JPH10290085A - Heat dissipating bus bar - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bus bar with a heat dissipating function and to prevent heat from being accumulated near the bus bar. SOLUTION: A bus bar 3 is composed of a flat plate 4 vertical to a circuit board 1, a side plate 5 formed by bending the flat plate 4 at a right angle from its one side edge, and a top plate 6 formed by bending the flat plate 4 at a right angle from its upper edge. Heat dissipating holes 9 are provided to the flat plate 4, the side plate 5, and the top plate 6 respectively. A stepped part 10 is provided to the flat plate 4 and the side plate 5 protruding respectively, and lead terminals 11 are droopingly provided to the stepped part 10 protruding from the circuit board 1. When the lead terminals 11 are fixed to the circuit board 1, the stepped part 10 beards against the circuit board 1, a gap 16 is formed between the lower edge of the flat plate 4 and the circuit board 1, and heat is dissipated through the gap 16 and the heat dissipating holes 9, so that heat is not accumulated near the bus bar 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar for electrically connecting circuit portions of a circuit board.

[0002]

2. Description of the Related Art In general, a conductive pattern for electrically connecting electronic components is formed on a circuit board. Usually, in this type of circuit board, the conductive pattern is formed by etching or printing a thin copper foil, but depending on the circuit configuration, a large current may be locally applied to the circuit portion. Therefore, there is a risk that the conductive pattern formed by the thin copper foil may be broken. For this reason, in the places where there is a risk of disconnection, the circuit portions of the conductive patterns are partially connected by bus bars made of a conductive metal material instead of copper foil. In addition, a bus bar for partially connecting between circuit portions has a lead terminal protruding from a lower end edge thereof, and the lead terminal is soldered to the circuit board to be electrically connected and fixed to the circuit board at the same time. The bus bar fixed to the board stands substantially perpendicularly to the circuit board in a state of being in contact with the circuit board. By the way, circuit boards are mounted with electronic components such as coils and transformers that generate high heat, and in recent years, with the demand for smaller and lighter electric devices incorporating the circuit boards, there is a tendency to make circuit boards smaller. Components such as electronic components and bus bars to be mounted on a circuit board are intensively mounted in close proximity. In addition, the heat-generating electronic components are fixed to the heat radiating plate to prevent the electronic components from being adversely affected by heat, but if the bus bar fixed close to the electronic components also has a heat radiating function, the heat radiating plate is separately provided. There is no need to provide them, and the number of components can be reduced. However, the conventional bus bar is merely intended to electrically connect the circuit portions, and is formed in a narrow band plate shape. For this reason, the heat radiation area was small, and the heat radiation effect was extremely low. Moreover, as described above, since the bus bar is vertically standing and fixed while being in contact with the circuit board, heat radiated from the electronic components is blocked by the bus bar, and is trapped around the bus bar. For this reason, there is a concern that the heat blocked by the bus bar may adversely affect the electronic components mounted near the bus bar.

The present invention is intended to solve such a problem, and has a bus bar having a heat radiating function, efficiently radiates heat around the bus bar, and suppresses thermal effects of electronic components. It is an object of the present invention to provide a heat-dissipating bus bar that can perform the heat radiation.

[0004]

According to the present invention, there is provided a bus bar for electrically connecting between circuit portions of a circuit board. The bus bar has a flat plate portion which stands substantially perpendicular to the circuit board. A plurality of heat radiation holes are provided in the flat plate portion.

[0005] A large heat dissipation area is formed by the flat plate portion, and the heat radiated from the electronic components adjacent to the bus bar can be radiated by the bus bar. In addition, since heat collected near the bus bar escapes through the heat radiation holes of the flat plate portion, heat is not collected near the bus bar, and thermal effects on electronic components mounted close to the bus bar can be prevented.

[0006]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 3 show an embodiment of the present invention. In the drawings, reference numeral 1 denotes a circuit board on which an electronic component 2 is mounted, and 3 denotes a bus bar for electrically connecting circuit portions of the circuit board 1. The bus bar 3 is formed by plating a surface of a metal material having excellent conductivity such as copper. The bus bar 3 has a flat plate portion 4 perpendicular to the circuit board 1 and a side plate 5 bent at a right angle from one side edge of the flat plate portion 4, and is entirely bent into an L shape. The top plate 6 is bent at a right angle from the upper edge of one side of the portion 4. The side plate 5 protrudes upward from the upper edge of the flat plate portion 4, and a top plate portion 6 bent from the flat plate portion 4 is brought into contact with the inner surface of the side plate 5. It crosses in the shape of a letter.
In addition, the flat plate portion 4 of the bus bar 3 has a height of approximately 15 mm and the side plate 5 has a height of approximately 30 mm. Further, since the top plate portion 6 is bent from the upper edge of the flat plate portion 4, a large heat radiation area is provided. It is formed larger than a conventional bus bar for the purpose of simply connecting circuit portions of the circuit board 1.

Reference numeral 10 denotes a stepped portion which is partially protruded at the lower end edges of the flat plate portion 4 and the side plate 5, and has a projecting piece shape for connecting to the circuit board 1 at the lower end edge of the stepped portion 10. The lead terminal 11 is vertically provided integrally. Further, when soldering the lead terminal 11 to the lower side of the flat plate portion 4 and the side plate 5 in the vicinity of the step portion 10, the transfer of heat transmitted from the lead terminal 11 side to the bus bar 3 side is suppressed and A small hole 12 for preventing heat loss at the time of attachment is formed.

