TW201541565A - A whole structure of an intelligent power semiconductor module having an integrated heat sink - Google Patents

Abstract

This invention relates to a whole structure of an integrated heat sink and an intelligent power semiconductor module, the whole structure including a power semiconductor module, first and second control circuit boards. The power semiconductor module includes a chip, a DBC board, a heat sink and a module casing, wherein the chip is welded on the DBC board and has a silicon protective layer covered thereon; the module casing has first and second electrode terminals disposed thereon; the first and second control circuit boards are fixedly disposed on the first and second electrode terminals respectively, wherein the installation position of the second control circuit board is higher than the upper surface of the silicon protective layer. The invention integrates the drive circuit board, the first and second control circuit boards with the power semiconductor module having the heat sink such that approximately 30% of the dimensions can be reduced, and further, each of the control boards are fixed independently to allow direct replacement of the defective board as required and thus increase and provide greater maintenance flexibility.

Description

Overall structure of integrated heat sink and smart power semiconductor module

The invention relates to a power semiconductor module structure, in particular to a whole machine structure integrating a heat sink and a smart power semiconductor module.

Power semiconductor modules are often combined with other peripheral structures, such as heat sinks, drive circuit power boards, and CPU control boards, to form power semiconductor modules to achieve various functions, such as inverters, UPS, and electric welders. The electronics field is widely used. For example, in the inverter, the general combination of the power semiconductor module and the heat sink, the driving circuit power board and the CPU control board is as shown in FIG. 1 , the bottom of the power semiconductor module 1 is uniformly coated with the thermal grease 15 and then locked with a screw. On the air-cooling heat sink 16, the driving circuit power board 14 is soldered on the power semiconductor module 1, and the CPU board 3 is connected to the driving circuit power board 14 through the plug-in signal line, wherein the power semiconductor module is provided by a special module manufacturer. The rest is designed by the inverter or other terminal manufacturers. The advantage of this type of cooperation is that the engineer can freely design peripheral components according to the existing power semiconductor module, and the product has large flexibility, simple design, convenient disassembly and assembly, and shortcomings; The formed power semiconductor module is bulky and has low integration. Taking the frequency converter as an example, through research and analysis, it is large in size and low in integration. 15% is because the drive circuit power board and CPU board of the existing power semiconductor module are large, and the other 70% is power. The size of the heat sink of the semiconductor module is related (and the volume of the heat sink is proportional to the power consumption of the module).

In view of the drawbacks of the prior art, various manufacturers have made improvements: some companies have unpacked the driver circuit board into the driver board 2 and the power board 4, and then integrated the driver board 2 into the power semiconductor module 1 for the purpose. The epoxy is embedded, as shown in Fig. 2, the formed power semiconductor module is called IPM (Smart Power Module). This splitting method can improve the integration degree and reduce the volume to a certain extent, but the reduced volume is very limited, less than 10%; and because the driving circuit board is embedded in the power semiconductor module by the epoxy, it is difficult to disassemble and replace Therefore, the flexibility is not high enough and it is not easy to repair. The European module manufacturer Semikron uses the crimping technology to directly press the power semiconductor module 1 on the flat water-cooled heat sink 17 by means of a mechanical spring, as shown in Fig. 3, which can reduce the volume of the heat sink to the original. About 1/3 of the total power semiconductor module reduces the size and efficiency, but the crimping equipment and method used are complicated and difficult to implement, and the water-cooled heat sink 17 is generally complicated and expensive, so the method is formed. Power semiconductor modules are suitable for high-end applications. Other manufacturers, such as Infineon, use a new generation of low-power chips to reduce the size of the heatsink, which is the most direct and effective way. However, in order to reduce the size of the heat sink without reducing the output power, it is necessary to replace the wafer inside the power semiconductor module with a new generation of chips with lower technical power consumption. The technology is currently being ridged by several international companies. Broken; and the wafer replacement investment is huge, the cycle is long, and it is possible for several years or even decades.

In summary, the prior art structure improvement method of the power semiconductor module is not low integration degree, and the flexibility is reduced, that is, the cost is high and the improvement period is long, so a new power semiconductor module structure needs to be designed.

The technical problem to be solved by the present invention is to provide a complete structure of an integrated heat sink and a smart power semiconductor module, so as to solve the technical problem that the power semiconductor module structure in the prior art is bulky and low in integration.

The technical solution to solve the above technical problem is as follows: comprising a power semiconductor module, a first control circuit board and a second control circuit board, the power semiconductor module comprising a wafer, a DBC board, a heat sink and accommodating the DBC board and the chip a module housing; the DBC board is soldered to the upper surface of the heat sink; the wafer is soldered on the surface of the DBC board, and the wafer is covered with a silicone protective layer; the module housing is disposed adjacent to both ends of the DBC board a first slot and a second slot, wherein the first and second slots are respectively provided with a first electrode terminal and a second electrode terminal, and the first control circuit board is fixed on the first electrode terminal, the second The control circuit board is fixed on the second electrode terminal, and the second control circuit board is mounted at a position higher than an upper surface of the silicone protective layer.

