Tong areas 11 of increase closing form are taken in 12 Zhong Wutong areas of shape, the gap between each production board unit figure, this method
Shortcoming is：(1) when not taking any measure in 12 Zhong Wutong areas of production board unit figure, however it remains pressure is uneven and produces
The defects of copper sheet wrinkles, or exist since the inner figure You Tong areas of both sides have big difference and produce the defects of plate is stuck up；(2) exist
When the You Tong areas 11 of increase closing form are taken in gap between each production board unit figure, the You Tong areas 11 of closing form are pressing
During the flowing of resin can be made to have some setbacks, hinder resin filling dead zone so that cause layering or thickness of slab it is uneven the defects of.
The content of the invention
It is an object of the present invention to solve because the copper sheet that pressure is uneven or both sides You Tong areas having big difference and producing rises
Wrinkle and plate stick up defect.
The second object of the present invention is to solve layering or the thickness of slab inequality defect caused by the You Tong areas of closing form.
To achieve the above object, technical scheme is as follows：
A kind of multilayer circuit board manufacture craft makes the inner figure data of internal layer production plate, including multiple finished product Slab elements
Figure, each production board unit figure is interior to include production board inner line figure, it is characterised in that in adjacent finished product Slab element
Region between figure, or region between adjacent production board unit figure and in production board unit figure without into
The region of product inner cord line pattern is provided with the circular pattern of one or more equidistant arrangements, the circular pattern and it is described into
Product inner cord line pattern corresponds to internal layer production plate Shang Youtong areas, a diameter of 1.25mm of the circular pattern, adjacent circular
Distance of center circle between figure is 1.5mm, the circular pattern with the production board unit figure or with the production board internal layer circuit
The distance of figure is more than or equal to 1.5mm.
A kind of production method of multilayer circuit inner cord production plate, it is characterised in that using the internal layer described in claim 1
Inner figure is transferred on internal layer production plate by graphic documentation, in production board unit figure, production board inner line figure and circle
The corresponding region of shape figure forms internal layer production plate Shang Youtong areas.
From above-mentioned technical proposal it can be seen that：By internal layer produce plate except rationally dosing in conductive pattern Wai Wutong areas
Circular copper sheet array, can improve because copper sheet corrugation that circuit skewness or both sides You Tong areas having big difference and producing and plate are stuck up
Defect, and replaces whole copper sheet for closing with circular copper sheet array, the filling that can make resin evenly, can improve internal layer
The planarization of plate pressing is produced, improves the performance of multilayer circuit board.
Brief description of the drawings
Fig. 1 is the structure diagram of inner figure data of the prior art；
Fig. 2 is the structure diagram of the inner figure data in a specific embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawings, the embodiment of the present invention is described in further detail.
It should be noted that in following embodiments, when embodiments of the present invention are described in detail, in order to clear
Ground represents the structure of the present invention in order to illustrate, special not draw to the structure in attached drawing according to general proportion, and has carried out part
Amplification, deformation and simplified processing, therefore, should avoid in this, as limitation of the invention to understand.
In embodiment of the invention below, referring to Fig. 2, Fig. 2 is the knot of the inner figure data of the present invention
Structure schematic diagram.As shown in the figure, a kind of inner figure data 2 of multilayer circuit inner cord production plate, including multiple finished product Slab elements
Figure 22, each production board unit figure 22 is interior to include production board inner line figure 23, in adjacent production board unit figure
Region 21 between 22, or region 21 between adjacent production board unit figure 22 and in production board unit figure
The region of no production board inner line figure is provided with the circular pattern 24 of one or more equidistant arrangements, circular pattern 24 and into
Product inner cord line pattern 23 corresponds to internal layer production plate Shang Youtong areas, a diameter of 1.25mm of circular pattern 24, adjacent circular
Distance of center circle between figure 24 is 1.5mm, the distance 26 of circular pattern 24 and production board unit figure 22 or circular pattern 24 with into
The distance 25 of product inner cord line pattern 23 is more than or equal to 1.5mm.
Using the circuit on above-mentioned inner figure data make internal layer production plate, in the present embodiment, internal layer production plate is
Inner figure, is transferred on internal layer production plate, inner figure data (film) is placed on exposure machine by copper-clad plate using negative film,
Inner figure, is transferred on internal layer production plate, passed through by the internal layer production plate of positioning alignment coating mask by exposed and developed
Etching removes other local copper foils, and after moving back film, production board unit figure, production board inner line figure and circular pattern correspond to
The copper foil in region be retained, form internal layer production plate Shang Youtong areas.The corresponding You Tong areas of production board inner line figure are
Conducting wire, has electric property, and act as improving circuit without electric property in the You Tong areas in the corresponding region of circular pattern
Skewness.Can also use positive transfer inner figure, the technique such as others cleaning, etching, AOI and surface treatment with it is existing
Technology is identical, and this will not be repeated here.
