JPH0964582A - Shield case structure - Google Patents
Shield case structureInfo
- Publication number
- JPH0964582A JPH0964582A JP21197995A JP21197995A JPH0964582A JP H0964582 A JPH0964582 A JP H0964582A JP 21197995 A JP21197995 A JP 21197995A JP 21197995 A JP21197995 A JP 21197995A JP H0964582 A JPH0964582 A JP H0964582A
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- heat
- circuit board
- generating component
- case structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はテレビジョン受像機のチ
ューナや高速デジタル信号処理回路ユニットの組立等に
使用するシールドケース構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield case structure used for assembling a tuner of a television receiver or a high speed digital signal processing circuit unit.
【0002】[0002]
【従来の技術】従来の代表的な電磁波シールド構造、例
えば、テレビジョン受像機の高速デジタル信号処理回路
等を構成する回路ブロックは高周波成分を扱う為、近接
する回路ブロック間の相互干渉(クロストーク)の防止
策の代表例としてはシールドケースで回路基板を覆う形
態があげられる。2. Description of the Related Art Since a conventional typical electromagnetic wave shield structure, for example, a circuit block constituting a high-speed digital signal processing circuit of a television receiver handles high frequency components, mutual interference (crosstalk) between adjacent circuit blocks. As a typical example of the preventive measure (1), there is a form in which the circuit board is covered with a shield case.
【0003】[0003]
【発明が解決しようとする課題】その場合、回路基板上
の実装部品に比較的高い消費電力の発熱体があるとシー
ルドケース内に熱がこもり、高温となって実装部品の耐
熱性許容限界値を越える場合が少なくな伊。そのような
場合、使用時の性能や信頼性に支障が生じる危険性を伴
う。又、許容限界値を越す場合には放熱用ヒートシンク
等の部品費用や取付費用等コスト高となる欠点があっ
た。又、ヒートシンク取付の為ユニットのシールドケー
ス容積が大きくなると共に、シールドケース内の雰囲気
温度は殆んど低下しない欠点があった。In this case, if a mounted component on the circuit board has a heating element of relatively high power consumption, heat is trapped in the shield case and the temperature rises to a high limit of the heat resistance of the mounted component. I rarely cross over. In such a case, there is a risk that performance and reliability during use may be impaired. Further, when the allowable limit value is exceeded, there is a drawback that the cost of parts such as a heat sink for heat radiation and the cost of mounting become high. Further, since the heat sink is attached, the volume of the shield case of the unit becomes large, and the atmospheric temperature in the shield case is hardly lowered.
【0004】本発明は上記従来の難点を解消するもの
で、発熱部品からの熱量を発熱部品表面に均一に、且つ
最大の面積で接触させた突起状の平面部にいち早く直接
熱伝導させてシールドケースに熱伝導させて、更にはシ
ールドケース表面からシールドケース外に熱放散する事
でシールドケース内温度を比較的低く抑える効果を上げ
ようとするものである。The present invention solves the above-mentioned problems of the prior art, and the amount of heat from a heat-generating component is directly and quickly conducted to the surface of the heat-generating component and directly to a projecting flat portion that is in contact with the maximum area. By conducting heat to the case and further dissipating the heat from the surface of the shield case to the outside of the shield case, the effect of suppressing the temperature inside the shield case to a relatively low level is enhanced.
【0005】[0005]
【課題を解決するための手段】発熱部品からの熱を効率
良くシールドケースに熱伝導させる為には発熱部品との
接触面積を最大にする必要がある。In order to efficiently conduct heat from the heat-generating component to the shield case, it is necessary to maximize the contact area with the heat-generating component.
【0006】この場合、発熱部品面との接触は接触面全
体に均一である事が熱伝導効率が高くなる。従って、平
面接触部の周辺部には自在に変形する形態とする必要が
ある。In this case, since the contact with the surface of the heat-generating component is uniform over the entire contact surface, the heat conduction efficiency becomes high. Therefore, it is necessary that the peripheral portion of the plane contact portion be freely deformed.
【0007】本発明の構成では、回路基板上の発熱部品
表面から発する熱量を直接伝導により効率良くシールド
ケースに熱伝導させ、その事によってシールドケース内
の空気の温度上昇を最小限にする事を実現するものであ
る。In the configuration of the present invention, the amount of heat generated from the surface of the heat-generating component on the circuit board is efficiently conducted to the shield case by direct conduction, thereby minimizing the temperature rise of the air in the shield case. It will be realized.
