JP2798464B2 - Power amplification module structure - Google Patents
Power amplification module structureInfo
- Publication number
- JP2798464B2 JP2798464B2 JP2038885A JP3888590A JP2798464B2 JP 2798464 B2 JP2798464 B2 JP 2798464B2 JP 2038885 A JP2038885 A JP 2038885A JP 3888590 A JP3888590 A JP 3888590A JP 2798464 B2 JP2798464 B2 JP 2798464B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- power amplification
- amplification module
- module structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は高周波信号の電力増幅モジュール構造に関
し、特にプリント基板にスルーホール等を用いないで表
面実装をすることが可能な構造の電力増幅モジュールに
関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power amplification module structure for a high-frequency signal, and more particularly to a power amplification module having a structure that can be surface-mounted without using a through hole or the like on a printed circuit board. About.
従来、この種の電力増幅モージュール構造は、表面実
装をする場合、電力増幅モジュールのプリント基板に接
する面が接地電極と放熱板を兼ねており通常平板金属と
なっている。よってこれをプリント基板に表面実装した
状態では、平板金属のほぼ全面が基板と密着するものと
なっていた。すなわち、第２図（ａ），（ｂ）はそれぞ
れ電力増幅モジュール構造の平面図と側面図であり、９
は放熱板、10は電力増幅モジュール及びその保護ケー
ス、８はプリント基板、11〜14は端子であり、斜線部の
プリント基板８は放熱板９と密着していた。Conventionally, in the case of this type of power amplification module structure, when it is mounted on a surface, the surface of the power amplification module that is in contact with the printed circuit board also serves as a ground electrode and a heat sink, and is usually a flat metal plate. Therefore, when this is surface-mounted on a printed board, almost the entire surface of the flat metal is in close contact with the board. 2 (a) and 2 (b) are a plan view and a side view of the power amplification module structure, respectively.
Is a heat radiating plate, 10 is a power amplification module and its protective case, 8 is a printed circuit board, 11 to 14 are terminals.
上述した従来の電力増幅モジュール構造は、その放熱
板が平板の金属性であるために、表面実装をする際以下
の２点が問題となる。In the above-described conventional power amplification module structure, since the heat radiation plate is a flat metal material, there are the following two problems in surface mounting.
1.熱容量が大きいので基板にクランドを半田付けする際
に大きな熱量を必要とする。1. Since the heat capacity is large, a large amount of heat is required when soldering the land to the board.
2.動作時に生ずる熱の放散効率が悪化する。2. Dissipation efficiency of heat generated during operation deteriorates.
第一の問題点については、大きな熱を加えるための特
殊な製造装置が必要であり、製造の自動化に障害となる
ばかりでなく、半田付部分の高温がモジュール自身の回
路部10及びプリント基板８上の他の部品に伝わり部品及
び、部品の接続の信頼性を損う欠点がある。第２の問題
点についても、モジュールの増幅動作時の発熱を放散し
きれずにモジュール及び周囲のプリント基板の温度が以
上に上昇してしまう欠点がある。Regarding the first problem, a special manufacturing apparatus for applying a large amount of heat is required, which not only hinders the automation of the manufacturing, but also causes the high temperature of the soldered portion to cause the circuit portion 10 of the module itself and the printed circuit board 8. There is a disadvantage that the reliability of the component and the connection of the component is impaired by being transmitted to other components above. The second problem is also disadvantageous in that the heat generated during the amplification operation of the module cannot be completely dissipated and the temperature of the module and the surrounding printed circuit board rises further.
本発明の電力増幅モジュール構造は、プリント基板
と、このプリント基板上に表面実装する電力増幅モジュ
ールの前記プリント基板に対向する取付面に固定された
放熱板と、この放熱板を前記プリント基板表面に半田付
けする二つの端面部を形成する以外の部分は前記プリン
ト基板との間に空隙を有する構造である。The power amplification module structure of the present invention includes a printed circuit board, a heat sink fixed to a mounting surface of the power amplification module surface-mounted on the printed circuit board facing the printed circuit board, and disposing the heat dissipation plate on the surface of the printed circuit board. Except for forming the two end face portions to be soldered, a structure having a gap between the printed circuit board and the other portions is provided.
