JPS642397A - Cooling structure of package for electronic circuit - Google Patents

Cooling structure of package for electronic circuit

Info

Publication number
JPS642397A
JPS642397A JP62157192A JP15719287A JPS642397A JP S642397 A JPS642397 A JP S642397A JP 62157192 A JP62157192 A JP 62157192A JP 15719287 A JP15719287 A JP 15719287A JP S642397 A JPS642397 A JP S642397A
Authority
JP
Japan
Prior art keywords
elements
cooling
conduction
heat
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157192A
Other languages
Japanese (ja)
Other versions
JP2504059B2 (en
JPH012397A (en
Inventor
Kazuhiko Umezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62157192A priority Critical patent/JP2504059B2/en
Publication of JPS642397A publication Critical patent/JPS642397A/en
Publication of JPH012397A publication Critical patent/JPH012397A/en
Application granted granted Critical
Publication of JP2504059B2 publication Critical patent/JP2504059B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Abstract

PURPOSE: To simplify structure while reducing cost by cooling an IC element by a primary refrigerant, in which the IC element is dipped directly, and a secondary refrigerant not brought into contact with the IC element when the IC element is cooled.
CONSTITUTION: One part of heat generated by IC elements 1 is transmitted over wiring substrates 2 and the residue is conducted directly over a primary refrigerant 12, and transmitted over cooling plates 5 by conduction and a convection. Heat is conducted over tubes at both ends of thermal conduction plates by conduction in the cooling plates 5, and discharged to a secondary refrigerant 6 from the tubes. Consequently, since structure in which the cooling plates 5 are not brought into contact directly with the IC elements 1 and heat is transmitted through the primary refrigerant 12 is formed, not only thermal stress by a temperature rise has no adverse effect on the connecting sections of the IC elements 1 and the wiring substrates 2 but also cooling performance is not also lowered by the dispersion of the mounting height and inclination of the IC elements 1. Accordingly, no noise, etc., is generated in a device building in a computer, etc.
COPYRIGHT: (C)1989,JPO&Japio
JP62157192A 1987-06-24 1987-06-24 Electronic circuit package cooling structure Expired - Lifetime JP2504059B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157192A JP2504059B2 (en) 1987-06-24 1987-06-24 Electronic circuit package cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157192A JP2504059B2 (en) 1987-06-24 1987-06-24 Electronic circuit package cooling structure

Publications (3)

Publication Number Publication Date
JPS642397A true JPS642397A (en) 1989-01-06
JPH012397A JPH012397A (en) 1989-01-06
JP2504059B2 JP2504059B2 (en) 1996-06-05

Family

ID=15644212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157192A Expired - Lifetime JP2504059B2 (en) 1987-06-24 1987-06-24 Electronic circuit package cooling structure

Country Status (1)

Country Link
JP (1) JP2504059B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4217431A1 (en) * 1991-05-31 1992-12-03 Hitachi Ltd ACCOMMODATION STRUCTURE FOR SMALL COMPUTERS
US5774333A (en) * 1996-08-23 1998-06-30 Speculative Incorporated Thermally efficient portable computer incorporating deploying CPU module
US6243261B1 (en) 1996-08-23 2001-06-05 Speculative Incorporated Thermally efficient computer incorporating deploying CPU module
JP2012064724A (en) * 2010-09-15 2012-03-29 Aisin Aw Co Ltd Semiconductor cooling device and driving device for vehicle
WO2014003194A1 (en) 2012-06-29 2014-01-03 Kao Corporation Hydraulic composition
JP2019143485A (en) * 2018-02-16 2019-08-29 エドワーズ株式会社 Vacuum pump and vacuum pump control device
US10912222B2 (en) 2017-04-05 2021-02-02 Fujitsu Limited Cooling system, cooling device, and electronic system

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4217431A1 (en) * 1991-05-31 1992-12-03 Hitachi Ltd ACCOMMODATION STRUCTURE FOR SMALL COMPUTERS
US5313362A (en) * 1991-05-31 1994-05-17 Hitachi, Ltd. Packaging structure of small-sized computer
DE4217431C2 (en) * 1991-05-31 1994-08-04 Hitachi Ltd Housing structure for small computers
US5774333A (en) * 1996-08-23 1998-06-30 Speculative Incorporated Thermally efficient portable computer incorporating deploying CPU module
US6243261B1 (en) 1996-08-23 2001-06-05 Speculative Incorporated Thermally efficient computer incorporating deploying CPU module
US6297956B1 (en) 1996-08-23 2001-10-02 Speculative Incorporated Thermally efficient portable computer incorporating deploying CPU module
JP2012064724A (en) * 2010-09-15 2012-03-29 Aisin Aw Co Ltd Semiconductor cooling device and driving device for vehicle
WO2014003194A1 (en) 2012-06-29 2014-01-03 Kao Corporation Hydraulic composition
US10912222B2 (en) 2017-04-05 2021-02-02 Fujitsu Limited Cooling system, cooling device, and electronic system
JP2019143485A (en) * 2018-02-16 2019-08-29 エドワーズ株式会社 Vacuum pump and vacuum pump control device

Also Published As

Publication number Publication date
JP2504059B2 (en) 1996-06-05

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