JPH114050A - Circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dissipate heat conducted to a wiring circuit pattern through part terminal feet so as to decrease a board in temperature by a method wherein a part of a wiring circuit pattern is cut and raised up by pressing the part- mounted side or part-soldered side of a circuit board. SOLUTION: A circuit board 100 is punched out of a metal plate 1, a required wiring circuit pattern is formed on the circuit board 100, a part of the wiring circuit pattern is left unsealed, and the unsealed part of the metal plate 1 is cut and raised up into a cut riser or a protrudent cylindrical cut riser 1a by pressing a part-mounted surface side or a part-soldered surface side. When parts are soldered and electrically connected to the circuit board 100, heat conducted to the wiring circuit pattern through part terminal feet can be efficiently dissipated through the cut riser 1a, so that the circuit board 100 is improved in heat dissipating properties, and the board 100 can be prevented from rising in temperature. Therefore, the circuit board 100 can be restrained from being warped after it is dipped into a dip-soldering tank.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for various devices, particularly, a power circuit such as a power supply circuit.

[0002]

2. Description of the Related Art Conventionally, a circuit board shown in FIG. 9 is generally used as a circuit board formed by punching a metal plate by means of etching or pressing to form a required wiring circuit.

[0003] This is a circuit board 900 in which a wiring circuit pattern is formed from a metal plate 91, insert-molded on an insulating support 92, and molded. This circuit board 900
Then, the components are inserted and soldered to make an electrical connection between the wiring circuit pattern and the components.

[0004]

In the conventional circuit board, the wiring circuit pattern is insert-molded and molded on the insulating support as described above, so that heat from the heat-generating components is soldered. Conducted to the wiring circuit pattern through the component terminal feet, the temperature of the entire board rises,
As a result, the heat-affected parts were adversely affected by heat.

Further, when soldering components, the circuit board is passed through a dip tank, so that the circuit board is warped under the influence of heat.

[0006]

In order to solve the above-mentioned problems, a circuit board according to the present invention has the following features: 1) Pressing a part of a wiring circuit pattern on a component mounting surface side or a component soldering surface side without molding. Processing,
It was configured to be cut and raised or projected in a cylindrical shape. 2) A configuration in which cylindrical metal pins or metal pieces are connected to a wiring circuit pattern or a circuit board. 3) A cylindrical metal pin is connected to the component terminal foot on the soldering surface side. 4) The wiring circuit pattern is pressed into a convex shape so as to be substantially coplanar with the surface of the insulating support, thereby exposing the surface of the wiring circuit pattern.

[0007] According to the above configuration, the heat conducted from the component terminal feet to the wiring circuit pattern is radiated, and the substrate temperature can be reduced. As a result, the adverse effect of the heat on the weakly heated component can be prevented. Furthermore, since the metal support is integrally formed on the outside of the wiring circuit pattern along the four sides of the circuit board or on the outer periphery of the four sides, the warpage of the board after passing the circuit board through the solder dip tank is reduced. be able to.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION
In a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support, and molding the wiring circuit pattern, a part of the wiring circuit pattern is not molded and the component mounting surface side or A circuit board characterized by pressing the parts soldering surface side, cutting and protruding or protruding in a cylindrical shape, radiating the heat conducted from the component terminal feet to the wiring circuit pattern, and lowering the board temperature. As a result, it is possible to prevent an adverse effect of heat on the low heat component.

According to a second aspect of the present invention, there is provided a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support, and molding the wiring circuit pattern. This is a circuit board characterized by connecting cylindrical metal pins or metal pieces to the board.It can radiate the heat conducted from the component terminal feet to the wiring circuit pattern, lower the board temperature, and as a result In addition, it is possible to prevent an adverse effect of heat on the low heat component.

According to a third aspect of the present invention, there is provided a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support, and molding the wiring circuit pattern, on the component soldering surface side. A circuit board characterized in that cylindrical metal pins are connected to terminal feet, which can radiate heat conducted from component terminal feet and lower the board temperature, as a result An adverse effect due to heat can be prevented.

According to a fourth aspect of the present invention, there is provided a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support and molding the wiring circuit pattern. On the attachment surface side, the wiring circuit pattern is pressed into a convex shape so as to be substantially flush with the surface of the insulating support, and the surface of the wiring circuit pattern is exposed, and the adjacent convex shape is formed. A circuit board, wherein a gap distance capable of withstanding a voltage between adjacent wiring circuit patterns is provided between edges of the wiring circuit pattern, and heat conducted from component terminal feet is radiated. As a result, the substrate temperature can be reduced, and as a result, the adverse effect of heat on the weakly heated components can be prevented.

