JPS56169354A - Cooling structure for large scale integrated circuit package - Google Patents

Cooling structure for large scale integrated circuit package

Info

Publication number
JPS56169354A
JPS56169354A JP7233180A JP7233180A JPS56169354A JP S56169354 A JPS56169354 A JP S56169354A JP 7233180 A JP7233180 A JP 7233180A JP 7233180 A JP7233180 A JP 7233180A JP S56169354 A JPS56169354 A JP S56169354A
Authority
JP
Japan
Prior art keywords
duct
package
integrated circuit
large scale
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7233180A
Other languages
Japanese (ja)
Other versions
JPS6131624B2 (en
Inventor
Tsuneaki Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7233180A priority Critical patent/JPS56169354A/en
Publication of JPS56169354A publication Critical patent/JPS56169354A/en
Publication of JPS6131624B2 publication Critical patent/JPS6131624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To effectively cool a high density LSI package by forming a duct of a good thermal conductor and brining the duct into contact with a heat sink. CONSTITUTION:A package 2 in which many LSIs 1 are mounted is mounted in high density on a printed board 3, and is electrically connected with a connector 4. A duct 6' of a good thermal conductor is constructed by conveying a heat sink 5 secured to each package 2 and brining it into contact with the end of the heat sink 5, and a cold air is fed by a blower 7 to the heat sinks 5. According to this structure the heat can be readily moved from the high temperature LSIs through the duct 6', and the duct itself can effectively cool the LSI packages as a part of the heat sinks.
JP7233180A 1980-05-30 1980-05-30 Cooling structure for large scale integrated circuit package Granted JPS56169354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7233180A JPS56169354A (en) 1980-05-30 1980-05-30 Cooling structure for large scale integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7233180A JPS56169354A (en) 1980-05-30 1980-05-30 Cooling structure for large scale integrated circuit package

Publications (2)

Publication Number Publication Date
JPS56169354A true JPS56169354A (en) 1981-12-26
JPS6131624B2 JPS6131624B2 (en) 1986-07-21

Family

ID=13486192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7233180A Granted JPS56169354A (en) 1980-05-30 1980-05-30 Cooling structure for large scale integrated circuit package

Country Status (1)

Country Link
JP (1) JPS56169354A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511940Y2 (en) * 1987-02-17 1993-03-25

Also Published As

Publication number Publication date
JPS6131624B2 (en) 1986-07-21

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