The present invention is not on the premise of customer service circuit design is influenced, by increasing the array of circular pattern in no copper region,
Copper sheet ridging defect can effectively be solved, plate sticks up defect and avoids layering caused by resin unsmooth flowing or thickness of slab is uneven lacks
Fall into.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (2)
1. a kind of inner figure data of multilayer circuit inner cord production plate, including multiple production board unit figures, each finished product
Include production board inner line figure in Slab element figure, it is characterised in that the area between adjacent production board unit figure
Domain, or region between adjacent production board unit figure and in production board unit figure without production board internal layer circuit
The region of figure is provided with the circular pattern of one or more equidistant arrangements, the circular pattern and the production board internal layer circuit
Figure corresponds to internal layer production plate Shang Youtong areas, a diameter of 1.25mm of the circular pattern, the center of circle between adjacent circular figure
Away from for 1.5mm, the circular pattern it is big with the production board unit figure or with the distance of the production board inner line figure
In equal to 1.5mm.
2. a kind of production method of multilayer circuit inner cord production plate, it is characterised in that using the internal layer figure described in claim 1
Inner figure is transferred on internal layer production plate by shape data, in production board unit figure, production board inner line figure and circle
The corresponding region of figure forms internal layer production plate Shang Youtong areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711421727.7A CN108012469A (en) | 2017-12-25 | 2017-12-25 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711421727.7A CN108012469A (en) | 2017-12-25 | 2017-12-25 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012469A true CN108012469A (en) | 2018-05-08 |
Family
ID=62061166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711421727.7A Pending CN108012469A (en) | 2017-12-25 | 2017-12-25 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108012469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543461A (en) * | 2021-06-23 | 2021-10-22 | 惠科股份有限公司 | Printed circuit board and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547555A (en) * | 2009-05-05 | 2009-09-30 | 福建星网锐捷网络有限公司 | Printed circuit board |
| CN203086841U (en) * | 2013-01-14 | 2013-07-24 | 广东生益科技股份有限公司 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN206332913U (en) * | 2016-12-30 | 2017-07-14 | 上海嘉捷通信息科技有限公司 | A kind of printed circuit board internal layer edge structure |
| CN207678102U (en) * | 2017-12-25 | 2018-07-31 | 大连崇达电路有限公司 | A kind of inner figure data of multilayer circuit inner cord production plate |
-
2017
- 2017-12-25 CN CN201711421727.7A patent/CN108012469A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547555A (en) * | 2009-05-05 | 2009-09-30 | 福建星网锐捷网络有限公司 | Printed circuit board |
| CN203086841U (en) * | 2013-01-14 | 2013-07-24 | 广东生益科技股份有限公司 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN206332913U (en) * | 2016-12-30 | 2017-07-14 | 上海嘉捷通信息科技有限公司 | A kind of printed circuit board internal layer edge structure |
| CN207678102U (en) * | 2017-12-25 | 2018-07-31 | 大连崇达电路有限公司 | A kind of inner figure data of multilayer circuit inner cord production plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543461A (en) * | 2021-06-23 | 2021-10-22 | 惠科股份有限公司 | Printed circuit board and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103068185B (en) | The manufacture method of printed circuit board soft-hard combination substrate flexible area | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| CN102325426B (en) | Circuit board fabrication method for laminating asymmetric light guide panel on outer layer of multilayer panel again | |
| CN104244612B (en) | A kind of method that plated through-hole is made on PTFE circuit boards | |
| TWI538590B (en) | Printed circuit board and method for manufacturing same | |
| CN102056413B (en) | Method for manufacturing printed circuit board | |
| CN104427762B (en) | Bury resistance printed board and preparation method thereof | |
| CN109068491B (en) | Aluminum substrate machining process | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN207678102U (en) | A kind of inner figure data of multilayer circuit inner cord production plate | |
| CN107347229A (en) | The process of wiring board selective resin consent | |
| CN108012469A (en) | A kind of production method and inner figure data of multilayer circuit inner cord production plate | |
| CN105357893B (en) | A kind of production method of carbon oil plate | |
| CN108093569A (en) | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty | |
| CN101742822B (en) | Method for peeling rigid board from flexible board area of flexible-rigid board | |
| CN105338735B (en) | A kind of mixing material printed wiring board new producing method | |
| CN106793515B (en) | A kind of buried via hole lamination process method of printed circuit board | |
| CN103533783B (en) | PCB multilayer board manufacture method | |
| CN203645911U (en) | Inner-layer core plate of improving hole arranging area flat layering and multi-layer printed circuit board (PCB) | |
| CN104185363A (en) | Composite type ultra-thin non-core substrate and manufacturing method thereof | |
| CN102523694A (en) | Method for avoiding substrate exposure during pattern transfer of step circuit boards | |
| CN202374556U (en) | Multi-layer printed circuit board | |
| CN104918424B (en) | Circuit board size antihunt means with different-thickness core plate | |
| TWI400016B (en) | Laminated substrate and the producing method thereof | |
| JP2011171353A (en) | Method of manufacturing printed board, and printed board using this |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180508 |
|
| RJ01 | Rejection of invention patent application after publication |