According to a fifth aspect of the present invention, in a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support and molding the wiring circuit pattern, the circuit board is provided outside the wiring circuit pattern. A metal substrate is integrally formed along four sides of the circuit board, and the warpage of the board after passing the circuit board through a solder dip tank can be reduced.

According to a sixth aspect of the present invention, in a circuit board formed by integrating a metal plate on which a wiring circuit pattern is formed and an insulating support and molding the wiring circuit pattern, the outer periphery of four sides of the circuit board is formed. A circuit board characterized in that a metal support is integrally formed on the circuit board, which reduces the warpage of the board after passing the circuit board through a solder dip tank, provides a heat dissipation effect, and prevents a rise in the board temperature. Can be. Hereinafter, a circuit board according to an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) FIGS. 1A and 1B are schematic views of a circuit board according to Embodiment 1 of the present invention, wherein FIG. 1A is a plan view and FIG. FIG. 2 is a cross-sectional perspective view of a main member of the wiring circuit pattern of FIG.

In FIG. 1, reference numeral 1 denotes a metal plate, 1a denotes a cut and raised portion, 2 denotes an insulating support, 100 denotes a circuit board,
100a is the component soldering surface side of the circuit board, and 100b is the component mounting surface side of the circuit board. Circuit board 100 of the present invention
Is formed by punching a metal plate 1 to form a required wiring circuit pattern and integrally supporting the same with an insulating support 2. The cut-and-raised portion 1a is formed on the wiring circuit pattern of the metal plate 1 by pressing or the like by means of pressing or the like.
It has been cut and raised.

When the components are soldered to such a circuit board 100 and electrically connected, the heat conducted to the wiring circuit pattern through the component terminal feet can be efficiently radiated from the cut and raised portion 1a, and the heat radiation effect is increased. Thus, it is possible to prevent the substrate temperature from rising. FIG. 1 shows an example in which a cutout is made on the component soldering side 100a.

In the first embodiment, the cutting and raising direction may be on the component mounting surface side 100b, and it is needless to say that the cutting and raising height is arbitrary. Further, the cutting and raising is described as an example, and may be formed in an arbitrary shape, for example, a cylindrical shape as shown in FIG.

(Embodiment 2) FIG. 4 is a schematic diagram of a circuit board according to Embodiment 2 of the present invention. The circuit board 400 of the present invention is formed by punching a metal plate 41 to form a required wiring circuit pattern, and is integrally supported by an insulating support 42. The metal pin 43 or the metal piece 44 having a cylindrical shape is connected to the wiring circuit pattern of the circuit board 400 or the circuit board 400.

When the components are soldered to such a circuit board 400 and electrically connected, heat is conducted to the wiring circuit pattern through the component terminal legs, and the metal pins 43 or the metal pieces 4 are connected.
4, heat radiation can be performed more efficiently, the heat radiation effect increases, and an increase in substrate temperature can be prevented.

(Embodiment 3) FIG. 5 is a sectional perspective view of a main member in a state where components 53 are soldered to a circuit board 500 according to Embodiment 3 of the present invention. The circuit board 500 of the present invention is formed by punching a metal plate 51 to form a required wiring circuit pattern and integrally supporting the same with an insulating support 52. The component soldering surface side 5 of such a circuit board 500
The cylindrical metal pin 54 is press-fitted into the component terminal foot 53a of the component 00a and integrated, or connected and integrated by solder 55.

With this configuration, the heat conducted to the wiring circuit pattern through the component terminal feet 53a is radiated from the cylindrical metal pins 54 in advance, thereby reducing the conduction to the wiring circuit pattern and reducing the substrate temperature. Can be prevented from rising.

(Embodiment 4) FIGS. 6A and 6B are schematic views of a circuit board according to Embodiment 4 of the present invention, wherein FIG. 6A is a plan view and FIG. 6B is a cross-sectional view along AA '. The circuit board 600 of the present invention is formed by punching a metal plate 61 to form a required wiring circuit pattern and integrally supporting the same with an insulating support 62.