【0008】また、発熱部品位置を限定する場合は発熱
部品と接触させる突起部を別個片とせず、シールドケー
スの一部を絞り加工等により膨らませた突起部形成とし
た構成特徴している。Further, when the position of the heat-generating component is limited, the protrusion which comes into contact with the heat-generating component is not formed as a separate piece, but a part of the shield case is expanded to form a protrusion.
【0009】[0009]
【作用】その結果、放熱の為のヒートシンク等が不要と
なって、部品費用や取付費用の合理化が図れる一方、ユ
ニットも薄型設計が可能となるものである。 又、回路
基板は商品により発熱部品位置が異なるが、発熱部品と
接触させる部分を別個片とする事で、発熱部品位置は限
定されなくなる。その結果、発熱部品位置が異なる商品
に対してもシールドケースは共通的に使用出来る長所も
合わせ持つ手段である。As a result, a heat sink or the like for radiating heat is not required, so that the cost of parts and the installation cost can be rationalized, and the unit can be designed thin. Further, the position of the heat-generating component of the circuit board differs depending on the product, but the position of the heat-generating component is not limited by forming a separate piece in contact with the heat-generating component. As a result, the shield case is a means to have the advantage that it can be commonly used even for products having different heat-generating component positions.
【0010】[0010]
【実施例】以下、本発明の実施例について、図面を参照
しながら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0011】(実施例1)本発明の一実施例におけるシ
ールドケース構造の断面図1、図2は図1の要部側面図
である。図中、符号1は発熱部品と接触する平面形成部
を有する有する金属製別個片。2は回路基板と平行なシ
ールドケース面。3は回路基板上に実装される発熱部
品。4は金属製別個片1に設けたシールドケースへの取
付用L字形突起形成部。5は発熱部品と接触する平面形
成部。6は回路基板。7はL字形突起形成部の嵌合用及
び放熱用に設けられたシールドケースの孔。(Embodiment 1) Sectional views 1 and 2 of a shield case structure according to an embodiment of the present invention are side views of the essential portions of FIG. In the figure, reference numeral 1 is a metal separate piece having a flat surface forming portion that comes into contact with a heat generating component. 2 is the shield case surface parallel to the circuit board. 3 is a heat-generating component mounted on the circuit board. Reference numeral 4 is an L-shaped projection forming portion for attachment to the shield case provided on the metal separate piece 1. Reference numeral 5 is a plane forming portion that comes into contact with the heat generating component. 6 is a circuit board. 7 is a hole of a shield case provided for fitting the L-shaped projection forming portion and for heat dissipation.
【0012】(実施例2)本発明の一実施例におけるシ
ールドケース構造を図3、図4に示す。図3は本発明の
一実施例における発熱部品と接触させる突起形成片の平
面図、図4は本発明の一実施例における発熱部品と接触
させる突起形成片をシールドケースへ取り付けた状態の
要部断面図を示す。この場合は、発熱部品と接触させる
凸平面形成部を有する金属製別個片をシールドケースと
一体化させたもので有る。なお、回路基板と平行なシー
ルドケースの平部面を絞り加工等により成型してよいこ
とは言うまでもない。(Embodiment 2) A shield case structure according to an embodiment of the present invention is shown in FIGS. FIG. 3 is a plan view of a protrusion forming piece to be brought into contact with a heat generating component according to one embodiment of the present invention, and FIG. 4 is a main part in a state where the protrusion forming piece to be brought into contact with a heat generating component according to one embodiment of the present invention is attached to a shield case. A sectional view is shown. In this case, a separate metal piece having a convex flat surface forming portion that comes into contact with the heat generating component is integrated with the shield case. Needless to say, the flat surface of the shield case parallel to the circuit board may be formed by drawing.
【0013】[0013]
【発明の効果】本発明のシールドケース構造を回路実装
ユニツトとして用いる事により、発熱部品によりユニッ
ト内温度が許容限度より上昇するのを防止する。また、
発熱部品の数と熱量と実装位置に応じ、適宜、金属製別
個片の位置や数量を設定する事で、シールドケースを共
通的に使用出来るものである。その結果、商品毎にシー
ルドケースの加工型を製作する必要がなくなる等、大き
な合理化が達成出来るものである。By using the shield case structure of the present invention as a circuit mounting unit, it is possible to prevent the temperature inside the unit from rising above an allowable limit due to heat-generating components. Also,
The shield case can be commonly used by appropriately setting the position and the number of separate metal pieces according to the number of heat-generating components, the amount of heat, and the mounting position. As a result, a great rationalization can be achieved, such as eliminating the need to manufacture a processing case for the shield case for each product.
