JPS645045A - Cooling structure for integrated circuit package - Google Patents

Cooling structure for integrated circuit package

Info

Publication number
JPS645045A
JPS645045A JP15921387A JP15921387A JPS645045A JP S645045 A JPS645045 A JP S645045A JP 15921387 A JP15921387 A JP 15921387A JP 15921387 A JP15921387 A JP 15921387A JP S645045 A JPS645045 A JP S645045A
Authority
JP
Japan
Prior art keywords
heat
fins
conducting plate
cooling water
heat exchangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15921387A
Other languages
Japanese (ja)
Inventor
Yasuo Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15921387A priority Critical patent/JPS645045A/en
Publication of JPS645045A publication Critical patent/JPS645045A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve packaging density remarkably, by altenately arranging heat exchangers and printed circuit boards carrying integrated circuits on the opposite faces thereof, so that heat from the integrated circuits can be absorbed by cooling water passing within the heat exchangers. CONSTITUTION:A plurality of printed circuit boards 1 and a plurality of heat exchangers 3 are arranged altenately. Each of the heat exchangers 3 has a plurality of heat absorbing fins 4 and a heat conducting plate 6 by which the fins are fixed. The heat conducting plate 6 includes a water path 5 therein and is formed of a metal having a high heat conductivity. The fins 4 and the surface of the integrated circuit 2 adjacent thereto are spaced by a predetermined distance such that they are not in direct contact but closed to each other. Any heat conducted to the fins 4 is allowed to flow into the heat conducting plate 6 by heat conduction and increases temperature of cooling water within the water path 5. Thus, the heat can be taken out of the related apparatus together with the cooling water. In this manner, the packaging density can be improved remarkably.
JP15921387A 1987-06-26 1987-06-26 Cooling structure for integrated circuit package Pending JPS645045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15921387A JPS645045A (en) 1987-06-26 1987-06-26 Cooling structure for integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15921387A JPS645045A (en) 1987-06-26 1987-06-26 Cooling structure for integrated circuit package

Publications (1)

Publication Number Publication Date
JPS645045A true JPS645045A (en) 1989-01-10

Family

ID=15688798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15921387A Pending JPS645045A (en) 1987-06-26 1987-06-26 Cooling structure for integrated circuit package

Country Status (1)

Country Link
JP (1) JPS645045A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100427525B1 (en) * 2002-04-30 2004-04-28 위니아만도 주식회사 The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater
JPWO2013061409A1 (en) * 2011-10-25 2015-04-02 富士通株式会社 Water cooling device, electronic device having water cooling device, and water cooling method
JP2019143485A (en) * 2018-02-16 2019-08-29 エドワーズ株式会社 Vacuum pump and vacuum pump control device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100427525B1 (en) * 2002-04-30 2004-04-28 위니아만도 주식회사 The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater
JPWO2013061409A1 (en) * 2011-10-25 2015-04-02 富士通株式会社 Water cooling device, electronic device having water cooling device, and water cooling method
US9420720B2 (en) 2011-10-25 2016-08-16 Fujitsu Limited Liquid cooling apparatus
JP2019143485A (en) * 2018-02-16 2019-08-29 エドワーズ株式会社 Vacuum pump and vacuum pump control device

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