JPS645045A - Cooling structure for integrated circuit package - Google Patents
Cooling structure for integrated circuit packageInfo
- Publication number
- JPS645045A JPS645045A JP15921387A JP15921387A JPS645045A JP S645045 A JPS645045 A JP S645045A JP 15921387 A JP15921387 A JP 15921387A JP 15921387 A JP15921387 A JP 15921387A JP S645045 A JPS645045 A JP S645045A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- fins
- conducting plate
- cooling water
- heat exchangers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To improve packaging density remarkably, by altenately arranging heat exchangers and printed circuit boards carrying integrated circuits on the opposite faces thereof, so that heat from the integrated circuits can be absorbed by cooling water passing within the heat exchangers. CONSTITUTION:A plurality of printed circuit boards 1 and a plurality of heat exchangers 3 are arranged altenately. Each of the heat exchangers 3 has a plurality of heat absorbing fins 4 and a heat conducting plate 6 by which the fins are fixed. The heat conducting plate 6 includes a water path 5 therein and is formed of a metal having a high heat conductivity. The fins 4 and the surface of the integrated circuit 2 adjacent thereto are spaced by a predetermined distance such that they are not in direct contact but closed to each other. Any heat conducted to the fins 4 is allowed to flow into the heat conducting plate 6 by heat conduction and increases temperature of cooling water within the water path 5. Thus, the heat can be taken out of the related apparatus together with the cooling water. In this manner, the packaging density can be improved remarkably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15921387A JPS645045A (en) | 1987-06-26 | 1987-06-26 | Cooling structure for integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15921387A JPS645045A (en) | 1987-06-26 | 1987-06-26 | Cooling structure for integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645045A true JPS645045A (en) | 1989-01-10 |
Family
ID=15688798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15921387A Pending JPS645045A (en) | 1987-06-26 | 1987-06-26 | Cooling structure for integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645045A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100427525B1 (en) * | 2002-04-30 | 2004-04-28 | 위니아만도 주식회사 | The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater |
| JPWO2013061409A1 (en) * | 2011-10-25 | 2015-04-02 | 富士通株式会社 | Water cooling device, electronic device having water cooling device, and water cooling method |
| JP2019143485A (en) * | 2018-02-16 | 2019-08-29 | エドワーズ株式会社 | Vacuum pump and vacuum pump control device |
-
1987
- 1987-06-26 JP JP15921387A patent/JPS645045A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100427525B1 (en) * | 2002-04-30 | 2004-04-28 | 위니아만도 주식회사 | The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater |
| JPWO2013061409A1 (en) * | 2011-10-25 | 2015-04-02 | 富士通株式会社 | Water cooling device, electronic device having water cooling device, and water cooling method |
| US9420720B2 (en) | 2011-10-25 | 2016-08-16 | Fujitsu Limited | Liquid cooling apparatus |
| JP2019143485A (en) * | 2018-02-16 | 2019-08-29 | エドワーズ株式会社 | Vacuum pump and vacuum pump control device |
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