【図1】本発明の一実施例におけるシールドケース構造
の断面図FIG. 1 is a sectional view of a shield case structure according to an embodiment of the present invention.
【図2】本発明の一実施例における突起形成片の側面図FIG. 2 is a side view of a protrusion forming piece according to an embodiment of the present invention.
【図3】本発明の一実施例における突起形成片の平面図FIG. 3 is a plan view of a projection forming piece according to an embodiment of the present invention.
【図4】本発明の一実施例における突起形成片をシール
ドケースへ取り付けた状態の要部断面図FIG. 4 is a cross-sectional view of an essential part of a state where the protrusion forming piece according to the embodiment of the present invention is attached to the shield case.
1 放熱用金属接触片 2 シールドケース平面 3 発熱部品 4 L字形突起片 5 平面形成部 6 回路基板 7 孔 1 Heat-dissipating metal contact piece 2 Shield case flat surface 3 Heat-generating component 4 L-shaped projection piece 5 Flat surface forming part 6 Circuit board 7 hole
Claims (4)
る金属製シールドケースに於いて、シールドケース面の
一部に金属製の別個片を取付け、前記シールドケース面
と前記回路基板面とに平行な突起平面部を形成した事を
特徴とするシールドケース構造。1. A metal shield case which encloses a circuit board and shields against electromagnetic interference, wherein a separate metal piece is attached to a part of the shield case surface and is parallel to the shield case surface and the circuit board surface. Shield case structure characterized by forming a protruding flat surface.
部を設ける事で回路基板との平行を確保した事を特徴と
する請求項1記載のシールドケース構造。2. The shield case structure according to claim 1, wherein parallelism with the circuit board is ensured by providing a freely deformable portion in the peripheral portion of the protrusion flat surface portion of the separate piece.
ルドケースに設けた孔に嵌合し、取付けた事を特徴とす
る請求項1または請求項2記載のシールドケース構造。3. The shield case structure according to claim 1, wherein an L-shaped projection provided on a part of the separate piece is fitted and attached to a hole provided in the shield case.
り加工等により形成したことを特徴とする請求項1また
は請求項2記載のシールドケース構造。4. The shield case structure according to claim 1, wherein the projection plane portion is formed by drawing a part of the shield case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21197995A JPH0964582A (en) | 1995-08-21 | 1995-08-21 | Shield case structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21197995A JPH0964582A (en) | 1995-08-21 | 1995-08-21 | Shield case structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0964582A true JPH0964582A (en) | 1997-03-07 |
Family
ID=16614882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21197995A Pending JPH0964582A (en) | 1995-08-21 | 1995-08-21 | Shield case structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0964582A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002031673A (en) * | 2000-05-25 | 2002-01-31 | Bruker Sa | Multi-frequency rf signal generator |
WO2002035900A1 (en) * | 2000-10-25 | 2002-05-02 | Sony Computer Entertainment Inc. | Circuit board unit and electronic equipment |
EP1248507A1 (en) * | 2001-04-04 | 2002-10-09 | Siemens Aktiengesellschaft | High frequencies module for audio device with improved heat dissipation |
JP2002324989A (en) * | 2001-04-26 | 2002-11-08 | Murata Mach Ltd | Heat radiating structure for printed circuit board |
JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
EP1689220A2 (en) | 2005-02-08 | 2006-08-09 | Kabushi Kaisha Toshiba | Heat radiating apparatus in electronic device and heat radiating method |
JP2006237149A (en) * | 2005-02-23 | 2006-09-07 | Toshiba Corp | Heat radiator of electronic equipment |
JP2010056448A (en) * | 2008-08-29 | 2010-03-11 | Kenwood Corp | Ground connection structure |
JP2011245126A (en) * | 2010-05-28 | 2011-12-08 | Fujishoji Co Ltd | Game machine |
WO2012008398A1 (en) * | 2010-07-16 | 2012-01-19 | シャープ株式会社 | Electronic apparatus and display unit |
JP2013008741A (en) * | 2011-06-22 | 2013-01-10 | Mitsubishi Electric Corp | Semiconductor module attachment structure and controller of air conditioner |
JP5208331B1 (en) * | 2012-08-02 | 2013-06-12 | 三菱電機株式会社 | Heat sink |
WO2013105138A1 (en) * | 2012-01-13 | 2013-07-18 | パナソニック株式会社 | Heat dissipation structure |
-