次に本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図（ａ），（ｂ）は本発明の一実施例の平面図、
側面図である。１は放熱板であり、２は放熱板１ととも
に表面実装される電力増幅モジュール及びその保護ケー
ス、４〜７は端子である。放熱板１をプリント板８に半
田付けする際には半田付け箇所３のみを加熱すればよ
く、放熱板全体を加熱する必要はない。又プリント板に
実装後、動作した場合に発生する熱の大部分は放熱板１
とプリント基板８の間の空隙部分より空気中に放熱され
モジュール自身の温度上昇は小さく１の放熱板を通じて
プリント板に伝わる熱量は少ない。1 (a) and 1 (b) are plan views of one embodiment of the present invention,
It is a side view. Reference numeral 1 denotes a radiator plate, 2 denotes a power amplification module surface-mounted together with the radiator plate 1 and its protective case, and 4 to 7 terminals. When soldering the heat sink 1 to the printed board 8, only the soldering points 3 need be heated, and it is not necessary to heat the entire heat sink. Most of the heat generated during operation after mounting on a printed board is
The heat is radiated into the air from the gap between the substrate and the printed board 8 and the temperature rise of the module itself is small, and the amount of heat transmitted to the printed board through one heat sink is small.
以上説明したように本発明は放熱板の基板に半田付け
する部分以外をプリント基板と離すことにより、以下の
２点の効果があり、従来の方法により大きく優れてい
る。As described above, the present invention has the following two effects by separating the portion of the heatsink other than the portion to be soldered to the substrate from the printed circuit board, and is greatly superior to the conventional method.
1.局所的な加熱により表面実装できるので、通常の局所
加熱用の半田付け装置が使用できるとともにモジュール
自身及び他の部分の高温による劣化を防ぐことができ
る。1. Since surface mounting can be performed by local heating, an ordinary soldering device for local heating can be used, and deterioration of the module itself and other parts due to high temperatures can be prevented.
2.モジュールの動作時における発熱の放散に優れており
モジュール自身及び他の部分の高温による劣化を防ぐこ
とができる。2. Excellent heat dissipation during module operation, preventing deterioration of the module itself and other parts due to high temperatures.
第１図（ａ），（ｂ）は本発明の一実施例を示す平面
図、側面図、第２図（ａ），（ｂ）は従来の電力増幅モ
ジュール構造の平面図、側面図である。 １……放熱板、２……電力増幅モジュール及び保護ケー
ス、３……半田付け箇所、４〜７……端子。1 (a) and 1 (b) are a plan view and a side view showing one embodiment of the present invention, and FIGS. 2 (a) and (b) are a plan view and a side view of a conventional power amplification module structure. . DESCRIPTION OF SYMBOLS 1 ... Heat sink, 2 ... Power amplification module and protective case, 3 ... Soldering place, 4-7 ... Terminal.
Claims (1)
面実装する電力増幅モジュールの前記プリント基板に対
向する取付面に固定された放熱板と、この放熱板を前記
プリント基板表面に半田付けする二つの端面部を形成す
る以外の部分は前記プリント基板との間に空隙を有する
構造であることを特徴とする電力増幅モジュール構造。A printed circuit board, a heat sink fixed to a mounting surface of the power amplifying module surface-mounted on the printed circuit board facing the printed circuit board, and a solder plate for soldering the heat sink to the surface of the printed circuit board. A power amplification module structure, characterized in that a portion other than the formation of the two end surfaces has a gap between the printed circuit board and the printed circuit board.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2038885A JP2798464B2 (en) | 1990-02-19 | 1990-02-19 | Power amplification module structure |
| EP91300037A EP0437312B1 (en) | 1990-01-08 | 1991-01-03 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| DE69104734T DE69104734T2 (en) | 1990-01-08 | 1991-01-03 | Electronic component mountable on the surface of a printed circuit board and assembly method. |
| AU68683/91A AU644395B2 (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| US07/637,557 US5148349A (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
| KR1019910000091A KR910015207A (en) | 1990-01-08 | 1991-01-07 | Structures of electronic components that can be mounted on the surface of a printed circuit board and mounting methods thereof |
| CA002033699A CA2033699C (en) | 1990-01-08 | 1991-01-07 | Electronic part with heat radiating member |
| HK85397A HK85397A (en) | 1990-01-08 | 1997-06-19 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2038885A JP2798464B2 (en) | 1990-02-19 | 1990-02-19 | Power amplification module structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03241795A JPH03241795A (en) | 1991-10-28 |
| JP2798464B2 true JP2798464B2 (en) | 1998-09-17 |
Family
ID=12537667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2038885A Expired - Lifetime JP2798464B2 (en) | 1990-01-08 | 1990-02-19 | Power amplification module structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2798464B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650373U (en) * | 1992-06-12 | 1994-07-08 | 八重洲無線株式会社 | Laser diode mounting structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58114047U (en) * | 1982-01-27 | 1983-08-04 | 富士通株式会社 | Semiconductor device mounting structure |
-
1990
- 1990-02-19 JP JP2038885A patent/JP2798464B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03241795A (en) | 1991-10-28 |
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