Based on the above technical solutions, the present invention can also be improved as follows.

Further, the first control circuit board is fixed on the first electrode terminal by plugging or soldering.

Further, the second control circuit board is fixed by the plugging or soldering On the second electrode terminal.

Further, a heat sink is fixed to the bottom of the heat sink.

Further, the heat sink is a composite board of at least two layers, and the DBC board is welded on the upper surface of the uppermost layer of the composite board, and the bottom of the composite board is provided with a groove, and the heat sink is inserted in the groove.

Further, the heat sink is a copper-aluminum-copper three-layer composite board composed of an upper copper layer, an intermediate aluminum layer and a bottom copper layer, and the DBC board is soldered on the surface of the upper copper layer, and the bottom copper layer is provided with a heat sink for inserting the heat sink. Groove.

Further, the first control circuit board is a power board, and the second control circuit board is a driving circuit board.

Further, a CPU board is further included, and the CPU board is connected to the driving circuit board through a plug-in signal line.

Further, the first control circuit board is a power board, and the second control circuit board is a driving CPU integrated circuit board.

Further, the first control circuit board is a capacitor voltage conversion integrated board of the power board, and the second control circuit board is a protection circuit board of the power board.

The invention has the beneficial effects that the whole structure of the integrated heat sink and the smart power semiconductor module is integrated, and the first control circuit board and the second control circuit board are respectively integrated on the power semiconductor module with the heat sink. Not only the volume is reduced by 30%, but also the volume can be further reduced with the new wafer technology. At the same time, each control board is independently fixed. When a fault occurs, each control board can be directly replaced, and the power semiconductor module is improved. Group flexibility for repair and replacement.

1‧‧‧Power semiconductor module

2‧‧‧Second control circuit board, drive circuit board

3‧‧‧CPU board

4‧‧‧First control circuit board, power board

5‧‧‧DBC board

6‧‧‧Modular housing

7‧‧‧ wafer

8‧‧‧矽 rubber protective layer

9.1‧‧‧First slot

9.2‧‧‧Second slot

10.1‧‧‧First electrode terminal

10.2‧‧‧Second electrode terminal

11‧‧‧ radiator, composite board

11.1‧‧‧Upper copper layer

11.2‧‧‧Intermediate aluminum layer

11.3‧‧‧Bottom copper layer

12‧‧‧ Groove

13‧‧‧ Heat sink

14‧‧‧Drive circuit power board

15‧‧‧ Thermal Grease

16‧‧‧Air-cooled radiator

17‧‧‧Water-cooled radiator

1 is a schematic structural view of a power semiconductor module used in a prior art for a frequency converter; FIGS. 2 and 3 are schematic structural views of a power semiconductor module for an improved inverter; and FIG. 4 is an integrated heat sink of the present invention. And a schematic structural diagram of the whole structure of the smart power semiconductor module; and FIG. 5 is a structural schematic diagram of the whole structure of the integrated heat sink and the smart power semiconductor module for the inverter in the first embodiment.

The principles and features of the present invention are described below in conjunction with the drawings, which are intended to illustrate the invention and not to limit the scope of the invention.

4 is a schematic structural view of a whole structure of an integrated heat sink and a smart power semiconductor module according to the present invention, including a power semiconductor module 1, a second control circuit board 2, and a first control circuit board 4, the power semiconductor module 1 includes a wafer 7, a DBC board 5, a heat sink 11 and a module housing 6 accommodating the DBC board 5 and the wafer 7; the wafer 7 is soldered on the upper surface of the DBC board 5, and the wafer 7 is covered with a silicone protective layer 8 A first slot 9.1 and a second slot 9.2 are disposed on the outer periphery of the DBC board 5, and the first slot 9.1 and the second slot 9.2 are respectively provided with a first electrode terminal 10.1. And the second electrode terminal 10.2, the first control circuit board 4 is fixed on the first electrode terminal 10.1, the second control circuit board 2 is fixed on the second electrode terminal 10.2, and the second control circuit board 2 is mounted. The position is higher than the upper surface of the silicone protective layer 8.

Embodiment 1 is an integrated heat sink and smart power semiconductor for a frequency converter The whole structure of the body module, as described in FIG. 5, is a structural schematic diagram of the whole structure of the integrated heat sink and the smart power semiconductor module for the frequency converter in the first embodiment, and the heat sink 11 is a composite board. The composite board 11 is a copper-aluminum-copper three-layer structure, the DBC board 5 is welded on the upper surface of the upper copper layer 11.1, the intermediate layer of the composite board 11 is an intermediate aluminum layer 11.2, and the bottom copper layer 11.3 is provided with a groove 12, the groove 12 has a heat sink 13 inserted therein. In other embodiments, the composite panel 11 can be at least two layers. The DBC board 5 is soldered to the upper surface of the uppermost layer of the composite panel 11. The bottom of the composite panel 11 is provided with a recess 12, and the heat sink 13 is inserted. Within the recess 12.

