FR2413016A1 - Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate - Google Patents

Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate

Info

Publication number
FR2413016A1
FR2413016A1 FR7739192A FR7739192A FR2413016A1 FR 2413016 A1 FR2413016 A1 FR 2413016A1 FR 7739192 A FR7739192 A FR 7739192A FR 7739192 A FR7739192 A FR 7739192A FR 2413016 A1 FR2413016 A1 FR 2413016A1
Authority
FR
France
Prior art keywords
collector
thermal
drain
hole
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7739192A
Other languages
French (fr)
Other versions
FR2413016B1 (en
Inventor
Alain Laurent
Georges Nocture
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7739192A priority Critical patent/FR2413016A1/en
Publication of FR2413016A1 publication Critical patent/FR2413016A1/en
Application granted granted Critical
Publication of FR2413016B1 publication Critical patent/FR2413016B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

The multilayer printed circuits (11) has a metallic copper plate (12) which forms the thermal collector of the circuits. The plate has a hole (13) in it whose initial dia. is very slightly less than the lower part of a copper thermal drain (15). The body (16) of the thermal drain has a dia. greater than the lower part of the drain. A crystal forming the substrate of a semiconductor (18) is fixed on the upper face of the thermal drain by means of a thin layer (20) of adhesive having a good thermal conductivity. The drain is forced into the hole (14) of the collector plate. The mechanical and thermal connections between the drain(s) and the thermal collector is reinforced by a ring of solder (29).
FR7739192A 1977-12-26 1977-12-26 Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate Granted FR2413016A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7739192A FR2413016A1 (en) 1977-12-26 1977-12-26 Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7739192A FR2413016A1 (en) 1977-12-26 1977-12-26 Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate

Publications (2)

Publication Number Publication Date
FR2413016A1 true FR2413016A1 (en) 1979-07-20
FR2413016B1 FR2413016B1 (en) 1981-06-26

Family

ID=9199336

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7739192A Granted FR2413016A1 (en) 1977-12-26 1977-12-26 Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate

Country Status (1)

Country Link
FR (1) FR2413016A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405971A (en) * 1979-12-10 1983-09-20 Sony Corporation Electrical circuit apparatus
EP0136454A1 (en) * 1983-08-30 1985-04-10 Bodenseewerk Gerätetechnik GmbH Device for the heat dissipation of printed circuit boards
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
WO1991006126A1 (en) * 1989-10-16 1991-05-02 Eastman Kodak Company High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact
EP0489958A1 (en) * 1990-12-12 1992-06-17 Siemens Aktiengesellschaft Circuit board for electronic control apparatus and method of making this circuit board
FR2671260A1 (en) * 1990-12-27 1992-07-03 Telecommunications Sa ELECTRIC PRINTED CIRCUIT SUPPORT WITH THERMAL DRAINAGE MEANS.
EP0555668A1 (en) * 1992-02-14 1993-08-18 Rheinmetall Industrie GmbH Printed circuit board for electronical power circuit containing power semiconductors
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
EP1503615A2 (en) * 2003-07-31 2005-02-02 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
DE102007011811A1 (en) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Copper inlay for printed circuit boards
WO2009141413A1 (en) * 2008-05-21 2009-11-26 Nujira Limited Printed circuit board with co-planar plate and method of manufacturing therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105472877B (en) * 2015-09-22 2018-10-16 乐健科技（珠海）有限公司 Printed circuit board and preparation method thereof with thermally conductive and electrically insulating micro- radiator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2139031A1 (en) * 1970-08-04 1972-02-10 Lannionnaise Delectronique Soc Process for assembling integrated circuits
FR2207401A1 (en) * 1972-11-22 1974-06-14 Cii
US4046442A (en) * 1975-05-07 1977-09-06 Burroughs Corporation Pluggable semiconductor device package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2139031A1 (en) * 1970-08-04 1972-02-10 Lannionnaise Delectronique Soc Process for assembling integrated circuits
FR2207401A1 (en) * 1972-11-22 1974-06-14 Cii
US4046442A (en) * 1975-05-07 1977-09-06 Burroughs Corporation Pluggable semiconductor device package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405971A (en) * 1979-12-10 1983-09-20 Sony Corporation Electrical circuit apparatus
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
EP0136454A1 (en) * 1983-08-30 1985-04-10 Bodenseewerk Gerätetechnik GmbH Device for the heat dissipation of printed circuit boards
US4583149A (en) * 1983-08-30 1986-04-15 Bodenseewerk Geratetechnik Gmbh Device for heat dissipation of printed circuit plates
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
WO1991006126A1 (en) * 1989-10-16 1991-05-02 Eastman Kodak Company High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
EP0489958A1 (en) * 1990-12-12 1992-06-17 Siemens Aktiengesellschaft Circuit board for electronic control apparatus and method of making this circuit board
EP0494560A2 (en) * 1990-12-27 1992-07-15 SAT (Société Anonyme de Télécommunications) Support for printed circuits with heat dissipation means
EP0494560A3 (en) * 1990-12-27 1992-08-12 Sat (Societe Anonyme De Telecommunications) Support for printed circuits with heat dissipation means
FR2671260A1 (en) * 1990-12-27 1992-07-03 Telecommunications Sa ELECTRIC PRINTED CIRCUIT SUPPORT WITH THERMAL DRAINAGE MEANS.
EP0555668A1 (en) * 1992-02-14 1993-08-18 Rheinmetall Industrie GmbH Printed circuit board for electronical power circuit containing power semiconductors
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
EP1503615A2 (en) * 2003-07-31 2005-02-02 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
EP1503615A3 (en) * 2003-07-31 2005-07-27 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
DE102007011811A1 (en) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Copper inlay for printed circuit boards
WO2009141413A1 (en) * 2008-05-21 2009-11-26 Nujira Limited Printed circuit board with co-planar plate and method of manufacturing therefor

Also Published As

Publication number Publication date
FR2413016B1 (en) 1981-06-26

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