WO2023087842A1

WO2023087842A1 - Integrated circuit apparatus for high-power modules in aerospace power supply product and mounting method therefor

Info

Publication number: WO2023087842A1
Application number: PCT/CN2022/115624
Authority: WO
Inventors: 许志尧; 宋伟; 支树播; 顾毅; 裴行政; 张宇; 杨硕
Original assignee: 北京卫星制造厂有限公司
Priority date: 2021-11-16
Filing date: 2022-08-29
Publication date: 2023-05-25
Also published as: CN114190042A

Abstract

The present invention relates to the technical fields of satellite-borne power supply integrated circuit apparatus and mounting, and an integrated circuit apparatus for high-power modules in an aerospace power supply product and a mounting method therefor. The integrated circuit apparatus comprises an integrated base (1), the upper surface of the integrated base (1) being composed of a ceramic plate assembly functional area, a transformer assembly functional area, and an inductor assembly functional area; a ceramic plate assembly (2), the ceramic plate assembly (2) being provided on the ceramic plate assembly functional area; a transformer assembly (3), the transformer assembly (3) being provided on the transformer assembly functional area; and an inductor assembly (4), the inductor assembly (4) being provided on the inductor assembly functional area. The present invention can solve the problems of complex mounting, debugging, and testing of high-power modules in an aerospace power supply product and higher and higher maintainability implementation difficulty, and improve the mounting, debugging, testing, and maintenance efficiency of the aerospace power supply product.

Description

High-power module integrated circuit device for aerospace power supply products and installation method thereof

This application claims the priority of the Chinese patent application submitted to the China Patent Office on November 16, 2021, with the application number 202111351747.8 and the application name "High-power module integrated circuit device for aerospace power supply products and its installation method", the entire content of which Incorporated in this application by reference.

technical field

The invention relates to a high-power module integrated circuit device of an aerospace power supply product and an installation method thereof.

Background technique

Spacecraft power supply and power supply and distribution products contain a large number of high-power modules, and there are many power devices inside the modules and the installation is complicated. As the size of the product decreases, the installation, debugging, and testing of the high-power modules inside the product become more and more complicated, and it becomes more and more difficult to achieve maintainability. Therefore, it is necessary to improve the efficiency of high-power module installation, commissioning and maintenance through integrated design of high-power modules, installation design of embedded structures, and interchangeability design.

When traditional high-power modules are installed, the layout method of flat design in the plane is adopted, and the power transformer, output filter inductor, power switch tube, output rectifier, freewheeling diode and other components are evenly arranged inside the module. However, due to the uneven distribution of heat consumption of the device, it is easy to cause a large internal temperature gradient of the product when the high-power module is working, causing a problem of high temperature rise of the local device. At the same time, due to the different dimensional tolerances and installation requirements of different devices, there are also defects such as crossed leads between different independent units and difficult maintenance.

technical problem

In order to overcome the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a high-power module integrated circuit device for aerospace power supply products and its installation method, which can solve the problem that the installation, debugging and testing of high-power modules for aerospace power supply products are becoming more and more complicated and difficult. The realization of maintainability is becoming more and more difficult, and the efficiency of installation, debugging, testing and maintenance of aerospace power supply products is improved.

technical solution

For realizing above-mentioned purpose of the invention, technical scheme of the present invention is:

The invention provides a high-power module integrated circuit device for aerospace power supply products, including:

An integrated base, the upper surface of which is composed of ceramic plate component functional areas, transformer component functional areas and inductor component functional areas;

A ceramic plate assembly, the ceramic plate assembly is arranged on the functional area of the ceramic plate assembly;

a transformer component, the transformer component is arranged on the functional area of the transformer component;

An inductor component is arranged on the functional area of the inductor component.

According to one aspect of the present invention, the functional area of the ceramic plate assembly includes a first functional area of the ceramic plate assembly and a functional area of the second ceramic plate assembly, and the functional area of the first ceramic plate assembly and the functional area of the second ceramic plate are respectively The first tin-lead alloy coating layer and the second tin-lead alloy coating layer are arranged on the functional area of the component,

The ceramic plate assembly includes a first ceramic assembly and a second ceramic assembly, and the first ceramic assembly and the second ceramic assembly are respectively disposed on the first pewter plating layer and the second pewter plating layer.

According to one aspect of the present invention, the ceramic board assembly includes a power switch tube, a rectifier diode, a freewheeling diode, a ceramic board and a pad,

The power switch tube, the rectifier diode and the freewheeling diode are evenly arranged and welded on the ceramic board;

The first ceramic component and the second ceramic component are respectively soldered to the first tin-lead alloy plating layer and the second tin-lead alloy plating layer through the pads disposed at the bottom of the ceramic plate.

