JPS57206055A - Cooling system for electronic device - Google Patents

Cooling system for electronic device

Info

Publication number
JPS57206055A
JPS57206055A JP8957881A JP8957881A JPS57206055A JP S57206055 A JPS57206055 A JP S57206055A JP 8957881 A JP8957881 A JP 8957881A JP 8957881 A JP8957881 A JP 8957881A JP S57206055 A JPS57206055 A JP S57206055A
Authority
JP
Japan
Prior art keywords
metal foil
semiconductor devices
protrusions
substrate
cooling water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8957881A
Other languages
Japanese (ja)
Other versions
JPS6251498B2 (en
Inventor
Motohiro Sato
Noriyuki Ashiwake
Akio Yasukawa
Susumu Hioki
Fumiyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8957881A priority Critical patent/JPS57206055A/en
Publication of JPS57206055A publication Critical patent/JPS57206055A/en
Publication of JPS6251498B2 publication Critical patent/JPS6251498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Abstract

PURPOSE:To reduce thermal distortion by a method wherein protrusions are formed on the regions of a heat conducting plate that are not in contact with semiconductor devices. CONSTITUTION:Several semiconductor devices 10 are fixed face down to a substrate 9 by balls 11. The rear surface of the substrate 10 is plated with a metal film by evaporation and the metal film is provided with a piece of thin metal foil 13 exemplifiedly of Al or Cu with a solder layer 12 between. A cooling plate 14 and some cooling water channels 14a are provided on the other side of the metal foil 13. The parts of the metal foil 13 not in contact with the semiconductor devices 10 are provided with protrusions 15. Thermal distortion to be generated between the cooling water channels and the semiconductor devices is absorbed because of the employment of the metal foil 13 in the channels and the provision of protrusions in the metal foil 13 contributing to the reduction of stiffness.
JP8957881A 1981-06-12 1981-06-12 Cooling system for electronic device Granted JPS57206055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8957881A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8957881A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Publications (2)

Publication Number Publication Date
JPS57206055A true JPS57206055A (en) 1982-12-17
JPS6251498B2 JPS6251498B2 (en) 1987-10-30

Family

ID=13974675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8957881A Granted JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Country Status (1)

Country Link
JP (1) JPS57206055A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275599U (en) * 1985-10-30 1987-05-14
JPS62174406A (en) * 1986-01-28 1987-07-31 星和電機株式会社 Power source built-in type spontaneous light guide mark
JPH01106992U (en) * 1988-01-06 1989-07-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Also Published As

Publication number Publication date
JPS6251498B2 (en) 1987-10-30

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