JPH0563053U - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] To prevent damage to the insulating substrate due to thermal stress in a hybrid integrated circuit substrate in which a heat sink is attached to the insulating substrate. [Structure] A heat sink 9 made of metal is attached to an insulating substrate 1 on which circuit wiring is formed, and the exterior surface of a semiconductor component 2 connected to the circuit wiring of the insulating substrate 1 is bonded to the heat sink 9. Since the slits 11 are provided in the width direction of the heat dissipation plate 9, when the heat dissipation plate 9 tries to expand due to a temperature rise, the difference in thermal expansion in the longitudinal direction from the insulating substrate 1 bonded together is due to the slit 11. Be absorbed. Therefore, the thermal stress generated in the insulating substrate 1 is relaxed, and a large thermal stress does not occur in the insulating substrate 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a high frequency power amplifier using semiconductor components such as power transistors and FETs and the like, and to a hybrid integrated circuit board provided with a heat dissipation plate for cooling the semiconductor components.

[0002]

[Prior Art]

 Conventionally, a hybrid integrated circuit board that mounts a semiconductor component with a large amount of heat dissipation has been designed to reduce the risk of heat generation impairing the circuit function, by allowing the outer casing of the semiconductor component to come into contact with a heat dissipation plate to facilitate heat dissipation. is doing. For example, in a semiconductor component such as a power transistor that generates a large amount of heat, a heat dissipation plate that helps the heat dissipation effect is joined to the exterior of the semiconductor component.

As the hybrid integrated circuit board on which these semiconductor components that easily generate heat are mounted, for example, those shown in FIGS. 3 and 4 showing a conventional example are known. That is, in the hybrid integrated circuit board shown in FIGS. 3 and 4, two semiconductor components 2, 2, ... Such as power transistors that generate a large amount of heat are used, and these semiconductor components 2, 2 ,. As the insulating substrate 1, for example, an alumina substrate or a glass epoxy resin substrate is used, and through holes 3 ', 3'are formed in advance at the mounting positions of the semiconductor components 2, 2 ,. In addition, the circuit wiring 20 is formed by a conductor pattern or the like on one main surface of the insulating substrate 1, and the conductor film 5 is formed on one surface of the other main surface.

The semiconductor components 2, 2, ... Are housed in the through holes 3 ′, 3 ′ of the insulating substrate 1, and the other electronic components 4, 4, ... Are mounted on one main surface of the insulating substrate 1. Has been done. The lead lands 8, 8 ... Are formed on one side of the insulating substrate 1, and one end of the lead terminals 7, 7 ... Is soldered to each of the lead lands 8, 8 ,. Have been guided to.

The metal heat dissipation plate 9'has a substantially rectangular shape having substantially the same width dimension as the substrate, and is formed to have a length slightly longer than the substrate. Both ends thereof are fixed ends 10 and 10 having recesses for screwing to a housing or the like. Such a heat dissipation plate 9'is soldered over the conductor film 5 formed on one surface of the other main surface of the insulating substrate 1, and at the same time, the semiconductor component 2 housed in the through holes 3 ', 3'. The two outer casings are joined to the heat dissipation plate 9 '. After that, lead terminals for external connection are connected to predetermined portions on the insulating substrate 1 to be used as a hybrid integrated circuit device.

[0006]

[Problems to be solved by the device]

 However, since the heat dissipation plate 9'is made of metal having good thermal conductivity, and the insulating substrate 1 is an alumina substrate or a glass epoxy resin substrate, the difference in thermal expansion coefficient between them is large. Therefore, as shown by the chain double-dashed line in FIG. 4, when the heat radiation plate 9 ′ rises in temperature, the heat radiation plate 9 ′ expands and tends to warp to the side of the insulating substrate 1 having a low coefficient of thermal expansion. Thermal stress occurs in the. As a result, the brittle insulating substrate 1 is cracked, which leads to disconnection of the circuit, deterioration of insulation, and the like, which leads to trouble such as circuit failure. An object of the present invention is to provide a hybrid integrated circuit board in which the insulating substrate does not generate thermal response in view of the problems of the conventional hybrid integrated circuit device.

[0007]

[Means for solving the problem]

 That is, in the present invention, in order to achieve the above-mentioned object, an insulating substrate 1 on which circuit wiring is formed, a semiconductor component 2 connected to the circuit wiring of the insulating substrate 1, and the insulating substrate 1 are bonded together, and Provided is a hybrid integrated circuit board having a heat dissipation plate 9 to which the exterior surface of the semiconductor component 2 is joined, wherein a slit 11 is provided in the width direction of the heat dissipation plate 9.