Further, a part of the wiring circuit pattern is pressed into a convex shape on the part soldering surface 600a so as to be substantially flush with the surface of the insulating support member 62 (FIG. A gap 63 capable of withstanding the voltage of the adjacent wiring circuit pattern is provided between the exposed portion 61a) and the end 61b of the adjacent convex wiring circuit pattern (exposed portion 61a).

When the components are soldered and electrically connected to the circuit board 600, heat conducted to the wiring circuit pattern through the component terminal feet is more efficiently transmitted to the wiring circuit pattern than the exposed portion 61a because the wiring circuit pattern is exposed. The heat can be radiated well, the heat radiation effect increases, and an increase in the substrate temperature can be prevented.

(Embodiment 5) FIGS. 7A and 7B are schematic diagrams of a circuit board according to Embodiment 5 of the present invention, wherein FIG. 7A is a plan view and FIG. 7B is a side view. Circuit board 700 of the present invention
Are formed by punching a metal plate 71 to form a required wiring circuit pattern, and along the four sides around the circuit board 700, that is, along the four sides around the circuit board 700.
3 is integrally molded with an insulating support 72.

The components are mounted on such a circuit board 700, passed through a dip tank, and soldered to the circuit board 70.
Zero warpage can be reduced. When the metal support plate 83 is adhered to the outer periphery of the circuit board 800 as shown in FIG. 8, the warpage of the circuit board 800 can be reduced, a heat radiation effect can be obtained, and a rise in the substrate temperature can be prevented.

[0027]

As described above, according to the circuit board of the present invention, the heat conducted from the component terminal feet to the wiring circuit pattern can be dissipated to lower the board temperature. Can be prevented from being adversely affected.
Further, it is possible to reduce the warpage of the circuit board after passing the circuit board through the solder dip tank.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a circuit board according to Embodiment 1 of the present invention.

FIG. 2 is a sectional perspective view of a main part of the circuit board according to Embodiment 1 of the present invention.

FIG. 3 is a cross-sectional perspective view of a main part of the circuit board according to Embodiment 1 of the present invention.

FIG. 4 is a schematic perspective view of a circuit board according to Embodiment 2 of the present invention.

FIG. 5 is a cross-sectional perspective view of a main part in a state where components are soldered to a circuit board according to Embodiment 3 of the present invention.

FIG. 6 is a schematic diagram of a circuit board according to Embodiment 4 of the present invention.

FIG. 7 is a schematic diagram of a circuit board according to Embodiment 5 of the present invention.

FIG. 8 is a schematic diagram of a circuit board according to a fifth embodiment of the present invention.

FIG. 9 is a schematic diagram of a conventional circuit board.

[Explanation of symbols]

1, 41, 51, 61, 71 Metal plate 1a Cut and raised portion 2, 42, 52, 62, 72 Support 3 Component 3a Component terminal leg 43, 54 Metal pin 44 Metal piece 61a Exposed portion 61b Edge 63 Gap distance 73 , 83 Metal support plate 100, 400, 500, 600, 700, 800 Circuit board 100a, 500a, 600a Component soldering surface side 100b Component insertion surface side

Claims (6)

[Claims] 1. A circuit board formed by molding with an insulating support member while leaving a part of a wiring circuit pattern made of a metal plate, wherein an unmolded portion of the wiring circuit pattern is cut and raised. . 2. A circuit board formed by molding a wiring circuit pattern made of a metal plate with an insulating support member, wherein at least one of a cylindrical metal pin or a metal piece is connected to the circuit board. Circuit board. 3. A circuit board formed by molding with an insulating support member while leaving a part of a wiring circuit pattern made of a metal plate, wherein a cylindrical metal pin is connected to a component terminal foot on a component soldering surface side. A circuit board, characterized in that: 4. A circuit board formed by molding a wiring circuit pattern made of a metal plate with an insulating support member, wherein the wiring circuit pattern is formed so as to be substantially flush with the surface of the support member on the component soldering side. A circuit board, characterized by being exposed to a surface. 5. A circuit board formed by molding a wiring circuit pattern made of a metal plate with an insulating support member, wherein a metal support is integrally formed along four sides of the circuit board at a position outside the wiring circuit pattern. A circuit board characterized by having been made. 6. A circuit board formed by molding a wiring circuit pattern made of a metal plate with an insulating support member, wherein a metal support is integrally formed near the outer periphery of four sides of the circuit board. .