Next, the operation and effect of this embodiment will be described with respect to the above configuration.

First, the lead terminals 11 formed on the flat plate portion 4 and the side plate 5 of the bus bar 3 are connected to the circuit portion (not shown) of the circuit board 1.
And the lead terminals 11 are soldered on the back side of the circuit board 1. By soldering the lead terminals 11 formed on the flat plate portion 4 and the side plate 5 in this way, the circuit portions (not shown) are electrically connected, and the bus bar 3 is fixed to the circuit board 1. I do. The bus bar 3 fixed to the circuit board 1 includes a flat plate portion 4 and a side plate 5.
A step portion 10 protruding from the lower edge of the abutment contacts the circuit board 1, and a gap 16 is formed between the circuit board 1 and the bus bar 3 by the height of the step portion 10. The bus bar 3 electrically connected to the circuit board 1 has a flat plate portion 4 and a side plate 5 bent from one side edge of the flat plate portion 4 standing upright with respect to the circuit board 1. The height is higher than that of a general bus bar for connecting the parts, and the top plate part 6 is bent from the upper edge of the flat plate part 4 to have a large heat radiation area. Function. Therefore, when the electronic component 2 is mounted adjacent to the bus bar 3, the heat radiated from the electronic component 2 can be radiated by the bus bar 3.
By the way, when the bus bar 3 is increased in size in order to give the bus bar 3 a heat radiation function, when the lead terminal 11 is heated and the lead terminal 11 is soldered, the bus terminal 3 is connected to the flat portion 4 of the bus bar 3 from the lead terminal 11. Although heat may be transmitted to the side plate 5 and the heat loss may make it impossible to sufficiently heat the lead terminal 11, a small hole 12 is provided near the step portion 10 in this embodiment. Since the heat transfer to the bus bar 3 side can be suppressed by the 12, the lead terminals
It is possible to locally heat the lead 11 in a short time, and there is no problem in soldering the lead terminals 11. A gap 16 is formed between the bus bar 3 and the circuit board 1 by a stepped portion 10, and the flat plate portion 4, the side plate 5, and the top plate portion 6 constituting the bus bar 3 have round holes, respectively. Since a plurality of 9s are formed, heat radiated from the electronic component 2 is radiated to the periphery through the gap 16 between the bus bar 3 and the circuit board 1 and the heat radiation holes 9.

As described above, in the present embodiment, the function as a heat radiating plate can be provided by using the bus bar 3 for electrically connecting the circuit portions of the circuit board 1. Also,
Heat from the electronic component 2 mounted close to the bus bar 3 is radiated to the periphery through the gap 16 between the bus bar 3 and the circuit board 1 and the heat radiation holes 9 formed in the flat plate portion 4, the side plate 5, and the top plate portion 6. In addition, heat does not accumulate in the vicinity of the bus bar 3, so that it is possible to prevent thermal effects on the electronic components 1 close to the bus bar 3. Also,
As the heat of the electronic component 2 passes through the gap 16 and the heat radiating hole 9, the air circulates and the bus bar 3 itself is cooled, so that the heat radiating effect can be enhanced. In the present embodiment, when the lead terminals 11 are heated when the lead terminals 11 are soldered by enlarging the bus bar 3 in order to enlarge the heat radiation area, the heat is applied to the lead terminals 11.
It takes time for the temperature to reach a temperature suitable for soldering from the side plate 5 and the flat plate 4 to the side plate 5 and the flat plate 4.
By forming the small holes 12 on the base side of the step portion 10, the transmission of heat transmitted from the lead terminal 11 side to the bus bar 3 side can be suppressed, and heat loss at the time of soldering can be prevented. For this reason, it is possible to locally heat the lead terminal 11, and there is an additional effect that the soldering of the lead terminal 11 can be performed in a short time.

Although one embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, the bus bar, the shape, the shape, the number, and the formation position of the heat radiating holes may be appropriately selected. Also. Although an example has been described in which a gap is formed between the bus bar and the circuit board to dissipate heat, it may be appropriately selected, such as by forming a large number of slits.

[0012]

According to the present invention, there is provided a bus bar for electrically connecting between circuit portions of a circuit board. The bus bar has a flat portion which stands substantially perpendicular to the circuit board. Since a plurality of heat-dissipating holes are provided in the flat panel, a large heat-dissipating area can be formed by the flat plate portion, and the heat radiated from the adjacent electronic components can be dissipated by the bus bar. Further, the heat radiated from the electronic component is circulated through the heat radiating hole, and the heat is not trapped near the bus bar, so that the thermal effect of the electronic component can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of a bus bar showing one embodiment of the present invention.

FIG. 2 is a cross-sectional view of the bus bar as viewed from the above-described side surface direction.

FIG. 3 is a perspective view of the bus bar.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 3 Bus bar 4 Flat plate part 9 Heat dissipation hole

Claims (1)

[Claims] A bus bar for electrically connecting between circuit portions of a circuit board is provided. The bus bar has a flat plate portion that stands substantially perpendicular to the circuit board, and a plurality of heat radiation holes are formed in the flat plate portion. A heat-dissipating bus bar characterized by being provided.