JPS55134952A - Mounting of ic package - Google Patents

Mounting of ic package

Info

Publication number
JPS55134952A
JPS55134952A JP4273679A JP4273679A JPS55134952A JP S55134952 A JPS55134952 A JP S55134952A JP 4273679 A JP4273679 A JP 4273679A JP 4273679 A JP4273679 A JP 4273679A JP S55134952 A JPS55134952 A JP S55134952A
Authority
JP
Japan
Prior art keywords
package
printed
circuit board
packages
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4273679A
Other languages
Japanese (ja)
Inventor
Mikio Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4273679A priority Critical patent/JPS55134952A/en
Publication of JPS55134952A publication Critical patent/JPS55134952A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To permit IC packages to be mounted highly densely in a small mounting area by arranging heat sinks in parallel on a printed-circuit board, and inserting IC packages lengthwise into grooves of the heat sinks. CONSTITUTION:Leads 3 of an IC package 1 are soldered to a printed-circuit board 4, and a heat sink conductor 11 attached to the package is inserted into grooves 10 of cold plates 7, and fixed. A coolant is supplied through the hole 14 of the plate 7. This constitution, superior to air cooling in heat radiation, permits the ICs to be mounted highly densely in a small mounting area on the printed-circuit board.
JP4273679A 1979-04-09 1979-04-09 Mounting of ic package Pending JPS55134952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4273679A JPS55134952A (en) 1979-04-09 1979-04-09 Mounting of ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4273679A JPS55134952A (en) 1979-04-09 1979-04-09 Mounting of ic package

Publications (1)

Publication Number Publication Date
JPS55134952A true JPS55134952A (en) 1980-10-21

Family

ID=12644311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4273679A Pending JPS55134952A (en) 1979-04-09 1979-04-09 Mounting of ic package

Country Status (1)

Country Link
JP (1) JPS55134952A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281404A2 (en) * 1987-03-04 1988-09-07 Nec Corporation Cooling system for electronic equipment
JP2011131893A (en) * 2009-12-22 2011-07-07 Nippon Kimu Kk Storage container
JP2013542604A (en) * 2010-10-13 2013-11-21 ブル・エス・アー・エス Replaceable expansion module heat sink that can be connected to a computer board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281404A2 (en) * 1987-03-04 1988-09-07 Nec Corporation Cooling system for electronic equipment
JP2011131893A (en) * 2009-12-22 2011-07-07 Nippon Kimu Kk Storage container
JP2013542604A (en) * 2010-10-13 2013-11-21 ブル・エス・アー・エス Replaceable expansion module heat sink that can be connected to a computer board

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