KR200146570Y1 - Coiled cooling plate for ics - Google Patents
Coiled cooling plate for ics Download PDFInfo
- Publication number
- KR200146570Y1 KR200146570Y1 KR2019960026333U KR19960026333U KR200146570Y1 KR 200146570 Y1 KR200146570 Y1 KR 200146570Y1 KR 2019960026333 U KR2019960026333 U KR 2019960026333U KR 19960026333 U KR19960026333 U KR 19960026333U KR 200146570 Y1 KR200146570 Y1 KR 200146570Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- integrated circuit
- present
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 238000004804 winding Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 고안은 집적회로용 코일형 방열판에 관한 것으로, 종래에는 인쇄회로기판에 방열판을 설치함에 따른 소자의 배치 공간을 차지하게 됨으로 이를 감안하여 인쇄회로기판의 크기를 더 크게 제작해야 하는 문제점이 있었다.The present invention relates to a coil type heat sink for an integrated circuit, and in the related art, it takes up a space for arranging elements according to the installation of a heat sink on a printed circuit board, and thus, the size of the printed circuit board has to be made larger.
본 고안은 제한된 표면적을 갖는 인쇄회로기판의 표면적을 확장시키지 않더라도 소망하는 소자를 상대적으로 더 많이 배치할 수 있도록 방열판의 설치공간은 최소화시키고, 방열효과를 더 향상시킬 수 있는 코일형 방열판을 제공하기 위한 것이다. 본 고안의 구성요소로서 인쇄회로기판(10)상에 고정되는 리드 프레임(31)을 갖는 집적회로(30)와; 박판형 금속을 코일형으로 감고, 그 자유단의 양측면이 절결되어 상기 집적회로(30)의 면적과 동일한 면적을 갖는 방열판(20)으로 구성되어 있는데, 본 고안에 의하면 방열판(20)의 설치공간은 최소화시킴으로써 제한된 표면적을 갖는 인쇄회로기판에 소자를 상대적으로 더 많이 배치할 수 있고, 방열효과를 더 향상시킬 수 있는 효과를 제공한다.The present invention provides a coil type heat sink that can minimize the installation space of the heat sink and further improve the heat dissipation effect so that the desired elements can be placed relatively more even without expanding the surface area of the printed circuit board having a limited surface area. It is for. An integrated circuit (30) having a lead frame (31) fixed on a printed circuit board (10) as a component of the present invention; The thin plate-shaped metal is wound in a coil shape, and both side surfaces of the free end thereof are cut out to have a heat sink 20 having the same area as that of the integrated circuit 30. According to the present invention, the installation space of the heat sink 20 is By minimizing, it is possible to place more elements on a printed circuit board having a limited surface area and provide an effect of further improving heat dissipation effect.
Description
본 고안은 집적회로용 방열판에 관한 것으로, 더욱 상세하게는 인쇄회로기판의 면적을 최대한 활용할 수 있도록 방열판의 설치공간을 최소화시킨 집적회로용 방열판에 관한 것이다.The present invention relates to a heat sink for integrated circuits, and more particularly, to a heat sink for integrated circuits to minimize the installation space of the heat sink to maximize the area of the printed circuit board.
일반적으로, 각종 전기·전자 제품속에는 제품의 기능을 달성하기 위한 회로를 구성하는 소자들이 인쇄회로기판에 배열되어 있다. 이러한 소자들 중에는 집적회로와 같이 비교적 고가인 소자들도 포함되어 있는데, 집적회로는 전기적인 동작시 내부에서 많은 열이 발생되어 이를 냉각시키기 위하여 방열판을 부설하는 경우가 많다.In general, in various electrical and electronic products, elements constituting a circuit for achieving a product function are arranged on a printed circuit board. Among these devices, relatively expensive devices such as integrated circuits are also included. In an integrated circuit, a large amount of heat is generated internally during electrical operation, and a heat sink is often installed to cool it.
따라서, 방열판(20)은 도 1 및 도 2에 도시된 바와 같이 인쇄회로기판(10)상에 집적회로(30)와 밀착되도록 밴딩수단을 의해 결합되어진다. 방열판(20)은 열전도도가 우수한 알루미늄으로 제작된다.Therefore, the heat sink 20 is coupled by the bending means to be in close contact with the integrated circuit 30 on the printed circuit board 10 as shown in Figs. The heat sink 20 is made of aluminum with excellent thermal conductivity.
