JPH11195889A - Heat radiating part for printed board - Google Patents

Heat radiating part for printed board

Info

Publication number
JPH11195889A
JPH11195889A JP9368112A JP36811297A JPH11195889A JP H11195889 A JPH11195889 A JP H11195889A JP 9368112 A JP9368112 A JP 9368112A JP 36811297 A JP36811297 A JP 36811297A JP H11195889 A JPH11195889 A JP H11195889A
Authority
JP
Japan
Prior art keywords
heat radiating
heat
part
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9368112A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Miyazawa
和義 宮澤
Original Assignee
Nec Home Electron Ltd
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Home Electron Ltd, 日本電気ホームエレクトロニクス株式会社 filed Critical Nec Home Electron Ltd
Priority to JP9368112A priority Critical patent/JPH11195889A/en
Publication of JPH11195889A publication Critical patent/JPH11195889A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Abstract

PROBLEM TO BE SOLVED: To obtain a heat readapting part, which has sufficient heat radiating effect and does not occupy the surface area of a printed board broadly. SOLUTION: A heat radiating part 11 comprises an attaching part 13 which is inserted into a lead inserting hole 2a of a printed board 2 and soldered together with a lead 3a of an electronic part such as a power transistor, and a heat radiating part 14 which is protruded from the board surface as an integral body with this attaching part 13. The heat generated in the electronic part is transmitted to the heat radiating part 11 through the lead 3a and mainly discharged from the heat radiating part 14. Different from the heat radiating means by a heat sink, the surface area of the printed board 2 is not broad. Furthermore, since the heat radiating part 14 rises up from the surface of the board, the heat radiating efficiency is high, and the sufficient heat radiating effect is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating component for a printed board for radiating heat of an electronic component mounted on the printed board.

[0002]

2. Description of the Related Art Conventionally, a heat sink 1 as shown in FIG. 5 has been generally employed as a means for radiating electronic components mounted on a printed circuit board. That is, a heat sink (radiator plate) 1 made of aluminum or the like is provided close to an electronic component 3 such as a power transistor mounted on the printed circuit board 2.
Is fixed with screws 4, and the case 3 b portion of the electronic component 3 is tightly fixed to the heat sink 1. Reference numeral 2a denotes a lead insertion hole into which the lead 3a of the electronic component 3 is inserted.

[0003]

SUMMARY OF THE INVENTION The above-described heat sink 1
Since the heat dissipating means for occupying the printed circuit board occupies a large surface area of the printed circuit board 2, it has become difficult to secure a space for a heat sink in recent years as the mounting density of the printed circuit board increases.

Therefore, a resist cut is made on the solder surface pattern near the lead insertion hole of the printed circuit board (resist of the solder surface pattern (solder resist) is removed only to a certain extent). A resist-cut / solder-pumping method is also used. In this case, the heat of the electronic component is transmitted to the solder pile via the lead, and is radiated from the solder pile. However, in this method, since the heat radiating portion is formed in a plane on the substrate surface, the heat radiating efficiency is not good, and the heat radiating effect is not sufficient.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a heat radiating component for a printed circuit board which can obtain a sufficient heat radiating effect without occupying a large surface area of the printed circuit board. I do.

[0006]

According to the present invention, there is provided a heat radiating component for a printed circuit board, which is mounted on the printed circuit board to radiate heat of electronic components mounted on the printed circuit board. A mounting portion that is inserted into the lead insertion hole of the printed circuit board and soldered to the printed circuit board together with the lead of the electronic component; and a heat radiating portion that rises from the substrate surface integrally with the mounting portion.

According to a second aspect of the present invention, the mounting portion has an eyelet structure. According to a third aspect of the present invention, the heat radiating portion has a cylindrical shape surrounding the lead on the side opposite to the electronic component and has a plurality of longitudinal slits spaced in the circumferential direction.