[0008]

[Work]

 In the hybrid integrated circuit board according to the present invention, since the slits 11 are provided in the width direction of the heat dissipation plate 9, when the heat dissipation plate 9 is about to expand due to temperature rise, The difference in thermal expansion is absorbed by the slit 11. For this reason, the thermal stress generated in the insulating substrate 1 is relaxed, and a large thermal stress is not generated in the insulating substrate 1.

[0009]

【Example】

 Next, an embodiment of the present invention will be specifically described with reference to the drawings. The hybrid integrated circuit boards shown in FIGS. 1 and 2 are basically common to the hybrid integrated circuit boards of FIGS. 3 and 4 already shown as a conventional example, and the same portions are denoted by the same reference numerals. That is, as the insulating substrate 1, for example, an alumina substrate or a glass epoxy resin substrate is used, and the through holes 3 ′, 3 ′ are formed in advance on the insulating substrate 1 at the positions where the semiconductor components 2, 2, ... Are mounted. There is. Also, the circuit wiring 20 is formed on one main surface of the insulating substrate 1 by a conductor pattern or the like, and the conductor film 5 is formed on one surface of the other main surface.

The semiconductor components 2, 2, ... Are housed in the through holes 3 ′, 3 ′ of the insulating substrate 1, and the other electronic components 4, 4, ... Are mounted on one main surface of the insulating substrate 1. Has been done. The lead lands 8, 8 ... Are formed on one side of the insulating substrate 1, and one end of the lead terminals 7, 7 ... Is soldered to each of the lead lands 8, 8 ... Have been derived from.

The metal heat dissipation plate 9 has a substantially rectangular shape with a width dimension substantially the same as that of the substrate, and is formed to be a little longer than the substrate. Both ends thereof are fixed ends 10 and 10 having recesses for screwing to a housing or the like. Further, three slits 11, 11, ... Are provided on the central portion side of the fixed ends 10, 10 of the heat dissipation plate 9. These slits are alternately cut from both sides of the heat sink in the width direction, and the depth of the slit is slightly longer than half the width of the heat sink 9.

The heat dissipation plate 9 is soldered to the conductor film 5 formed on one surface of the other main surface of the insulating substrate 1 so as to be overlaid and soldered, and the semiconductor parts housed in the through holes 3 ′, 3 ′. The outer casings 2 and 2 are joined to the heat dissipation plate 9. In this case, the area where the slits 11, 11 ... Are formed is bonded to the insulating substrate 1. After that, lead terminals for external connection are connected to predetermined portions on the insulating substrate 1 to complete the hybrid integrated circuit device. In the above-described embodiment, the heat sink 9 is provided with three slits 11, 11, ... With a depth of cut that is about half the width of the heat sink 9. However, the number and depth of the slits are the size of the heat sink 9 and the expected depth. It should be appropriately selected depending on the temperature rise, and it is sufficient that there is at least one.

[0013]

[Effect of the device]

 As described above, according to the present invention, even when the temperature of the heat dissipation plate 9 rises, a large thermal stress does not occur in the insulating substrate 1, so that the insulating substrate 1 can be prevented from cracking. Therefore, it is possible to provide a highly reliable hybrid integrated circuit board having a small projected area and capable of preventing circuit failure or the like due to the temperature rise of the heat sink 9.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of the present invention.

FIG. 2 is a bottom view of the hybrid integrated circuit board showing the embodiment.

FIG. 3 is a perspective view of a hybrid integrated circuit board showing a conventional example.

FIG. 4 is a vertical sectional side view of the hybrid integrated circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Heat-generating semiconductor component 3 Through hole 4 General electronic component 9 Heat sink 11 Slit

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 26, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

Claims (1)

[Reference number] 0030500-01 ▲ [Claims for utility model registration] 1. An insulating substrate (1) on which circuit wiring is formed
A semiconductor component (2) connected to the circuit wiring of the insulating substrate (1), and a heat dissipation plate (9) bonded to the insulating substrate (1) and having an exterior surface of the semiconductor component 2 bonded thereto. A hybrid integrated circuit board having a slit (11) in the width direction of the heat dissipation plate (9).