JPS56148855A - High density package - Google Patents

High density package

Info

Publication number
JPS56148855A
JPS56148855A JP5308780A JP5308780A JPS56148855A JP S56148855 A JPS56148855 A JP S56148855A JP 5308780 A JP5308780 A JP 5308780A JP 5308780 A JP5308780 A JP 5308780A JP S56148855 A JPS56148855 A JP S56148855A
Authority
JP
Japan
Prior art keywords
lsi
substrate
package
contacting
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5308780A
Other languages
Japanese (ja)
Inventor
Yoshikatsu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5308780A priority Critical patent/JPS56148855A/en
Publication of JPS56148855A publication Critical patent/JPS56148855A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide a contacting unit capable of being connected to an external unit in a high density package by improving a cooling structure to readily mount an LSI package, enabing to supply a large current and simplifying the cooling structure. CONSTITUTION:A power bus 11, a connecting connector 10 and an LSI package 4 are mounted to form a cooling air passage 14 by a fan 1 provided at the end of a multilayer substrate 2. This LSI pacakge 4 mounts a substrate 12, an LSI semiconductor element 5 carried on the substrate 12, contacting pins connected to a cable 3, the substrate 12 and the power bus 11 mechanically, and has screws 8 for supplying a voltage to the substrate 12, a cooling heat sink 9, and contacting pins 6. Cooling air is flowed by a fan 1 into the passage 14 to cool the semiconductor element 5 carried on the LSI package 4 through the heat sink 9. A signal can be transmitted via the contacting pins 7 directly between the LSI packages.
JP5308780A 1980-04-22 1980-04-22 High density package Pending JPS56148855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5308780A JPS56148855A (en) 1980-04-22 1980-04-22 High density package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5308780A JPS56148855A (en) 1980-04-22 1980-04-22 High density package

Publications (1)

Publication Number Publication Date
JPS56148855A true JPS56148855A (en) 1981-11-18

Family

ID=12932992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5308780A Pending JPS56148855A (en) 1980-04-22 1980-04-22 High density package

Country Status (1)

Country Link
JP (1) JPS56148855A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages

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