[0008]

FIG. 1 is a block diagram showing an embodiment of the present invention.
A description will be given with reference to the embodiment shown in FIGS. FIG. 1 is a diagram showing a state in which an electronic component 3 such as a power transistor is mounted on a printed circuit board 2 using a heat radiating component 11 according to an embodiment of the present invention. FIG. 2 is an enlarged view of a portion of the heat radiating component 11 in FIG. FIG. 3 is a perspective view showing only the heat radiating component 11 in FIG. 2 upside down, and FIG. 4 is a plan view of FIG. As shown in these figures, the heat dissipating component 11 is formed by pressing a metal plate, is inserted into a lead insertion hole 2a of the printed board 2, and is soldered to the printed board 2 together with the lead 3a of the electronic component 3. Mounting portion 13, and heat radiating portion 1 extending outside of substrate 2 integrally with mounting portion 13.
4 is provided. The mounting portion 13 of this embodiment has an eyelet structure, and includes a cylindrical portion 13a and a radial portion 13b serving as a collar of the eyelet. The heat radiating portion 14 has a large-diameter cylindrical shape surrounding the lead 3a on the side opposite to the electronic component 3, and has a plurality of vertical slits 14 spaced apart in the circumferential direction.
This is a structure in which a is formed. The vertical slits 14a are formed so that the solder can penetrate inside and solder the leads 3a at the time of soldering. The mounting portion 13 of the heat dissipating component 11 has a protrusion 13 at the front end in FIG.
c does not exist.

[0009] By using the heat radiating component 11, the electronic component 3
Is mounted on the printed circuit board 2, the heat radiating component 11 is attached to the printed circuit board 2 in advance. In this case, the tubular portion 13a of the mounting portion 13 of the heat radiating component 11 is inserted into the lead insertion hole 2a of the printed circuit board 2 and the distal end side is crushed to be mounted in the state shown in FIG. 2 (but without solder).
Then, together with various electronic components, the electronic component 3 is mounted by inserting its leads 3 a into the lead insertion holes 2 a of the printed circuit board 2 and then sending it to the soldering process, where the heat radiating component 11 is placed on the solder resist 15 on the pattern 17. Solder to Reference numeral 16 denotes solder. Thus, the electronic component 3
The mounting of the heat radiating component 11 is performed at the same time as the mounting.

The heat generated in the electronic component 3 mounted as described above is radiated to the outside from the case 3b.
The heat is transmitted to the heat radiating component 11 via the lead 3a, and is radiated from the surface of the heat radiating component 11 or a solder surface in contact with the heat radiating component 11. The heat generated in the pattern of the printed circuit board 2 is also radiated by the heat radiating component 11.

As described above, heat can be dissipated from the electronic components without requiring large heat dissipating components such as the conventional heat sink 1. The heat radiating component of the present invention is simple and inexpensive because the component itself has a simple structure and is inexpensive, and it is not necessary to change the existing printed circuit board 2 for mounting the component. Becomes possible. The work of attaching the heat radiating component 11 to the printed circuit board 2 can be performed simultaneously in the board processing step before the soldering step, so that the manufacturing process does not become complicated.

The conventional heat sink system can be used together with the heat radiating component 11 of the present invention. In this case, the heat sink can be made sufficiently small so as not to occupy a large surface area.

In the heat radiating component 11 of the embodiment, the mounting portion 13 has an eyelet structure, but is not necessarily limited to this. In short, what is necessary is just to be inserted into the lead insertion hole together with the lead of the electronic component and soldered.

The heat radiating component 11 of the embodiment includes a heat radiating portion 1.
4 is a cylindrical shape having a vertical slit 14a, but this is not limited to this shape. In short, any shape may be used as long as it is formed integrally with the mounting portion 13 and can efficiently dissipate heat. Further, it is appropriate that the heat radiating portion 14 is arranged on the side opposite to the electronic component, but if there is space, it can be arranged on the same side as the electronic component. In this case, the heat radiating portion can be formed on both the opposite side and the same side as the electronic component.

The heat radiating component of the present invention is not limited to the above-described power transistor, and can be applied to mounting of a power resistor and various other heat generating electronic components.

[0016]

Since the heat radiating component of the present invention is installed using the lead insertion hole, it does not require a large heat radiating component as in the conventional heat sink system, and the surface area occupied on the printed circuit board is extremely small. The effect is obtained. Therefore, it meets the recent demand for high-density mounting.

Further, the heat radiating portion is not provided in a plane on the substrate surface as in the case of the resist cut / soldering method, but is provided so as to rise from the substrate surface. It is easy to secure a sufficient heat radiation area, and therefore, it is possible to obtain a sufficient heat radiation effect.

Further, the heat radiating component of the present invention is simple and inexpensive because the component itself has a simple structure and is inexpensive, and it is not necessary to change an existing printed circuit board for mounting the component. Implementation is possible.