그러나 방열판(20)은 방열판을 통해 집적회로(30)의 열을 방출하려면 그 표면적이 집적회로(30)의 표면적 보다 커야 만이 방열효과를 향상시킬 수 있기 때문에 그 부피가 비교적 크게 제작되어진다.However, since the heat sink 20 may improve heat dissipation effect only when the surface area is larger than the surface area of the integrated circuit 30 in order to dissipate heat of the integrated circuit 30 through the heat sink, the heat sink 20 is made relatively large in volume.
따라서, 방열판(20)이 크게 설계되면 인쇄회로기판(10)상에서 방열판(20)이 점유하는 면적이 그만큼 커질 수밖에 없으므로 상대적으로 인쇄회로기판의 크기가 커질 수밖에 없다.Therefore, when the heat sink 20 is designed to be large, the area occupied by the heat sink 20 on the printed circuit board 10 is inevitably increased. Therefore, the size of the printed circuit board is relatively large.
결국, 제한된 면적을 갖는 인쇄회로기판(10)상에 소망하는 소자들을 모두 배치하려면 인쇄회로기판(10)의 면적을 더 크게 형성하거나 방열판(20)의 크기를 제한하여야 하지만 실질적으로 방열판(20)의 크기를 제한하면 집적회로(30)의 방열효과가 저하되기 때문에 방열판(20)의 크기를 제한할 수는 없다.As a result, in order to arrange all desired elements on the printed circuit board 10 having a limited area, the area of the printed circuit board 10 should be formed larger or the size of the heat sink 20 should be limited. Limiting the size of the heat sink 20 is not limited because the heat dissipation effect of the integrated circuit 30 is reduced.
따라서, 본 고안은 전술한 바와 같은 방열판(20)의 크기가 증가할 수록 인쇄회로기판의 크기도 크게 제작해야 하는 문제를 해결하기 위하여 본 고안을 안출하게 되었다.Therefore, the present invention has been devised to solve the problem that the size of the printed circuit board should also be increased as the size of the heat sink 20 as described above increases.
본 고안의 목적은 제한된 표면적을 갖는 인쇄회로기판에 소자를 상대적으로 더 많이 배치할 수 있도록 방열판의 설치공간을 최소화시키고, 방열효과를 더 향상시킬 수 있는 코일형 방열판을 제공하는데 있다.An object of the present invention is to provide a coil-type heat sink that can minimize the installation space of the heat sink and further improve the heat dissipation effect so that the device can be placed on a printed circuit board having a limited surface area relatively more.
본 고안에 따른 코일형 방열판은 박판형 금속을 코일형으로 권선되되, 그 자유단의 양측면이 절결되어 집적회로와 접속되는 최소한의 면적만을 갖는 방열판과;Coil-type heat sink according to the present invention is a heat sink that is wound around a thin plate-like metal coil, both sides of the free end is connected to the integrated circuit and the minimum area;
상기 방열판의 자유단에 밀착되도록 부착되고 인쇄회로기판상에 고정되는 리드 프레임을 갖는 집적회로로 달성될 수 있다.It may be achieved by an integrated circuit having a lead frame attached to be in close contact with the free end of the heat sink and fixed on the printed circuit board.
도 1은 종래의 집적회로용 방열판을 예시적으로 도시하는 요부 사시도이다.1 is a perspective view illustrating main parts of a conventional heat sink for an integrated circuit.
도 2는 도 1에 도시된 종래의 방열판의 설치상태를 보여주는 요부 단면도이다.FIG. 2 is a cross-sectional view illustrating main parts of the conventional heat sink shown in FIG. 1.
도 3은 본 고안에 따른 집적회로용 코일형 방열판의 사시도이다.3 is a perspective view of a coiled heat sink for an integrated circuit according to the present invention.
도 4는 본 고안에 따른 집적회로용 코일형 방열판의 고정예를 예시하는 정면도이다.Figure 4 is a front view illustrating a fixing example of the coil-shaped heat sink for integrated circuit according to the present invention.
도 5는 본 고안에 따른 본 고안에 따른 집적회로용 코일형 방열판의 고정예를 예시하는 요부 단면도이다.Figure 5 is a cross-sectional view of the main portion illustrating an example of fixing the coil-type heat sink for integrated circuit according to the present invention.