According to one aspect of the present invention, the transformer assembly includes a transformer base, a transformer pressing block, a high-frequency transformer, and a second mounting hole for the transformer assembly,

The transformer base and the transformer pressing block clamp the high-frequency transformer;

The second installation hole of the transformer assembly is set at the bottom of the transformer base;

The second installation hole of the transformer assembly is aligned with and screwed to the first installation hole of the transformer assembly provided on the functional area of the transformer assembly, so as to realize the connection between the transformer assembly and the integrated base.

According to one aspect of the present invention, the inductor component includes a wire-wound inductor and a second mounting hole for the inductor component,

The second mounting hole of the inductor assembly is set at the center of the bottom of the wire-wound inductor;

The second installation hole of the inductor assembly is aligned with the first installation hole of the inductor assembly provided on the functional area of the inductor assembly and screwed to realize the connection between the inductor assembly and the integrated base.

According to one aspect of the present invention, the material of the integrated base is aluminum-based silicon carbide.

In another aspect, the present invention provides a method for installing a high-power module integrated circuit device of an aerospace power supply product, including:

S1. On the upper surface of the integrated base, a ceramic board component functional area, a transformer component functional area and an inductor component functional area are set;

S2. Install a ceramic plate assembly on the functional area of the ceramic plate assembly;

S3. Installing a transformer component on the transformer component functional area;

S4. Installing an inductor component in the inductor component functional area.

According to one aspect of the present invention, step S2 also includes:

A lead-tin alloy coating is arranged on the functional area of the ceramic plate assembly;

Weld the power switch tube, rectifier diode and freewheeling diode on the ceramic board;

setting pads on the bottom of the ceramic board;

The ceramic board assembly is soldered to the lead-tin alloy plating through the pads.

According to one aspect of the present invention, step S3 also includes:

Set the transformer base and the transformer pressing block to clamp the high-frequency transformer to form a transformer assembly;

A second mounting hole for the transformer assembly is provided at the bottom of the transformer base;

A first installation hole for the transformer component is set on the functional area of the transformer component;

Aligning and screwing the first installation hole of the transformer assembly with the second installation hole of the transformer assembly realizes the connection between the transformer assembly and the integrated base.

According to one aspect of the present invention, step S4 also includes:

A second mounting hole for the inductor assembly is provided at the center of the bottom of the wire wound inductor;

setting a first installation hole for the inductor component on the functional area of the inductor component;

Aligning and screwing the first mounting hole of the inductor assembly with the second mounting hole of the inductor assembly realizes the connection of the inductor assembly and the integrated base.

Beneficial effect

According to the solution of the present invention, the high-power module integrated circuit device of the aerospace power supply product can realize power conversion of the integrated circuit device on the one hand by arranging and integrating ceramic plate components, transformer components and inductor components on the integrated base. On the other hand, the high heat generated by the integrated high-power modules or components can be quickly dissipated, reducing the impact on the performance of each component.

The on-board integrated circuit device mainly realizes the DC/DC power conversion function, and converts the direct current provided by the satellite battery through the distributor into various voltages required by the load equipment to ensure the normal operation and power consumption of each stand-alone equipment, and at the same time receive the switch of the antenna distributor machine signal to realize the switch machine action. It has the advantages of high power, high current and high integration.

According to a solution of the present invention, the integrated three-dimensional installation of components with multiple independent electrical functions is adopted, and different devices in the same functional module are integrated and installed on the multifunctional, integrated high-power module base, which is an independent component in the module. The components provide temperature protection function, which can effectively ensure the thermal reliability of key components and at the same time take into account the installation design requirements.

The invention can configure independent installation interfaces for independent components in the module, and adopt different device embedded installation interfaces for different device design parameters. Adopting the design of the interchangeability of the internal components can enhance the versatility and replaceability of the integrated circuit device, making it highly maintainable, convenient for debugging and operation, and has the advantages of simple and flexible operation.

Description of drawings

Fig. 1 schematically shows a schematic structural view of a high-power module integrated circuit device of an aerospace power supply product according to an embodiment of the present invention;

Fig. 2 schematically shows a schematic structural view of the upper surface of the integrated base in the high-power module integrated circuit device of the aerospace power supply product according to an embodiment of the present invention;

Fig. 3 schematically shows a front view of a transformer assembly in a high-power module integrated circuit device of an aerospace power supply product according to an embodiment of the present invention;

Fig. 4 schematically shows the bottom view of the transformer assembly in the high-power module integrated circuit device of the aerospace power supply product according to an embodiment of the present invention;

Fig. 5 schematically shows a flowchart of a method for installing a high-power module integrated circuit device of an aerospace power supply product according to an embodiment of the present invention.