1995
- 1995-08-21 JP JP21197995A patent/JPH0964582A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002031673A (en) * | 2000-05-25 | 2002-01-31 | Bruker Sa | Multi-frequency rf signal generator |
US7254035B2 (en) | 2000-10-25 | 2007-08-07 | Sony Computer Entertainment Inc. | Circuit substrate unit and electronic equipment |
WO2002035900A1 (en) * | 2000-10-25 | 2002-05-02 | Sony Computer Entertainment Inc. | Circuit board unit and electronic equipment |
EP1248507A1 (en) * | 2001-04-04 | 2002-10-09 | Siemens Aktiengesellschaft | High frequencies module for audio device with improved heat dissipation |
JP2002324989A (en) * | 2001-04-26 | 2002-11-08 | Murata Mach Ltd | Heat radiating structure for printed circuit board |
JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
US7312998B2 (en) | 2005-02-08 | 2007-12-25 | Kabushiki Kaisha Toshiba | Heat radiating apparatus in electronic device and heat radiating method |
JP2006222146A (en) * | 2005-02-08 | 2006-08-24 | Toshiba Corp | Heat dissipation device and heat dissipation method of electronic apparatus |
EP1689220A2 (en) | 2005-02-08 | 2006-08-09 | Kabushi Kaisha Toshiba | Heat radiating apparatus in electronic device and heat radiating method |
JP4498163B2 (en) * | 2005-02-08 | 2010-07-07 | 株式会社東芝 | Heat dissipation device for electronic equipment |
JP2006237149A (en) * | 2005-02-23 | 2006-09-07 | Toshiba Corp | Heat radiator of electronic equipment |
US7265984B2 (en) | 2005-02-23 | 2007-09-04 | Kabushiki Kaisha Toshiba | Heat dissipation device for electronic equipment |
JP2010056448A (en) * | 2008-08-29 | 2010-03-11 | Kenwood Corp | Ground connection structure |
JP2011245126A (en) * | 2010-05-28 | 2011-12-08 | Fujishoji Co Ltd | Game machine |
WO2012008398A1 (en) * | 2010-07-16 | 2012-01-19 | シャープ株式会社 | Electronic apparatus and display unit |
JP2013008741A (en) * | 2011-06-22 | 2013-01-10 | Mitsubishi Electric Corp | Semiconductor module attachment structure and controller of air conditioner |
WO2013105138A1 (en) * | 2012-01-13 | 2013-07-18 | パナソニック株式会社 | Heat dissipation structure |
JP5208331B1 (en) * | 2012-08-02 | 2013-06-12 | 三菱電機株式会社 | Heat sink |
WO2014020748A1 (en) * | 2012-08-02 | 2014-02-06 | 三菱電機株式会社 | Heat dissipation plate |
CN104509229A (en) * | 2012-08-02 | 2015-04-08 | 三菱电机株式会社 | Heat dissipation plate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110235278A1 (en) | Circuit module | |
JPH0964582A (en) | Shield case structure | |
US6101092A (en) | Heat-dissipating structure of an electronic part | |
JP2001332670A (en) | Mounting structure of semiconductor device | |
JP3113691U (en) | Digital broadcast receiver having a shield structure | |
JP2001168560A (en) | Electronic circuit unit | |
US20050018411A1 (en) | Shield casing with heat sink for electric circuits | |
JPH06252282A (en) | Shield structure of package | |
JP3156594B2 (en) | Module parts | |
JPH0786786A (en) | Shield structure of lsi case | |
JP2793568B2 (en) | Heat dissipation structure of electronic components | |
JPH03255697A (en) | Heat dissipating structure for integrated circuit | |
JPH08116195A (en) | Shielding device for circuit unit | |
JP2001230580A (en) | Electronic apparatus with module board | |
JPH09213852A (en) | Heat dissipating structure of heating electronic component | |
JP3892189B2 (en) | Electromagnetic wave shielding structure of electronic circuit board | |
JPH0927689A (en) | Electronic component | |
JPH098483A (en) | Heat dissipating device of electronic device | |
JPH03132059A (en) | Ic mounting | |
JPH03177095A (en) | Method of dissipating heat of electronic component | |
JP2003258465A (en) | Electronic circuit unit | |
JPH10189803A (en) | Mounting structure of insulating substrate for heat dissipating plate | |
JPH11307302A (en) | Non-thermal conducting resistor for servo amplifier and the servo amplifier equipped with the resistor | |
JP3728836B2 (en) | LSI package cooling device and fixing method thereof | |
JPH06181395A (en) | Heat dissipation printed-wiring board |