In the first embodiment, the first control circuit board 4 is a power supply board for supplying power, and the second control circuit board 2 is a driving circuit board, and the power supply board is fixed on the first electrode terminal 10.1 by plugging or soldering; The driving circuit board is fixed on the second electrode terminal 10.2 by plugging or soldering; the whole structure further includes a CPU board 3 for controlling the driving circuit board, and the CPU board 3 is connected to the driving circuit through the plugging and unplugging signal line The boards are connected.

In other embodiments, the first control circuit board and the second control circuit board may be specifically set according to actual needs, and the circuit board that is more easily damaged is independently disposed on the second electrode terminal for replacement. For example, in another embodiment, the first control circuit board is a power board, and the second control circuit board is a driving CPU integrated circuit board integrated with the driving board and the CPU board; in another embodiment, the first control circuit The board is a capacitor transformer integrated board that is independent of the capacitor and the transformer part of the power board. The second control circuit board is a protection circuit board that is independent of the protection line part of the power board.

The invention provides an integrated heat sink and a smart power semiconductor module The whole machine structure integrates the first control circuit board and the second control circuit board into the power semiconductor module with the heat sink respectively, which not only reduces the volume by 30%, but also cooperates with the new wafer technology in the later stage, and the volume can also be It is further reduced; at the same time, each control board is independently fixed. When a fault occurs, each control board can be directly replaced, which improves the flexibility of repair and replacement of the power semiconductor module.

The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalents, improvements, etc., which are within the spirit and scope of the present invention, should be included in the scope of the present invention. Inside.

2‧‧‧Second control circuit board

4‧‧‧First Control Board

5‧‧‧DBC board

6‧‧‧Modular housing

7‧‧‧ wafer

8‧‧‧矽 rubber protective layer

9.1‧‧‧First slot

9.2‧‧‧Second slot

10.1‧‧‧First electrode terminal

10.2‧‧‧Second electrode terminal

11‧‧‧ radiator

11.1‧‧‧Upper copper layer

11.2‧‧‧Intermediate aluminum layer

11.3‧‧‧Bottom copper layer

12‧‧‧ Groove

13‧‧‧ Heat sink

Claims (10)

A complete machine structure integrating a heat sink and a smart power semiconductor module includes: a power semiconductor module comprising: a wafer covered with a silicone protective layer; a DBC board; a heat sink; and a module housing a DBC board and a wafer; a first control circuit board; and a second control circuit board; wherein the DBC board is soldered to an upper surface of the heat sink, and the wafer is soldered to the DBC board surface, and the module housing is a first slot and a second slot are disposed at two ends of the DBC board, and the first electrode terminal and the second electrode terminal are respectively disposed in the first and second slots, where the first control circuit board is fixed The second control circuit board is fixed on the second electrode terminal, and the second control circuit board is mounted at a position higher than an upper surface of the silicone protective layer. The integrated structure of the integrated heat sink and the smart power semiconductor module according to claim 1, wherein the first control circuit board is fixed to the first electrode terminal by plugging or soldering. The integrated structure of the integrated heat sink and the smart power semiconductor module according to claim 1, wherein the second control circuit board is fixed to the second electrode terminal by plugging or soldering. Integrated heat sink and smart power as described in claim 1 The whole structure of the semiconductor module, wherein a heat sink is fixed on the bottom of the heat sink. The integrated structure of the integrated heat sink and the smart power semiconductor module according to claim 4, wherein the heat sink is a composite board of at least two layers, and the DBC board is welded on the uppermost layer of the composite board. The bottom surface of the composite plate is provided with a groove, and the heat sink is inserted in the groove. The whole structure of the integrated heat sink and the smart power semiconductor module as described in claim 4, wherein the heat sink is a copper, aluminum and copper three-layer composite board composed of an upper copper layer, an intermediate aluminum layer and a bottom copper layer. The DBC board is soldered to the surface of the upper copper layer, and the bottom copper layer is provided with a recess for inserting the heat sink. The whole structure of the integrated heat sink and the smart power semiconductor module as described in claim 1, 2, 3, 4, 5 or 6, wherein the first control circuit board is a power board, and the second control The board is the drive board. The overall structure of the integrated heat sink and the smart power semiconductor module described in claim 7 further includes a CPU board, and the CPU board is connected to the driving circuit board through a plug-in signal line. The whole structure of the integrated heat sink and the smart power semiconductor module as described in claim 1, 2, 3, 4, 5 or 6, wherein the first control circuit board is a power board, and the second control The board is designed to drive the CPU to integrate the board. As described in the scope of patent application 1, 2, 3, 4, 5 or 6 The whole structure of the heat exchanger and the smart power semiconductor module, wherein the first control circuit board is a capacitor voltage conversion integrated board of the power board, and the second control circuit board is a protection circuit board of the power board.