Reference signs:

1: Integrated base; 2: Ceramic plate assembly; 2-1: The first ceramic plate assembly; 2-2: The second ceramic plate assembly; 3: Transformer assembly; 4: Inductor assembly; 5: The first lead-tin alloy Plating layer; 5-1: Second lead-tin alloy coating; 6: First mounting hole of transformer component; 7: First mounting hole of inductor component; 8: Transformer pressing block; 9: Transformer base; 10: High frequency transformer; 11 : The second mounting hole of the transformer assembly.

Embodiments of the present invention

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following

Briefly introduce the accompanying drawings used in the implementation. Apparently, the drawings in the following description are only some implementations of the present invention, and those skilled in the art can also obtain other drawings based on these drawings without creative efforts.

When describing the embodiments of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientation or positional relationship expressed by "horizontal", "top", "bottom", "inner" and "outer" is based on the orientation or positional relationship shown in the relevant drawings, which are only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed, or operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, and the embodiments cannot be repeated here one by one, but the embodiments of the present invention are not therefore limited to the following embodiments.

FIG. 1 schematically shows a schematic structural view of a high-power module integrated circuit device of an aerospace power supply product according to this embodiment. As shown in FIG. 1 , this embodiment provides a high-power module integrated circuit device of an aerospace power supply product. The device mainly includes: an integrated base 1 , a ceramic board component 2 , a transformer component 3 and an inductor component 4 . Wherein, the upper surface of the integrated base 1 is composed of three functional areas, which are respectively the functional area of the ceramic plate assembly, the functional area of the transformer assembly and the functional area of the inductor assembly. The ceramic board assembly 2 , the transformer assembly 3 and the inductor assembly 4 are respectively arranged on the ceramic board assembly functional area, the transformer assembly functional area and the inductor assembly functional area. By integrating the ceramic plate assembly 2, the transformer assembly 3 and the inductor assembly 4 on the integrated base 1, a high-power module integrated circuit device capable of realizing power conversion and voltage transformation functions is formed. The on-board integrated circuit device mainly realizes the DC/DC power conversion function, and converts the direct current provided by the satellite battery through the distributor into various voltages required by the load equipment to ensure the normal operation and power consumption of each stand-alone equipment, and at the same time receive the switch of the antenna distributor machine signal to realize the switch machine action. It has the advantages of high power, high current and high integration.

FIG. 2 schematically shows the structure diagram of the upper surface of the integrated base in the high-power module integrated circuit device of the aerospace power supply product of this embodiment. As shown in Figure 2, the ceramic plate assembly functional area on the upper surface of the integrated base 1 includes a first ceramic plate assembly functional area and a second ceramic plate assembly functional area, and respectively in the first ceramic plate assembly functional area and the second ceramic plate assembly functional area The first tin-lead alloy coating layer 5 and the second tin-lead alloy coating layer 5-1 are arranged on the functional area of the board component, and the mounting interfaces of different devices are reserved, such as the first mounting hole 6 of the transformer component and the first mounting hole of the inductor component 7. Wherein, as shown in FIG. 1 , the lead-tin alloy coating is used for installing the ceramic plate assembly 2 , the first installation hole 6 of the transformer assembly is used for installing the transformer assembly 3 , and the first installation hole 7 of the inductor assembly is used for installing the inductor assembly 4 . The ceramic plate assembly 2 includes a first ceramic assembly 2-1 and a second ceramic assembly 2-2, and the first ceramic assembly 2-1 and the second ceramic assembly 2-2 are arranged on the first lead-tin alloy coating 5 and the second ceramic assembly 2-2 respectively. Dilead-tin alloy coating 5-1, so that the ceramic plate assembly 2 is arranged on the functional area of the ceramic plate assembly. In this embodiment, the arrangement here may be by welding the ceramic plate assembly 2 on the lead-tin alloy coating 5 .

The ceramic board assembly 2 includes a power switch tube, a rectifier diode, a freewheeling diode, a ceramic board and pads (not shown in the figure). As shown in Figure 1, the power switch tube, rectifier diode and freewheeling diode are uniformly arranged and welded on the ceramic board. Pads are provided on the bottom of the ceramic board. Further, in this embodiment, soldering pads on the first ceramic component 2-1 and the second ceramic component 2-2 to the first tin-lead alloy coating 5 and the second tin-lead alloy coating 5-1 respectively, The ceramic plate assembly 2 is arranged on the functional area of the ceramic plate assembly.

