JPS5769768A - Equipping structure of electronic circuit unit containing high electric power parts - Google Patents

Equipping structure of electronic circuit unit containing high electric power parts

Info

Publication number
JPS5769768A
JPS5769768A JP14655480A JP14655480A JPS5769768A JP S5769768 A JPS5769768 A JP S5769768A JP 14655480 A JP14655480 A JP 14655480A JP 14655480 A JP14655480 A JP 14655480A JP S5769768 A JPS5769768 A JP S5769768A
Authority
JP
Japan
Prior art keywords
side face
wiring plate
parts
transistors
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14655480A
Other languages
Japanese (ja)
Inventor
Masao Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14655480A priority Critical patent/JPS5769768A/en
Publication of JPS5769768A publication Critical patent/JPS5769768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To enhance reliability of an electronic circuit unit containing high electric power parts by a method wherein a printed wiring plate loading an LSI element module and power transistors are accommodated in a heat conductive case being formed with heat radiating fins on one side face and with a cavity on the other side face, and the wiring plate and the transistors are connected with bent leads. CONSTITUTION:In the casing 1 formed with the heat radiating fins 11 on one side face and with the cavity 12 on the other side face, the ceramic wiring plate 5 loading the LSI module 4 accommodated in leadless package of chip carrier, etc., is adhered on the bottom face 121 at the center part of the cavity 12. Moreover heat radiating metal bodies 61 of the power transistors 6 are fixed to the step bottom parts 122 formed at the circumferential edge parts of the bottom face 121, and the printed wiring plate 5 and the transistors 6 are connected with the leads 63 having the bent parts. Accordingly disconnection trouble to be caused by thermal expansion or vibration is not generated, and equipping structure having superior heat radiability can be obtained.
JP14655480A 1980-10-20 1980-10-20 Equipping structure of electronic circuit unit containing high electric power parts Pending JPS5769768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14655480A JPS5769768A (en) 1980-10-20 1980-10-20 Equipping structure of electronic circuit unit containing high electric power parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14655480A JPS5769768A (en) 1980-10-20 1980-10-20 Equipping structure of electronic circuit unit containing high electric power parts

Publications (1)

Publication Number Publication Date
JPS5769768A true JPS5769768A (en) 1982-04-28

Family

ID=15410284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14655480A Pending JPS5769768A (en) 1980-10-20 1980-10-20 Equipping structure of electronic circuit unit containing high electric power parts

Country Status (1)

Country Link
JP (1) JPS5769768A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368143A2 (en) * 1988-11-09 1990-05-16 TEMIC TELEFUNKEN microelectronic GmbH Electronic control apparatus
FR2766051A1 (en) * 1997-07-09 1999-01-15 Sagem Power pcb with metal box as heat sink
WO2002058142A3 (en) * 2001-01-20 2003-11-06 Conti Temic Microelectronic Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368143A2 (en) * 1988-11-09 1990-05-16 TEMIC TELEFUNKEN microelectronic GmbH Electronic control apparatus
FR2766051A1 (en) * 1997-07-09 1999-01-15 Sagem Power pcb with metal box as heat sink
WO2002058142A3 (en) * 2001-01-20 2003-11-06 Conti Temic Microelectronic Power module
US6952347B2 (en) 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module

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