*** 도면의 주요부분에 대한 부호의 설명 ****** Explanation of symbols for main parts of drawing ***
10:인쇄회로기판 20:코일형 방열판10: printed circuit board 20: coil type heat sink
21:방열부 23:고정부21: Heat dissipation 23: Government
30:집적회로 31:리드 프레임30: integrated circuit 31: lead frame
이하, 본 고안에 따른 코일형 방열판에 대한 구성요소를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings, the components of the coiled heat sink according to the present invention will be described in detail.
도 2는 본 고안에 따른 코일형 방열판을 예시적으로 보여주는 사시도이다. 도면에서 알 수 있는 바와 같이, 본 고안은 크게 코일형 방열판(20)은 방열부(21)와 고정부(23)로 구분된다.Figure 2 is a perspective view showing an exemplary coil-shaped heat sink according to the present invention. As can be seen in the figure, the present invention is largely divided into a coil-shaped heat sink 20 is divided into a heat dissipation portion 21 and the fixing portion (23).
방열부(21)는 박판형 금속을 코일형상으로 감아 상대적으로 큰 표면적을 구성한다.The heat dissipation part 21 winds a thin plate metal in coil shape, and comprises a relatively large surface area.
고정부(23)는 방열판(20)을 인쇄회로기판(10)에 결합되는 부분으로서 자유단의 중앙을 중심으로 그 양측 표면이 절결되어 있다. 따라서, 방열판(20)의 자유단에는 밀착되어지는 집적회로(30)의 면적에 해당하는 만큼의 면적만으로 구성되어져 있다.The fixing part 23 is a portion in which the heat sink 20 is coupled to the printed circuit board 10, and both surfaces thereof are cut out around the center of the free end. Therefore, the free end of the heat sink 20 is composed of only the area corresponding to the area of the integrated circuit 30 in close contact.
이와 같이 구성된 본 고안에 따른 코일형 방열판에 대한 작용예와 작용효과를 역시 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.When described in detail with reference to the accompanying drawings, the working example and the working effect of the coil-type heat sink according to the present invention configured as described above are as follows.
도 3 및 도 5에 도시된 바와 같이, 방열판(20)은 집적회로(30)가 밀착되도록 스크류로 밴딩되어 리드 프레임(31)이 인쇄회로기판(10)상에 솔더링되어 고정되게 된다. 전술한 집적회로(30)가 부착된 인쇄회로기판(10)의 양측면에는 인쇄회로기판에 배열되어지는 특정소자를 배치할 수 있다.As shown in FIGS. 3 and 5, the heat sink 20 is bent with a screw so that the integrated circuit 30 is in close contact with the lead frame 31 so that the lead frame 31 is soldered and fixed onto the printed circuit board 10. Specific elements arranged on the printed circuit board may be disposed on both sides of the printed circuit board 10 to which the integrated circuit 30 is attached.
만일 방열판(20)의 자유단이 절결되지 않은 경우 인쇄회로기판(10)의 표면에 방열판(20)의 자유단이 상대적으로 많은 면적을 점유하게 됨으로 인쇄회로기판(10)의 표면에 배열되는 소자들의 설치공간이 작아지지만 절결부공간에 해당하는 만큼 소자를 더 배치할 수 있는 것이다.If the free end of the heat dissipation plate 20 is not cut off, the free end of the heat dissipation plate 20 occupies a relatively large area on the surface of the printed circuit board 10, and thus the device is arranged on the surface of the printed circuit board 10. Although the installation space of these devices becomes small, more elements can be placed as much as the cutout space.
이러한 효과는 방열판(20)이 커질수록 더욱 효과적이다.This effect is more effective as the heat sink 20 increases.
아울러, 코일형으로 권선된 방열부는 코일형으로 권선되어 표면적이 크기 때문에 방열효과도 향상되는 효과를 제공하게 되는 것이다.In addition, since the heat radiating portion wound in the coil shape is wound in the coil shape, the surface area is large, thereby providing an effect of improving the heat radiating effect.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960026333U KR200146570Y1 (en) | 1996-08-28 | 1996-08-28 | Coiled cooling plate for ics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960026333U KR200146570Y1 (en) | 1996-08-28 | 1996-08-28 | Coiled cooling plate for ics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980012753U KR19980012753U (en) | 1998-06-05 |
| KR200146570Y1 true KR200146570Y1 (en) | 1999-06-15 |
Family
ID=19465082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960026333U KR200146570Y1 (en) | 1996-08-28 | 1996-08-28 | Coiled cooling plate for ics |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200146570Y1 (en) |
-
1996
- 1996-08-28 KR KR2019960026333U patent/KR200146570Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR19980012753U (en) | 1998-06-05 |
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