Fig. 3 and Fig. 4 schematically show the front view and bottom view of the transformer assembly in the high-power module integrated circuit device of the aerospace power supply product of the present embodiment respectively. The transformer assembly 3 includes a transformer base 9 , a transformer pressing block 8 , a high frequency transformer 10 and a second installation hole 11 of the transformer assembly. Wherein, as shown in FIG. 3 , the high-frequency transformer 10 is clamped by the transformer base 9 and the transformer pressing block 8 to form an independent transformer assembly. At the same time, the second installation hole 11 of the transformer assembly is provided at the bottom of the transformer base 9, as shown in FIG. 4 . The transformer assembly 3 is aligned with the first installation hole 6 of the transformer assembly through the second installation hole 11 of the transformer assembly, and connects the transformer assembly 2 with the integrated base 1 . In this embodiment, screws can be used to connect the transformer assembly 2 to the integrated base 1 , so that the transformer assembly 2 is installed on the integrated base 1 . Of course, those skilled in the art should understand that other appropriate ways can also be used to connect the transformer assembly 2 and the integrated base 1 .

In this embodiment, the inductor component 4 includes a wire-wound inductor and a second mounting hole of the inductor component. Wherein, the second installation hole of the inductor assembly is set at the center of the bottom of the wire-wound inductor. Moreover, the inductor assembly 4 is aligned with the first installation hole of the inductor assembly through the second installation hole of the inductor assembly, and the inductor assembly 4 is connected to the integrated base 1 . In this embodiment, screws may also be used to connect the inductor assembly 4 to the integrated base 1 , so as to install the inductor assembly 4 on the integrated base 1 . Of course, those skilled in the art should understand that other appropriate ways can also be used to connect the inductor component 4 and the integrated base 1 .

The material of the integrated base 1 is aluminum-based silicon carbide. The integrated base 1 using this material has the characteristics of high thermal conductivity and rapid heat dissipation, which can quickly dissipate the high heat generated by each high-power module or component integrated on the integrated base 1 during work, reducing the impact on the major power modules. Or the impact of component performance, provide temperature protection function for independent constituent units in the module.

In addition, the position, size and quantity of the lead-tin alloy coating 5 on the integrated base 1, the first installation holes 6 of the transformer assembly and the first installation holes 7 of the inductor assembly can be adjusted according to the integrated modules and their layout. The devices that can be installed on the above-mentioned integrated base 1 are not limited to the above-mentioned ceramic board assembly 2, transformer assembly 3, and inductor assembly 4, and any device or assembly with an independent installation interface can be installed. At the same time, the integrated base 1 can design suitable installation interfaces for different devices.

FIG. 5 schematically shows a flowchart of a method for installing a high-power module integrated circuit device of an aerospace power supply product according to this embodiment.

As shown in Fig. 5, the method comprises the following steps: S1. setting the functional area of the ceramic plate assembly, the functional area of the transformer assembly and the functional area of the inductor assembly on the upper surface of the integrated base; S2. installing the functional area of the ceramic plate assembly Ceramic plate assembly; S3. Installing the transformer assembly on the functional area of the transformer assembly; S4. Installing the inductor assembly on the functional area of the inductor assembly.

Specifically, step S2 also includes: setting a lead-tin alloy coating on the functional area of the ceramic plate assembly; welding the power switch tube, rectifier diode, and freewheeling diode on the ceramic plate; setting a pad at the bottom of the ceramic plate; Pads to solder the ceramic board assembly to the lead-tin alloy plating.

Specifically, step S3 also includes: setting the transformer base and the transformer pressing block to clamp the high-frequency transformer to form a transformer assembly; setting a second installation hole for the transformer assembly at the bottom of the transformer base; holes; align and screw the first installation hole of the transformer assembly with the second installation hole of the transformer assembly, so as to realize the connection between the transformer assembly and the integrated base.

Specifically, step S4 also includes: setting a second mounting hole for the inductor component at the center of the bottom of the wire-wound inductor; setting a first mounting hole for the inductor component on the functional area of the inductor component; installing the first mounting hole for the inductor component The hole is aligned with the second mounting hole of the inductor component and screwed, so as to realize the connection of the inductor component and the integrated base.