[Brief description of the drawings]

FIG. 1 is a view showing a state in which an electronic component is mounted on a printed board using a printed board heat radiating component of one embodiment of the present invention.

FIG. 2 is an enlarged view of a heat dissipating component in FIG.

FIG. 3 is a perspective view showing the heat radiating component in FIG. 2 upside down.

FIG. 4 is a plan view of FIG. 3;

FIG. 5 is a diagram showing a state in which electronic components are mounted on a printed circuit board using a conventional heat radiating component (heat sink).

[Explanation of symbols]

 2 Printed circuit board 2a Lead insertion hole 3 Electronic component 3a lead 11 Heat radiating component 13 Mounting portion 13a Cylindrical portion 13b Radial portion 13c Protrusion piece 14 Heat radiating portion 14a Vertical slit 15 Solder resist 16 Solder 17 Pattern

Claims (3)

[Claims]
1. A heat radiating component for a printed circuit board mounted on a printed circuit board to radiate heat of an electronic component mounted on the printed circuit board. Mounting part to be soldered,
A heat dissipating component for a printed circuit board, comprising: a heat dissipating part which rises from the surface of the board integrally with the mounting part.
2. The heat radiating component for a printed circuit board according to claim 1, wherein the mounting portion has an eyelet structure.
3. The printed circuit board according to claim 1, wherein the heat radiating portion has a cylindrical shape surrounding the lead on the side opposite to the electronic component, and has a plurality of longitudinal slits spaced in the circumferential direction. Heat dissipating parts.
JP9368112A 1997-12-27 1997-12-27 Heat radiating part for printed board Pending JPH11195889A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9368112A JPH11195889A (en) 1997-12-27 1997-12-27 Heat radiating part for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9368112A JPH11195889A (en) 1997-12-27 1997-12-27 Heat radiating part for printed board

Publications (1)

Publication Number Publication Date
JPH11195889A true JPH11195889A (en) 1999-07-21

Family

ID=18491003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9368112A Pending JPH11195889A (en) 1997-12-27 1997-12-27 Heat radiating part for printed board

Country Status (1)

Country Link
JP (1) JPH11195889A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034873A (en) * 2004-05-25 2008-02-14 Kitani Denki Kk Terminal box for solar cell module
JP2008060551A (en) * 2006-07-20 2008-03-13 Power Integrations Inc Thermal conduit
JP2008130757A (en) * 2006-11-20 2008-06-05 Daikin Ind Ltd Electrical circuit device
US7414228B2 (en) 2003-04-11 2008-08-19 Matsushita Electric Industrial Co., Ltd. High frequency heating apparatus
CN101888168A (en) * 2010-07-30 2010-11-17 中国北车股份有限公司大连电力牵引研发中心 Current-variable controller cabinet
US8330035B2 (en) 2004-05-25 2012-12-11 Kitani Electric Co., Ltd. Terminal box for solar cell modules
EP2648492A3 (en) * 2012-04-04 2014-01-08 Tellabs Oy A system provided with a solder joint
US9271386B2 (en) 2010-12-28 2016-02-23 Stumitomo Electric Industries, Ltd. Electrical apparatus and method for producing electrical apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7414228B2 (en) 2003-04-11 2008-08-19 Matsushita Electric Industrial Co., Ltd. High frequency heating apparatus
KR100989329B1 (en) * 2003-04-11 2010-10-25 파나소닉 주식회사 High frequency heating apparatus
JP2008034873A (en) * 2004-05-25 2008-02-14 Kitani Denki Kk Terminal box for solar cell module
US8330035B2 (en) 2004-05-25 2012-12-11 Kitani Electric Co., Ltd. Terminal box for solar cell modules
JP2008060551A (en) * 2006-07-20 2008-03-13 Power Integrations Inc Thermal conduit
JP2008130757A (en) * 2006-11-20 2008-06-05 Daikin Ind Ltd Electrical circuit device
CN101888168A (en) * 2010-07-30 2010-11-17 中国北车股份有限公司大连电力牵引研发中心 Current-variable controller cabinet
US9271386B2 (en) 2010-12-28 2016-02-23 Stumitomo Electric Industries, Ltd. Electrical apparatus and method for producing electrical apparatus
EP2648492A3 (en) * 2012-04-04 2014-01-08 Tellabs Oy A system provided with a solder joint

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