Through the above-mentioned installation method for the high-power module integrated circuit device of the aerospace power supply product, the ceramic board component, the transformer component and the inductor component can be integrated on the integrated base, and the layout design of these components is carried out according to the layout method of this embodiment On the one hand, the integrated circuit device can realize the functions of power conversion and voltage transformation, on the other hand, it can provide temperature protection function for the independent components in the module, effectively ensure the thermal reliability of key components, and quickly dissipate heat while taking into account the installation design requirements On the other hand, the integrated circuit device can be made versatile and easy to replace, and the efficiency of installation, debugging, testing and maintenance of aerospace power supply products can be improved.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

A high-power module integrated circuit device for aerospace power supply products, characterized in that it includes:

An integrated base (1), the upper surface of the integrated base (1) is composed of ceramic plate component functional areas, transformer component functional areas and inductor component functional areas;

A ceramic plate assembly (2), the ceramic plate assembly (2) is arranged on the functional area of the ceramic plate assembly;

A transformer component (3), the transformer component (3) is arranged on the functional area of the transformer component;

An inductor component (4), the inductor component (4) is arranged on the functional area of the inductor component.
The integrated circuit device according to claim 1, wherein the functional area of the ceramic board assembly includes a first functional area of the ceramic board assembly and a second functional area of the ceramic board assembly, and are respectively in the functional area of the first ceramic board assembly The first tin-lead alloy coating (5) and the second tin-lead alloy coating (5-1) are provided on the area and the functional area of the second ceramic plate assembly,

The ceramic plate assembly (2) includes a first ceramic assembly (2-1) and a second ceramic assembly (2-2), and the first ceramic assembly (2-1) and the second ceramic assembly (2-2) ) are respectively arranged on the first tin-lead alloy coating layer (5) and the second tin-lead alloy coating layer (5-1).
The integrated circuit device according to claim 2, wherein the ceramic board assembly (2) includes a power switch tube, a rectifier diode, a freewheeling diode, a ceramic board and a welding pad,

The power switch tube, the rectifier diode and the freewheeling diode are evenly arranged and welded on the ceramic board;

The first ceramic component (2-1) and the second ceramic component (2-2) are respectively welded to the first lead-tin alloy plating layer (5) and the above the second lead-tin alloy coating (5-1).
The integrated circuit device according to claim 1, characterized in that, the transformer assembly (3) includes a transformer base (9), a transformer pressing block (8), a high-frequency transformer (10) and a second installation hole of the transformer assembly ( 11),

The transformer base (9) and the transformer pressing block (8) clamp the high frequency transformer (10);

The second installation hole (11) of the transformer assembly is set at the bottom of the transformer base (9);

The second installation hole (11) of the transformer assembly is aligned and screwed to the first installation hole (6) of the transformer assembly provided on the functional area of the transformer assembly, so as to realize the integration of the transformer assembly (3) and the integrated base (1) Connections.
The integrated circuit device according to claim 1, characterized in that the inductor component (4) comprises a wire-wound inductor and a second mounting hole for the inductor component,

The second mounting hole of the inductor assembly is set at the center of the bottom of the wire-wound inductor;

The second mounting hole of the inductor component is aligned with the first mounting hole (7) of the inductor component on the functional area of the inductor component and screwed to realize the integration of the inductor component (4) and the Connection of base (1).
The integrated circuit device according to any one of claims 1 to 5, characterized in that, the material of the integrated base (1) is aluminum-based silicon carbide.
A method for installing a high-power module integrated circuit device for an aerospace power supply product, comprising:

S1. On the upper surface of the integrated base, a ceramic board component functional area, a transformer component functional area and an inductor component functional area are set;

S2. Install a ceramic plate assembly on the functional area of the ceramic plate assembly;

S3. Installing a transformer component on the transformer component functional area;

S4. Installing an inductor component in the inductor component functional area.
The installation method according to claim 7, wherein step S2 further comprises:

A lead-tin alloy coating is arranged on the functional area of the ceramic plate assembly;

Weld the power switch tube, rectifier diode and freewheeling diode on the ceramic board;

setting pads on the bottom of the ceramic board;

The ceramic board assembly is soldered to the lead-tin alloy plating through the pads.
The installation method according to claim 7, wherein said step S3 further comprises:

Set the transformer base and the transformer pressing block to clamp the high-frequency transformer to form a transformer assembly;

A second mounting hole for the transformer assembly is provided at the bottom of the transformer base;

A first installation hole for the transformer component is set on the functional area of the transformer component;

Aligning and screwing the first installation hole of the transformer assembly with the second installation hole of the transformer assembly realizes the connection between the transformer assembly and the integrated base.
The installation method according to claim 7, wherein said step S4 further comprises:

A second mounting hole for the inductor assembly is provided at the center of the bottom of the wire wound inductor;

setting a first installation hole for the inductor component on the functional area of the inductor component;

Aligning and screwing the first mounting hole of the inductor assembly with the second mounting hole of the inductor assembly realizes the connection of the inductor assembly and the integrated base.